Advanced Processes for 193-nm Immersion Lithography
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Published By SPIE

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Front Matter

Advanced Processes for 193-nm Immersion Lithography ◽

10.1117/3.820233.fm ◽

2009 ◽

Author(s):

Yayi Wei ◽

Robert L. Brainard

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Process Steps in the Track

Advanced Processes for 193-nm Immersion Lithography ◽

10.1117/3.820233.ch2 ◽

2009 ◽

pp. 19-51

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Back Matter

Advanced Processes for 193-nm Immersion Lithography ◽

10.1117/3.820233.bm ◽

2009 ◽

Author(s):

Yayi Wei ◽

Robert L. Brainard

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Topcoat and Resist Processes for Immersion Lithography

Advanced Processes for 193-nm Immersion Lithography ◽

10.1117/3.820233.ch5 ◽

2009 ◽

pp. 87-110

Keyword(s):

Immersion Lithography

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Contact Angle of Water on Resist Stacks

Advanced Processes for 193-nm Immersion Lithography ◽

10.1117/3.820233.ch4 ◽

2009 ◽

pp. 73-85

Keyword(s):

Contact Angle

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Immersion Defects and Defect-Reduction Strategies

Advanced Processes for 193-nm Immersion Lithography ◽

10.1117/3.820233.ch6 ◽

2009 ◽

pp. 111-157

Keyword(s):

Defect Reduction ◽

Reduction Strategies

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Line-Edge Roughness of Resist Patterns

Advanced Processes for 193-nm Immersion Lithography ◽

10.1117/3.820233.ch10 ◽

2009 ◽

pp. 257-284 ◽

Cited By ~ 1

Keyword(s):

Line Edge Roughness ◽

Edge Roughness

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Immersion Lithography and Its Challenges

Advanced Processes for 193-nm Immersion Lithography ◽

10.1117/3.820233.ch1 ◽

2009 ◽

pp. 1-17

Keyword(s):

Immersion Lithography

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Double Exposure and Double Patterning

Advanced Processes for 193-nm Immersion Lithography ◽

10.1117/3.820233.ch9 ◽

2009 ◽

pp. 215-255 ◽

Cited By ~ 3

Keyword(s):

Double Exposure ◽

Double Patterning

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Resist Leaching and Water Uptake

Advanced Processes for 193-nm Immersion Lithography ◽

10.1117/3.820233.ch3 ◽

2009 ◽

pp. 53-72

Keyword(s):

Water Uptake

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Advanced Processes for 193-nm Immersion LithographyLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By SPIE

Front Matter

Process Steps in the Track

Back Matter

Topcoat and Resist Processes for Immersion Lithography

Contact Angle of Water on Resist Stacks

Immersion Defects and Defect-Reduction Strategies

Line-Edge Roughness of Resist Patterns

Immersion Lithography and Its Challenges

Double Exposure and Double Patterning

Resist Leaching and Water Uptake

Advanced Processes for 193-nm Immersion Lithography
Latest Publications