Development of WLCSP for Accelerometer Packaging with Vertical CuPd Wire as Through Mold Interconnection (TMI)

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00183 ◽

2018 ◽

Cited By ~ 1

Author(s):

Zhaohui Chen ◽

Boon Long Lau ◽

Zhipeng Ding ◽

Eva Leong Ching Wai ◽

Beibei Han ◽

...

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