scholarly journals Chemical Mechanical Planarization-Related to Contaminants: Their Sources and Characteristics

2020 ◽  
Author(s):  
Jihoon Seo

Chemical mechanical planarization (CMP) process has been widely used to planarize a variety of materials including dielectrics, metal, and semiconductors in Si-based semiconductor devices. It is one of the most critical steps to achieve the nanolevel wafer and die scale planarity. However, various contaminants are observed on the wafer surfaces after the CMP process, and they become the most critical yield detractor over many generations of rapidly diminishing feature sizes because they have the most direct impacts on device performance and reliability. This book chapter provides (1) CMP consumables-induced contaminants such as residual particles, surface residues, organic residues, pad debris and metallic impurities, pad contamination, watermark, etc., (2) brush-induced cross-contamination during post CMP cleaning, (3) post-CMP cleaning for removing these contaminants. Fundamental understanding of the formation of various types of CMP contaminants and their characteristics will significantly benefit the development of next-generation CMP slurries and post-CMP cleaning solutions.

2020 ◽  
Vol 27 (28) ◽  
pp. 4584-4592 ◽  
Author(s):  
Avik Khan ◽  
Baobin Wang ◽  
Yonghao Ni

Regenerative medicine represents an emerging multidisciplinary field that brings together engineering methods and complexity of life sciences into a unified fundamental understanding of structure-property relationship in micro/nano environment to develop the next generation of scaffolds and hydrogels to restore or improve tissue functions. Chitosan has several unique physico-chemical properties that make it a highly desirable polysaccharide for various applications such as, biomedical, food, nutraceutical, agriculture, packaging, coating, etc. However, the utilization of chitosan in regenerative medicine is often limited due to its inadequate mechanical, barrier and thermal properties. Cellulosic nanomaterials (CNs), owing to their exceptional mechanical strength, ease of chemical modification, biocompatibility and favorable interaction with chitosan, represent an attractive candidate for the fabrication of chitosan/ CNs scaffolds and hydrogels. The unique mechanical and biological properties of the chitosan/CNs bio-nanocomposite make them a material of choice for the development of next generation bio-scaffolds and hydrogels for regenerative medicine applications. In this review, we have summarized the preparation method, mechanical properties, morphology, cytotoxicity/ biocompatibility of chitosan/CNs nanocomposites for regenerative medicine applications, which comprises tissue engineering and wound dressing applications.


MRS Bulletin ◽  
2002 ◽  
Vol 27 (10) ◽  
pp. 743-751 ◽  
Author(s):  
Rajiv K. Singh ◽  
Rajeev Bajaj

AbstractThe primary aim of this issue of MRS Bulletin is to present an overview of the materials issues in chemical–mechanical planarization (CMP), also known as chemical–mechanial polishing, a process that is used in the semiconductor industry to isolate and connect individual transistors on a chip. The CMP process has been the fastest-growing semiconductor operation in the last decade, and its future growth is being fueled by the introduction of copper-based interconnects in advanced microprocessors and other devices. Articles in this issue range from providing a fundamental understanding of the CMP process to the latest advancements in the field. Topics covered in these articles include an overview of CMP, fundamental principles of slurry design, understanding wafer–pad–slurry interactions, process integration issues, the formulation of abrasive-free slurries for copper polishing, understanding surface topography issues in shallow trench isolation, and emerging applications.


1993 ◽  
Vol 37 ◽  
pp. 585-593
Author(s):  
Leigh Ann Filcs-Sesler ◽  
Don Plumton ◽  
Yung-Chung Kao ◽  
Tae S. Kim

AbstractThis article explores applications of total reflection x-ray fluorescence (TRXRF) to GaAs processes. The applications include determination of surface contamination and InGaAs layer thicknesses. Surface contamination can deteriorate device performance and can occur in starting substrates and in subsequent processing. We demonstrate that TRXRF is a quick, nondestructive method for identifying sulfur contamination on incoming wafers and low levels of metallic impurities from device fabrication. Variable angle TRXRF has been used to determine heterostmeture film thickness, measuring films of InGaAs on GaAs as thin as 4 nm.


1993 ◽  
Vol 303 ◽  
Author(s):  
R.C. Hawthorne ◽  
R.P.S. Thakur ◽  
K. Morinville ◽  
R. Kauffman

ABSTRACTAs device performance requirements increase, device features become smaller and films become thinner. The resultant sensitivity to defect density is such that controlling the condition of wafer surfaces prior to primary process steps becomes more and more critical. Wafer cleaning technologies of the past may not be optimum in providing needed device characteristics and reliability of tomorrow's semiconductors. In this paper, we compare the currently used RCA wafer clean chemistries to newer HF last, vapor dry technologies which use direct displacement of liquids to minimize contaminants. Subsequent passivation of these hydrophobic wafer surfaces is accomplished by various methods of oxidation including chemical treatments and RTP processing. Data collected from I-V, SIMS and DEFECT DENSITY testing will be included in the presentation.


