Ultra-thin Chip Technology and Applications
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Published By Springer New York

9781441972750, 9781441972767
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Thermal Effects in Thin Silicon Dies: Simulation and Modelling

2010 ◽  
pp. 287-308 ◽  
Author(s):  
Niccolò Rinaldi ◽  
Salvatore Russo ◽  
Vincenzo d’Alessandro
Keyword(s):  
Thermal Effects ◽  
Simulation And Modelling ◽  
Thin Silicon

Substrate Handling Techniques for Thin Wafer Processing

2010 ◽  
pp. 125-138 ◽  
Author(s):  
Christof Landesberger ◽  
Sabine Scherbaum ◽  
Karlheinz Bock
Keyword(s):  
Wafer Processing

Through-Silicon via Technology for RF and Millimetre-Wave Applications

2010 ◽  
pp. 445-453
Author(s):  
Alvin Joseph ◽  
Cheun-Wen Huang ◽  
Anthony Stamper ◽  
Wayne Woods ◽  
Dan Vanslette ◽  
...  
Keyword(s):  
Through Silicon Via ◽  
Millimetre Wave

Ultra-thin Wafer Fabrication Through Dicing-by-Thinning

2010 ◽  
pp. 33-43 ◽  
Author(s):  
Christof Landesberger ◽  
Sabine Scherbaum ◽  
Karlheinz Bock
Keyword(s):  
Wafer Fabrication
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