Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

Ohmic curing was utilized as a method to improve the conductivity of three-dimensional (3D) interconnects printed from silver-loaded conductive inks and pastes. The goal was to increase conductivity of the conductive path without inducing damage to the substrate. The 3D via/interconnect structure was routed within 3D polymeric substrates and had external and internal sections. The 3D structures were created by the additive manufacturing (AM) process of stereolithography (SL) and were designed to replicate manufacturing situations which are common in the fabrication of 3D structural electronics that involve a combination of AM and direct write (DW) processing steps. The photocurable resins the 3D substrates were made of possessed glass transition temperatures of 75 °C and 42 °C meaning that a nonthermal method to increase the conductivity of the printed traces was needed as the conductive inks tested in this study required oven cure temperatures greater than 100 °C to perform properly. Ohmic curing was shown to decrease the measured resistance of the via/interconnect structure without harming the substrate. Substrate damage was observed on thermally cured samples and was characterized by discoloration and scaling of the substrate. Resistance measurements of the via/interconnect structures revealed samples cured by the ohmic curing process performed equal or better than samples subjected to thermal curing. The work presented here demonstrates a method to overcome the thermal cure temperature limitations of polymeric substrates imposed on the processing parameters of conductive inks during the fabrication of 3D structural electronics and presents an example of overcoming a manufacturing process problem associated with this emerging technology. An ink selection process involving characterization of the compatibility of inks with the substrate material and the use of different inks for the via and interconnect sections was also discussed.

Development of Direct Printing/Curing Process for 3D Structural Electronics

3D structural electronics is a new paradigm in fabricating electronics with high design complexity. Basically, manufacturing of 3D structural electronics consists of several processes: structure building, wire creation, and pick-and-place of electrical components. In this work, a 3D structure was built in a commercial AM machine, and conductive wires were created on the 3D structure with a predetermined design of an electronic circuit. Generally, 2D wire paths are projected to a 3D surface, and a tool path for the wire is generated in advance. And a direct printing device follows the tool path to draw the conductive wires on the surface, while a direct curing device simultaneously hardens the created wires using thermal/radiation energy. This direct printing/curing device was developed by combining a micro-dispensing device and a light focusing module installed in a motorized xyz stage. Several experiments were accomplished using photocrosslinkable materials filled with carbon nanotubes (CNTs). Finally, a 3D electronics prototype was fabricated to show the compelling evidence that the suggested manufacturing methods and materials would be promising in manufacturing 3D structural electronics.

Direct-Write Stretchable Sensors Using Single-Walled Carbon Nanotube/Polymer Matrix

There have been increasing demands and interests in stretchable sensors with the development of flexible or stretchable conductive materials. These sensors can be used for detecting large strain, 3D deformation, and a free-form shape. In this work, a stretchable conductive sensor has been developed using single-walled carbon nanotubes (SWCNTs) and monofunctional acrylate monomers (cyclic trimethylolpropane formal acrylate and acrylate ester). The suggested sensors have been fabricated using a screw-driven microdispensing direct-write (DW) technology. To demonstrate the capabilities of the DW system, effects of dispensing parameters such as the feed rate and material flow rate on created line widths were investigated. Finally, a stretchable conductive sensor was fabricated using proper dispensing parameters, and an experiment for stretchability and resistance change was accomplished. The result showed that the sensor had a large strain range up to 90% with a linear resistance change and gauge factor ∼2.7. Based on the results, it is expected that the suggested DW stretchable sensor can be used in many application areas such as wearable electronics, tactile sensors, 3D structural electronics, etc.