Influence of Hemostatic Solution on Bond Strength and Physicochemical Properties of Resin Cement

The aim of this study was to evaluate the degree of conversion, color stability, chemical composition, and bond strength of a light-cured resin cement contaminated with three different hemostatic solutions. Specimens were prepared for the control (uncontaminated resin cement) and experimental groups (resin cement contaminated with one of the hemostatic solutions) according to the tests. For degree of conversion, DC (n = 5) and color analyses (n = 10), specimens (3 mm in diameter and 2 mm thick) were evaluated by Fourier transform infrared spectroscopy (FTIR) and CIELAB spectrophotometry (L*, a*, b*), respectively. For elemental chemical analysis (n = 1), specimens (2 mm thick and 6 mm in diameter) were evaluated by x-ray energy-dispersive spectroscopy (EDS). The bond strengths of the groups were assessed by the microshear test (n = 20) in a leucite-reinforced glass ceramic substrate, followed by failure mode analysis by scanning electron microscopy (SEM). The mean values, except for the elemental chemical evaluation and failure mode, were evaluated by ANOVA and Tukey’s HSD test. The color stability was influenced by storage time (p<0.001) and interaction between contamination and storage time (p<0.001). Hemostop and Viscostat Clear contamination did not affect the DC, however Viscostat increased the DC. Bond strength of the resin cement to ceramic was negatively affected by the contaminants (p<0.001). Contamination by hemostatic agents affected the bond strength, degree of conversion, and color stability of the light-cured resin cement tested.

Electromigration Reliability of Glass Ceramic Multilayer Substrate with Various Surface Finishes

The process speed of high-end servers and supercomputers are steadily increasing. As a result, the backbone of the high speed processing, such as high-end LSI (flip-chip type), and associated substrate circuits is also becoming more dense and miniaturized, while supporting higher current densities. However, recent studies indicate that the higher current density triggers an electromigration (EM) at the solder bumps connecting the under bump metallurgy (UBM) of the flip-chip pad (e.g. Ni) and substrate pads (e.g. Ni/Au). This electromigration leads to voids within the solder joints, which may result in an open circuit. As of result, the life-cycle of the packaged devices is shortened. Thus solution to the EM issue is critical. To respond to such concerns, we have studied the mechanism of the void development, by closely examining differences in diffusion rate among the connective metals - within the pads and the solders. We have mitigated the EM occurrence by reducing the differences in diffusion rate by utilizing high purity Cu for the substrate metallization pads, Cu exhibits a diffusion rate similar to Sn used in solder bumps. Also, solder wettability was improved by utilizing a solder on pad (SOP) construction. As of result we were able to successfully demonstrate an improved life-cycle of the flip-chip solder joints, while accommodating a higher current density. Furthermore, a glass ceramic substrate was used for our study. Since this particular glass ceramic substrate has a coefficient of thermal expansion of 11.8ppm/K, there is an improvement in 1st and 2nd level reliabilities associated with thermal stress from device heat generation. At the same time, it possesses a dielectric constant of 5.8, which is conductive with superior electrical performance (high speed and high frequency). Thus, this glass ceramic substrate is capable of supporting increases in current density, while sustaining high reliability.

Densification Mechanism of the Low Temperature Co-Fired Glass-Ceramic Substrate

In this paper, application of multilayered circuit substrates has been studied, the glass ceramic (50%Al2O3-50%glass) with low temperature co-fired and good performance as the raw material was used, by means of calculating the apparent activation energy of densification in the experiment and observing the SEM images of glass ceramic substrate section, the densification mechanism of glass ceramic substrate sintering is analyzed.

Influence of Internal Architectures on the Fracture Response of LTCC Components

Low Temperature Co-fired Ceramics (LTCCs) are layered ceramic based components, which – in recent years - are increasingly used as high precision electronic devices (e.g. mobile and automotive technologies) in highly loaded (temperatures, inertia forces, etc.) environments. They consist of a complex three-dimensional micro-network of metal structures embedded within a glass-ceramic substrate. Even though LTCCs have been used for more than 20 years, there is insufficient understanding of the mechanical loads during processing. In this regard, different types of failure of the end component during service have been reported, coming from different parts within the part. In this work, the influence of the internal architectures in the fracture response of LTCC components during bending has been investigated. Strength has been determined in 10 × 10 mm2 specimens using the ball-on-three-balls test (biaxial loading) and evaluated using Weibull statistics. Fractography of broken specimens has been performed to determine the mode of fracture of the components and the role of the internal architecture in the crack path. Results show strength dependence as a function of the testing position within the part. The influence of the internal architecture and residual stresses is also discussed.

Amelogenin Induces Biomimetic Mineralization at Specific pH

Amelogenin proteins are assumed to control the calcification of dental enamel with a nanoscale precision that facilitates the formation of fibrous apatite crystals organized in a remarkable microstucture. In this study, recombinant full-length human amelogenin induced protein-guided mineralization and the formation of an enamel-like composite material at specific physical-chemical conditions as observed by atomic force microscopy (AFM). Amelogenin bound specifically to fluoroapatite crystals (FAP) of a glass-ceramic substrate at Ca2+ and PO43- concentrations similar to in-vivo conditions and at pH 8. Layers up to 400 nm high, containing elongated crystals, formed on the (001)-planes of FAP within 24h in supersaturated solutions. In contrast, (hk0)-faces grew by only 10-30 nm, but showed nanospheres aligned parallel to the c-axis of FAP. At pHs different from 8, proteins bound non-specifically to substrate and layers on FAP reached only 5-15 nm thickness. Micro-Raman spectroscopy and AFM revealed the formation of a composite material that resembled a structure and composition comparable to human enamel. These observations suggest that certain conditions are required to activate amelogenin to control and promote crystal growth of apatite along the c-axis and to synthesize an enamel-like material.