7th International Symposium on Plasma- and Process-Induced Damage
Latest Publications

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Published By American Vacuum Soc

0965157776

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Diagnostics of plasma process induced failure on analog device's mismatch characteristics

7th International Symposium on Plasma- and Process-Induced Damage ◽

10.1109/ppid.2002.1042610 ◽

2003 ◽

Author(s):

J.R. Shih ◽

A. Huang ◽

Y.H. Chinn ◽

C.C. Chin ◽

Yeng Peng ◽

...

Keyword(s):

Plasma Process

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Utility of CHARM/sup /spl reg//-2 in diagnosing sources of plasma charging damage in high density etchers and in assisting hardware development

7th International Symposium on Plasma- and Process-Induced Damage ◽

10.1109/ppid.2002.1042614 ◽

2003 ◽

Cited By ~ 2

Author(s):

S. Siu ◽

R. Patrick ◽

V. Vahedi

Keyword(s):

High Density ◽

Hardware Development

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Plasma induced damage from via etching in pMOSFETs

7th International Symposium on Plasma- and Process-Induced Damage ◽

10.1109/ppid.2002.1042622 ◽

2003 ◽

Cited By ~ 3

Author(s):

G. Cellere ◽

M.G. Valentini ◽

A. Baraldo ◽

A. Paccagnella

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Photoluminescence analyses of plasma-treated Si[100]-surfaces

7th International Symposium on Plasma- and Process-Induced Damage ◽

10.1109/ppid.2002.1042617 ◽

2003 ◽

Author(s):

M. Reiche

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Influence of photoresist pattern on charging damage during high current ion implantation

7th International Symposium on Plasma- and Process-Induced Damage ◽

10.1109/ppid.2002.1042620 ◽

2003 ◽

Cited By ~ 3

Author(s):

T. Dirnecker ◽

A. Ruf ◽

L. Frey ◽

A. Beyer ◽

A.J. Bauer ◽

...

Keyword(s):

Ion Implantation ◽

High Current

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Investigation on dual gate oxide charging damage in 0.13μm copper damascene technology

7th International Symposium on Plasma- and Process-Induced Damage ◽

10.1109/ppid.2002.1042598 ◽

2003 ◽

Cited By ~ 1

Author(s):

W.Y. Teo ◽

Y.T. Hou ◽

M.F. Li ◽

P. Chen ◽

L.H. Ko ◽

...

Keyword(s):

Gate Oxide ◽

Dual Gate

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Impact of F species on plasma charge damage in a RF asher

7th International Symposium on Plasma- and Process-Induced Damage ◽

10.1109/ppid.2002.1042616 ◽

2003 ◽

Cited By ~ 2

Author(s):

S.Q. Gu ◽

R. Fujimoto ◽

P. McGrath

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TDDB evaluation of plasma-enhanced Si/sub 3/N/sub 4/ nitride capacitors in CMOS integration schemes

7th International Symposium on Plasma- and Process-Induced Damage ◽

10.1109/ppid.2002.1042607 ◽

2003 ◽

Cited By ~ 1

Author(s):

D.A. Gajewski ◽

J. Walls ◽

M. Martin ◽

T. Remmel

Keyword(s):

Integration Schemes

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Present status and future trend of low-k dielectrics/interconnect technology for ULSI

7th International Symposium on Plasma- and Process-Induced Damage ◽

10.1109/ppid.2002.1042632 ◽

2003 ◽

Cited By ~ 1

Author(s):

T. Kikkawa

Keyword(s):

Present Status ◽

Future Trend ◽

Interconnect Technology ◽

Low K

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Development of a physical model of UV induced bulk photoconduction in silicon dioxide and application to charging damage

7th International Symposium on Plasma- and Process-Induced Damage ◽

10.1109/ppid.2002.1042600 ◽

2003 ◽

Cited By ~ 3

Author(s):

M. Joshi ◽

J.P. McVittie ◽

K. Saraswat

Keyword(s):

Silicon Dioxide ◽

Physical Model

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7th International Symposium on Plasma- and Process-Induced DamageLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By American Vacuum Soc

Diagnostics of plasma process induced failure on analog device's mismatch characteristics

Utility of CHARM/sup /spl reg//-2 in diagnosing sources of plasma charging damage in high density etchers and in assisting hardware development

Plasma induced damage from via etching in pMOSFETs

Photoluminescence analyses of plasma-treated Si[100]-surfaces

Influence of photoresist pattern on charging damage during high current ion implantation

Investigation on dual gate oxide charging damage in 0.13μm copper damascene technology

Impact of F species on plasma charge damage in a RF asher

TDDB evaluation of plasma-enhanced Si/sub 3/N/sub 4/ nitride capacitors in CMOS integration schemes

Present status and future trend of low-k dielectrics/interconnect technology for ULSI

Development of a physical model of UV induced bulk photoconduction in silicon dioxide and application to charging damage

7th International Symposium on Plasma- and Process-Induced Damage
Latest Publications