Wedge Bonding Wire and Ribbon to Support RF and Optoelectronic Packaging

The proliferation of mobile devices, video on-demand mobile and home, and Internet of Things (IoT), continues to drive an exponential growth in data bandwidth. Meeting the data demand requires continuous improvements in bandwidth and capacity for RF base station modules and optoelectronic modules. RF and Optoelectronic modules have many similar wire bond packaging requirements, especially as optoelectronic data rates continue to increase from 10G through 400G. This paper will provide a survey of RF and Optoelectronic Packages and their common wire and ribbon bond requirements. The paper will also survey the packaging challenges and solutions available to process engineers. Challenges include bonding on a variety of materials, signal pins, RF loop spans and shapes for wire and ribbon, program strategies to maintain constant loop span, referencing challenges, and simplified machine user interactions. The paper will also discuss collaborations between manufacturer and equipment supplier with helpful tips leveraging each other's strengths to transition from concept to production.

Materials and Fabrication Issues of Micro V-Groove for Optoelectronics Packaging

Micro V-groove is an important optical component in the packaging of optoelectronic devices, which holds the position of the optical fibers. The micro V-groove can be fabricated by three main techniques on different materials: wet etching, ultra precision machining and molding press. The main parameters, which determine the micro V-groove quality, include core pitch, surface roughness and cured adhesive height. In this paper, three fabrication techniques are discussed to address the future needs of the next-generation optical fiber communication technology. The advantages and disadvantages of each fabrication technique are discussed with the quality issues. The findings can be served as guides for the materials and fabrication in micro V-groove in optoelectronic packaging.