Wafer Bonding Using Spin-On Glass as Bonding Material

2012 ◽  
pp. 19-32
Author(s):  
Viorel Dragoi
Keyword(s):  
Wafer Bonding ◽  
Bonding Material

Photo-Polymer Wafer Bonding for Double Layer Transfer

2003 ◽  
Vol 768 ◽  
Author(s):  
Vorrada Loryuenyong ◽  
Tim Sands ◽  
Nathan W. Cheung
Keyword(s):  
Wafer Bonding ◽  
Low Temperatures ◽  
Uv Curing ◽  
Processing Parameters ◽  
Exposure Dose ◽  
Bonding Layer ◽  
Layer Transfer ◽  
Bonding Material ◽  
Temporary Bonding ◽  
Krf Excimer Laser

AbstractTemporary bonding is necessary for the two-stage transfer of thin films from one substrate to another while preserving the original orientation of the film. The process developed in this study uses an SU-8 photo-polymer both as a bonding material and as a delamination material for layer transfer. SU-8 was spun onto an optically transparent handle wafer (e.g., quartz or glass) and then bonded to the layer to be transferred. The processing parameters such as pre-baking temperature and UV exposure dose affect the bonding strength. UV curing of the SU-8 through the backside of the handle wafer could be performed to obtain the ultimate bond strength at low temperatures. A laser pulse from a KrF excimer laser (λ = 248 nm and λ = 38 ns) at a fluence of 50-150 mJ/cm2 was used to delaminate the SU-8 bonding layer to complete the layer transfer.

EFEKTIVITAS MODEL PEMBELAJARAN KOOPERATIF TIPE TEAMS GAMES TOURNAMENT (TGT) BERBANTUAN MEDIA KARTU SOAL PADA SUB MATERI IKATAN KOVALEN KELAS X MIA DI SMA ISLAM HARUNIYAH PONTIANAK

2018 ◽  
Vol 6 (2) ◽  
Author(s):  
Zulfadhli Abdillah
Keyword(s):  
Student Learning ◽  
Learning Outcomes ◽  
Covalent Bond ◽  
Student Learning Outcomes ◽  
Learning Model ◽  
Covalent Bonds ◽  
Team Games ◽  
Bonding Material ◽  
Before And After ◽  
Tenth Grade

 This  study  is  motivated  by  the  low  learning  outcomes  in  the  Sub-covalent  Bond class of tenth-grade students, SMA Islam Haruniyah Pontianak. This problem is due to the  lack  of  students'  understanding  of  the  concept  of  Covalent  Bonds.  Therefore,  a proper learning model is required to improve students’ understanding of Covalent Bond concepts  based  on  the  characteristics  of  both  learning  materials    and  students.  This study  aimed  to  investigate  the  differences  in  the  student  learning  outcomes  and  the effectiveness of the question card-based on TGT learning in the Sub-covalent Bonding material. Using the pre-experimental method of one-group pretest-posttest design, the tenth-grade  students  of  Math  and  Science  Class  of  SMS  Islam  Haruniyah  Pontianak participated in this study. The data collection tools used were learning outcomes tests, observation sheets, and interview sheets. The results of data analysis revealed that the average  pretest  score  was  36  and  the  posttest  was  62.94.  In  addition,  the  t-test statistical  analysis  indicated  a  significance  value  of  0.00  (0.00  <0.05)  which  meanth that there were differences in student learning outcomes between before and after the question  card-based  TGT  learning  model  implemented.  The  gain  value  was  0.42.  In other words, the  question card-based on TGT learning model is effective in improving the student  learning outcomes with good category. Keywords: Covalent Bond, Question Card, Team Games Tournament (TGT)

Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices

2014 ◽  
Author(s):  
François Kerisit ◽  
Bernadette Domenges ◽  
Michael Obein
Keyword(s):  
Comparative Study ◽  
Failure Analysis ◽  
Silver Wire ◽  
Bonding Material ◽  
Bond Wires

Abstract The introduction of silver as bonding material led to new failure analysis issues. This study compares the efficiency of wet and dry chemistries for decapsulation on Cu and Ag-based alloy wires. It is shown that dry chemistry allows better control and selectivity on the EMC/ Cu and Ag-based bond wires.

Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding

2020 ◽  
Author(s):  
L. Peng ◽  
S-W Kim ◽  
S. Iacovo ◽  
J. de Vos ◽  
B. Schoenaers ◽  
...  
Keyword(s):  
Wafer Bonding

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology

Chemical Mechanical Planarization Technology for Si Wafer Bonding

2019 ◽  
Vol 33 (10) ◽  
pp. 153-156
Author(s):  
JongHeun Lim ◽  
BoUn Yoon ◽  
KyungHyun Kim ◽  
YoungSun Ko ◽  
ChangJin Kang
Keyword(s):  
Wafer Bonding ◽  
Chemical Mechanical Planarization ◽  
Si Wafer

Silicon-to-silicon wafer bonding using evaporated glass

1998 ◽  
Vol 70 (1-2) ◽  
pp. 179-184 ◽  
Author(s):  
Steen Weichel ◽  
Roger de Reus ◽  
Michael Lindahl
Keyword(s):  
Silicon Wafer ◽  
Wafer Bonding
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