25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014)
Latest Publications

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Published By IEEE

9781479939442

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Silicon-Germanium (SiGe) composition and thickness determination via simultaneous smallspot XPS and XRF measurements

25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) ◽

10.1109/asmc.2014.6846971 ◽

2014 ◽

Cited By ~ 3

Author(s):

Benoit L'herron ◽

Nicolas Loubet ◽

Qing Liu ◽

Wei Ti Lee ◽

Mark Klare ◽

...

Keyword(s):

Silicon Germanium ◽

Thickness Determination

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Line centering yield optimization

25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) ◽

10.1109/asmc.2014.6846952 ◽

2014 ◽

Author(s):

Jeanne Paulette Bickford ◽

Troy J. Perry ◽

Erik L. Hedberg ◽

Kevin K. Dezfulian

Keyword(s):

Yield Optimization

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Study of central supply methodology for silica-based CMP slurry

25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) ◽

10.1109/asmc.2014.6847025 ◽

2014 ◽

Author(s):

C. N. Chang ◽

S. S. Lien ◽

H. C. Hsiao ◽

K. T. Tsai ◽

J. P. Yu

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Implementation of an advanced Recipe Management System in a fully automated 300mm fab

25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) ◽

10.1109/asmc.2014.6847024 ◽

2014 ◽

Author(s):

Andrew Lu ◽

Jeff Hanan ◽

Kevin Drinkwine ◽

Gaurav Gupta ◽

Andreas Weber ◽

...

Keyword(s):

Management System

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High-K metal gate contact process optimization for yield improvement via innovative defect inspection technique

25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) ◽

10.1109/asmc.2014.6846964 ◽

2014 ◽

Cited By ~ 1

Author(s):

Polly Lan ◽

Jung Yan Yang ◽

Garry Chen ◽

White Pai ◽

Mahatma Lin ◽

...

Keyword(s):

Process Optimization ◽

Contact Process ◽

Defect Inspection ◽

Metal Gate ◽

Yield Improvement ◽

High K

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Fluorine interaction On SiCN and SiOC layers detected by fault detection

25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) ◽

10.1109/asmc.2014.6846989 ◽

2014 ◽

Author(s):

Jean-Rene Raguet ◽

Laurent Blaya ◽

Emmanuel Paire

Keyword(s):

Fault Detection

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Improvement of characteristic of redistribution layer (RDL)on mobile application

25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) ◽

10.1109/asmc.2014.6846992 ◽

2014 ◽

Author(s):

C. S. Liu ◽

Ann Hsu ◽

C. T. Ni ◽

Ponder Pang ◽

Justin Lo ◽

...

Keyword(s):

Mobile Application

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3D technology applications market trends & key challenges

25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) ◽

10.1109/asmc.2014.6846981 ◽

2014 ◽

Cited By ~ 8

Author(s):

Amandine Pizzagalli ◽

Thibault Buisson ◽

Rozalia Beica

Keyword(s):

3D Technology ◽

Technology Applications ◽

Market Trends

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Tristate Inverter Array: A new test structure that compliments traditional SRAM arrays as a yield learning vehicle

25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) ◽

10.1109/asmc.2014.6846946 ◽

2014 ◽

Cited By ~ 5

Author(s):

Ishtiaq Ahsan ◽

Carl Schiller ◽

Zhigang Song ◽

Robert Wong ◽

David Clark ◽

...

Keyword(s):

Test Structure ◽

Yield Learning

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Surface metal contamination on tool components - A case study for evaluating acid extraction ICP-MS measurement process

25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) ◽

10.1109/asmc.2014.6847005 ◽

2014 ◽

Author(s):

Shi Liu ◽

Bin Liu

Keyword(s):

Metal Contamination ◽

Measurement Process ◽

Acid Extraction ◽

Icp Ms ◽

Surface Metal

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25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Silicon-Germanium (SiGe) composition and thickness determination via simultaneous smallspot XPS and XRF measurements

Line centering yield optimization

Study of central supply methodology for silica-based CMP slurry

Implementation of an advanced Recipe Management System in a fully automated 300mm fab

High-K metal gate contact process optimization for yield improvement via innovative defect inspection technique

Fluorine interaction On SiCN and SiOC layers detected by fault detection

Improvement of characteristic of redistribution layer (RDL)on mobile application

3D technology applications market trends & key challenges

Tristate Inverter Array: A new test structure that compliments traditional SRAM arrays as a yield learning vehicle

Surface metal contamination on tool components - A case study for evaluating acid extraction ICP-MS measurement process

25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014)
Latest Publications