Properties of Co-Fired BaTiO3Based Capacitor with Low Temperature Fired Multilayer Ceramic Substrates

1989 ◽  
Vol 28 (S2) ◽  
pp. 50
Author(s):  
Kenichi Hoshi ◽  
Shouichi Tosaka ◽  
Nobutatu Yamaoka
Keyword(s):  
Low Temperature ◽  
Ceramic Substrates ◽  
Multilayer Ceramic

Mechanical strength enhancement of low temperature co-fired multilayer ceramic substrates by introducing residual stress

2019 ◽  
Vol 45 (8) ◽  
pp. 10982-10990 ◽  
Author(s):  
Suxiang Qian ◽  
Feng Liu ◽  
Mingsheng Ma ◽  
Guanyu Chen ◽  
Zhifu Liu ◽  
...  
Keyword(s):  
Residual Stress ◽  
Low Temperature ◽  
Mechanical Strength ◽  
Ceramic Substrates ◽  
Strength Enhancement ◽  
Multilayer Ceramic

Computer‐aided selective production of low-resistance NiP and NiCuP layers

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Piotr Kowalik ◽  
Edyta Wróbel
Keyword(s):  
Low Temperature ◽  
Computer Program ◽  
Design Methodology ◽  
Surface Resistance ◽  
Temperature Coefficient Of Resistance ◽  
Ceramic Substrates ◽  
Content Type ◽  
Computer Aided ◽  
Chemical Metallization

Purpose This paper aims to present the possibility of computer-aided technology of chemical metallization for the production of electrodes and resistors based on Ni-P and Ni-Cu-P layers. Design/methodology/approach Based on the calculated parameters of the process, test structures were made on an alumina substrate using the selective metallization method. Dependences of the surface resistance on the metallization time were made. These dependencies take into account the comparison of the calculations with the performed experiment. Findings The author created a convenient and easy-to-use tool for calculating basic Ni-P and Ni-Cu-P layer parameters, namely, surface resistance and temperature coefficient of resistance (TCR) of test resistor, based on chemical metallization parameters. The values are calculated for a given level of surface resistance of Ni-P and Ni-Cu-P layer and defined required range of changes of TCR of test resistor. The calculations are possible for surface resistance values in the range of 0.4 Ohm/square ÷ 2.5 Ohm/square. As a result of the experiment, surface resistances were obtained that practically coincide with the calculations made with the use of the program created by the authors. The quality of the structures made is very good. Originality/value To the best of the authors’ knowledge, the paper presents a new, unpublished method of manufacturing electrodes (resistors) on silicon, Al2O3 and low temperature co-fired ceramic substrates based on the authors developed computer program.

Multilayer Ferrite Inductor Substrate for Ceramic-Based High Current Point-of-Load (POL) Converter

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000039-000046
Author(s):  
Wenli Zhang ◽  
Yipeng Su ◽  
Fred C. Lee
Keyword(s):  
Low Temperature ◽  
Power Electronics ◽  
Coefficient Of Thermal Expansion ◽  
Ceramic Substrate ◽  
Thermal Interface Material ◽  
Sintering Behavior ◽  
High Current ◽  
Output Current ◽  
Zn Ferrite ◽  
Multilayer Ceramic

Abstract High power-density and high efficiency are the two driving forces for point-of-load (POL) converters used in portable electronics and other applications where system miniaturization is required. Discrete passive components, especially bulky inductors, have become the bottleneck for downsizing POL converters. Low-temperature sintered Ni-Cu-Zn ferrite tapes for multilayer chip inductors have been widely studied and used in high-frequency power electronics applications. In our previous study, a low-profile, planar inductor substrate with lateral flux pattern was fabricated using mixed commercial low-fire Ni-Cu-Zn ferrite tapes and compatible low temperature co-fired ceramic (LTCC) processing. However, thermal interface material was used between active circuit board and passive layer (ferrite substrate), which increases the total volume of the converter and becomes a potential threat for reliability due to the mismatch of coefficient of thermal expansion among different layers. Additionally, this hybrid integration method requires labor-intensive manual steps which are not compatible with cost-sensitive power electronics market. A fully ceramic-based POL module with integrated multilayer ferrite inductor has been proposed. The circuit and other components are designed to be directly built on top of the multilayer ferrite inductor substrate. This presented work focuses on the development of the multilayer ceramic substrate with embedded planar, lateral-flux inductor by co-firing of ferrite and dielectric tapes with conductor paste. Commercial dielectric LTCC and ferrite tapes were chosen for the fabrication of multilayer ferrite inductor substrate. Different silver pastes were co-fired with ceramic tapes to form the inductor winding. The sintering behavior and compatibility of dielectric, magnetic, and conductive components in one co-firing process was studied in order to realize a cohesive multilayer ceramic substrate. The embedded inductors present lower inductance than pure ferrite inductors sintered alone using the same profile when the output current is smaller than 10 A. The inductance of both types of inductors are very similar when output current is above 15 A. The inductor embedded in dielectric tapes exhibits higher core loss density than its counterpart. Future work will focus on the integration of high current POL module using this developed multilayer ferrite inductor substrate.

scholarly journals Ultra-Low-Temperature Cofired Ceramic Substrates with Low Residual Carbon for Next-Generation Microwave Applications

2019 ◽  
Vol 11 (26) ◽  
pp. 23798-23807 ◽  
Author(s):  
Nina Joseph ◽  
Jobin Varghese ◽  
Merja Teirikangas ◽  
Timo Vahera ◽  
Heli Jantunen
Keyword(s):  
Low Temperature ◽  
Residual Carbon ◽  
Next Generation ◽  
Ceramic Substrates ◽  
Microwave Applications

Wavelength-tunable laser module using low-temperature cofired ceramic substrates

2005 ◽  
Vol 28 (1) ◽  
pp. 121-127 ◽  
Author(s):  
V. Heikkinen ◽  
J. Aikio ◽  
T. Alajoki ◽  
K. Kautio ◽  
J. Ollila ◽  
...  
Keyword(s):  
Low Temperature ◽  
Tunable Laser ◽  
Ceramic Substrates ◽  
Wavelength Tunable ◽  
Laser Module

Low-Temperature Sintered Pb(Zr,Ti)O3–Pb(Mn,Sb)O3–Pb(Zn,Nb)O3for Multilayer Ceramic Actuators

2010 ◽  
Vol 49 (7) ◽  
pp. 071503 ◽  
Author(s):  
Dandan Wan ◽  
Qian Li ◽  
Joo-Young Choi ◽  
Ji-Won Choi ◽  
Ying Yang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Multilayer Ceramic
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