Computer‐aided selective production of low-resistance NiP and NiCuP layers

Purpose This paper aims to present the possibility of computer-aided technology of chemical metallization for the production of electrodes and resistors based on Ni-P and Ni-Cu-P layers. Design/methodology/approach Based on the calculated parameters of the process, test structures were made on an alumina substrate using the selective metallization method. Dependences of the surface resistance on the metallization time were made. These dependencies take into account the comparison of the calculations with the performed experiment. Findings The author created a convenient and easy-to-use tool for calculating basic Ni-P and Ni-Cu-P layer parameters, namely, surface resistance and temperature coefficient of resistance (TCR) of test resistor, based on chemical metallization parameters. The values are calculated for a given level of surface resistance of Ni-P and Ni-Cu-P layer and defined required range of changes of TCR of test resistor. The calculations are possible for surface resistance values in the range of 0.4 Ohm/square ÷ 2.5 Ohm/square. As a result of the experiment, surface resistances were obtained that practically coincide with the calculations made with the use of the program created by the authors. The quality of the structures made is very good. Originality/value To the best of the authors’ knowledge, the paper presents a new, unpublished method of manufacturing electrodes (resistors) on silicon, Al2O3 and low temperature co-fired ceramic substrates based on the authors developed computer program.

Utilization of Polypropylene in the Production of Metal-Filled Polymer Composites: Development and Characteristics

Metal-filled composites based on polypropylene waste have been successfully obtained with an injection molding method of metalized polymer raw materials. Using the model polymer, the peculiarities of the formation of the copper layer in solutions of chemical metallization on the polypropylene surface were investigated and the main factors influencing this process were established. The main influence on the rate of reduction of copper in solutions of chemical metallization has the concentration of copper sulfate, sodium hydroxide, and EDTA-Na2. It was shown that the efficiency of the copper plating process also strongly depends on polymer processing, which follows the activation. In case of the use of simple activation, it is not possible to obtain metalized raw materials with high efficiency. Additional processing of activated polymer raw materials is required to carry out the process with high efficiency. The amount of reduced copper on the polymer surface can be adjusted by changing the concentration of the components of the chemical metallization solution, as well as the degree of loading of the polymer raw material. Examination by electron scanning microscopy of the obtained metalized polypropylene showed that the copper coating on the polymer particles is formed with a high degree of surface coverage. The formed copper coating is free of copper oxides, which is confirmed by X-ray diffraction studies and analysis of the spectrum of characteristic X-rays. Metal-filled composites have been characterized by the effect of copper on mechanical and rheological (MFR) properties. The Differential Scanning Calorimetry (DSC) and Thermogravimetric (TG) methods show a certain effect of metal on the magnitude of thermal effects and the rate of weight loss.

Selective metallization of silicon and ceramic substrates

Purpose The purpose of this paper is to present the possibility of technology of chemical metallization for the production of electrodes and resistors based on Ni–P alloy on silicon (Si), alundum (Al2O3) and low temperature cofired ceramic (LTCC) substrates. The developed technology provides low cost in any form. Design/methodology/approach During the study monocrystalline Si plates and Al2O3 and LTCC substrates were used. On the surface of the substrates, the electrodes (resistors) by the electroless metallization were made. Subsequently, the electrical parameters of obtained structures were measured. Afterwards, trial soldering was made to demonstrate that the layer is fully soldered. Findings Optimal parameters of the metallization bath were specified. As a result of the research conducted, it has been stated that the most appropriate way leading to the production of soldered metal layers with good adhesion to the portion of selectively activated Si plate and Al2O3 and LTCC substrates comprises the following technology: masking, selective activation, nickel-plating of activated plate. Such obtained metal layers have a great variety of application; in particular they can be used for the preparation of electric contacts in Si solar cells, production of electrodes and resistors and production of electrodes in thermoelectric structures. Originality/value The paper presents a new, unpublished method of manufacturing electrodes (resistors) on Si plate and Al2O3 and LTCC substrates.