Optoelectronic packaging on flexible substrates using flip chip-based optodic bonding

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159768 ◽

2015 ◽

Author(s):

Yixiao Wang ◽

Raimund Rother ◽

Ludger Overmeyer ◽

Claas Muller

Keyword(s):

Flip Chip ◽

Flexible Substrates ◽

Optoelectronic Packaging

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Effect of underfill design parameters on die cracking in flip chip on flexible substrates

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892336 ◽

2014 ◽

Cited By ~ 3

Author(s):

Mayur Sabale ◽

Kiran Vinerkar ◽

Shiwani Thakur ◽

Sandeep Tonapi

Keyword(s):

Flip Chip ◽

Design Parameters ◽

Flexible Substrates

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Electromigration in Pb-free flip chip solder joints on flexible substrates

Journal of Applied Physics ◽

10.1063/1.2163982 ◽

2006 ◽

Vol 99 (2) ◽

pp. 023520 ◽

Cited By ~ 29

Author(s):

J. W. Nah ◽

Fei Ren ◽

K. N. Tu ◽

Sridharan Venk ◽

Gabe Camara

Keyword(s):

Flip Chip ◽

Solder Joints ◽

Flexible Substrates

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Failure Mechanism of Anisotropic Conductive Adhesive Interconnections in Flip Chip ICs on Flexible Substrates

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2004.825797 ◽

2004 ◽

Vol 27 (1) ◽

pp. 161-166 ◽

Cited By ~ 18

Author(s):

J.H. deVries

Keyword(s):

Failure Mechanism ◽

Flip Chip ◽

Conductive Adhesive ◽

Flexible Substrates ◽

Anisotropic Conductive Adhesive

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Adhesive flip chip bonding on flexible substrates

Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97 ◽

10.1109/pep.1997.656478 ◽

2002 ◽

Cited By ~ 16

Author(s):

R. Aschenbrenner ◽

R. Miessner ◽

H. Reichl

Keyword(s):

Flip Chip ◽

Flexible Substrates ◽

Flip Chip Bonding

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Flip chip microassembly of a silicon triaxial force sensor on flexible substrates

Sensors and Actuators A Physical ◽

10.1016/j.sna.2007.02.042 ◽

2008 ◽

Vol 142 (1) ◽

pp. 421-428 ◽

Cited By ~ 13

Author(s):

Arne Sieber ◽

Pietro Valdastri ◽

Keith Houston ◽

Arianna Menciassi ◽

Paolo Dario

Keyword(s):

Flip Chip ◽

Force Sensor ◽

Flexible Substrates

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Polymer flip chip technology on flexible substrates-development and applications

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) ◽

10.1109/adhes.1998.742033 ◽

2002 ◽

Cited By ~ 4

Author(s):

T. Seidowski ◽

F. Kriebel ◽

N. Neumann

Keyword(s):

Flip Chip ◽

Flexible Substrates ◽

Chip Technology

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Flip chip joint-in-via architecture on flexible substrates with Au-Sn interdiffusion bonding

10.32657/10356/5272 ◽

2006 ◽

Author(s):

Teck Kheng Lee

Keyword(s):

Flip Chip ◽

Flexible Substrates

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Flip chip assembly for cryogenics and flexible substrates

2015 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC) ◽

10.1109/nssmic.2015.7581890 ◽

2015 ◽

Author(s):

A. Tomada ◽

J. Segal ◽

J. Hasi ◽

C. Kenney ◽

K. Nishimura

Keyword(s):

Flip Chip ◽

Flexible Substrates ◽

Flip Chip Assembly

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ADHESIVE FLIP CHIP BONDING ON FLEXIBLE SUBSTRATES

Journal of Electronics Manufacturing ◽

10.1142/s0960313197000257 ◽

1997 ◽

Vol 07 (04) ◽

pp. 245-252 ◽

Cited By ~ 14

Author(s):

R. ASCHENBRENNER ◽

R. MIEßNER ◽

H. REICHL

Keyword(s):

Flip Chip ◽

Flexible Substrates ◽

Flip Chip Bonding

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Reliability of flip chip on flexible substrates under drop impact

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892380 ◽

2014 ◽

Author(s):

Mohasin Mulla ◽

Kalpesh Bonde ◽

Mayur Sabale ◽

Shiwani Thakur ◽

Sandeep Tonapi

Keyword(s):

Flip Chip ◽

Drop Impact ◽

Flexible Substrates

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