2008 ◽  
Vol 389-390 ◽  
pp. 498-503
Author(s):  
N. Qin ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Feng Wei Huo

The calculating model of surface non-uniformity of polishing pad and the kinematical model between polishing pad and conditioner are initially established. Then the effects of several conditioning parameters were investigated by using the two models. The results of simulation and calculation show that the width ratio of diamond band of conditoner and the rotation speed at the same speed ratio between pad and conditioner have little effect on the surface non-uniformity of polishing pad, while at high non-integer rotation speed ratio, the surface non-uniformity of polishing pad is better than that at low integer speed ratio. The research results are available to select appropriate conditioning parameters especially for the stringent requirement of within-wafer non-uniformity in next generation IC.


1994 ◽  
Vol 342 ◽  
Author(s):  
R. Singh ◽  
J. Mavoori ◽  
R. P. S. Thakur ◽  
S. Narayanan

ABSTRACTThere are fundamental differences between conventional furnace processing (CFP) and rapid isothermal processing (RIP). The radiation spectrum of a conventional furnace consists of photons in the infrared and longer wavelength regions, whereas the spectrum of the incoherent light sources used in RIP consist of some ultraviolet, visible, and infrared photons. As compared to CFP, the photophysical and photochemical effects associated with RIP provide the capability of lower temperature processing. Due to photoeffects in RIP, differences are observed in junction movement and defect evolution with different lamp configurations and different kinds of lamps having differing spectra. This implies that diffusion models, in addition to considering processing time and temperature, should also account for the lamp configurations and spectra of the heating sources. The fundamental understanding of photoeffects in RIP can be further exploited to reduce the overall thermal budget used in the manufacturing of semiconductor devices. In this paper we present our study of photoeffects in RIP, which can be of help in the design of the next generation of RIP equipment.


2017 ◽  
Author(s):  
Omar Labban

Recently, next-generation HVAC technologies have gained attention as potential alternatives to the conventional vapor-compression system (VCS) for dehumidification and cooling. Previous studies have primarily focused on analyzing a specific technology or its application to a particular climate. A comparison of these technologies is necessary to elucidate the reasons and conditions under which one technology might outperform the rest. In this study, we apply a uniform framework based on fundamental thermodynamic principles to assess and compare different HVAC technologies from an energy conversion standpoint. The thermodynamic least work of dehumidification and cooling is formally defined as a thermodynamic benchmark, while VCS performance is chosen as the industry benchmark against which other technologies, namely desiccant-based cooling system (DCS) and membrane-based cooling system (MCS), are compared. The effect of outdoor temperature and humidity on device performance is investigated, and key insights underlying the dehumidification and cooling process are elucidated. In spite of the great potential of DCS and MCS technologies, our results underscore the need for improved system-level design and integration if DCS or MCS are to compete with VCS. Our findings have significant implications for the design and operation of next-generation HVAC technologies and shed light on potential avenues to achieve higher efficiencies in dehumidification and cooling applications.


10.5219/1210 ◽  
2019 ◽  
Vol 13 (1) ◽  
pp. 941-949
Author(s):  
Oleksandr Tokarskyy ◽  
Mykhaylo Korda

 The objectives of this study were: a) to determine E. coli O157:H7 survival on tomatoes and cardboard squares post-drying, stored at 25 ºC in humidified environment for four days, in buffered peptone water (BPW), and 0.1% diluted peptone (DP); b) to determine pathogen transfer rates (0, 1.5, or 24-hours drying post-inoculation), from inoculated tomato surfaces to uninoculated cardboard squares and conversely; and c) to evaluate SystemSure Plus ATP luminometer for recognizing contamination on visibly soiled (BPW) or visible clean (DP) cardboard. In tomato inoculation studies, E. coli O157:H7 survived better on the fruit when the inoculum was prepared using DP as compared to BPW. The 1.5-hours post drying counts of 5.34 and 5.76 log10 CFU.mL-1 in the rinsate substantially declined to 1.45 and 1.17 log10 CFU.mL-1 on day four, for DP and BPW, respectively. In cardboard inoculation studies, E. coli O157:H7 persisted for four days, with 1.5-hours post-drying counts and day four counts of 4.53 (DP) and 2.55 log10 CFU.mL-1 (BPW), contrary to 3.81 (DP) and 1.92 log10 CFU.mL-1 (BPW). Under the first impression, the slower die-off of E. coli O157:H7 on cardboard questions the possibility of reusing cardboard boxes due to the potential for cross-contamination. In wet transfer (0 hour drying) trials, both tomato-to-cardboard and cardboard-to-tomato yielded 100% positive transfers irrespective of diluent type. Dry transfer (1.5-hours drying interval post inoculation) from tomato-to-cardboard were 100% positive, but no positives were noted when inoculated, dried cardboard was contacted to tomatoes, irrespective of diluent. Results of transfers with BPW as the diluent showed 100% positive transfer from 24-hours dry tomatoes-to-cardboard, as inoculation spots on the tomatoes remained moist due to hygroscopic nature of solutes in BPW. Conversely, only a 40% positive transfer rate was observed under the same conditions with DP as diluent. No positive transfers were recorded from 24-hours dry cardboard-to-tomatoes, irrespective of diluent type. Though E. coli O157:H7 survived better on the surface of cardboard compared to the surface of tomatoes on day four, the dry transfers were more efficient from tomatoes-to-cardboard than conversely, possibly due to smooth and hydrophobic properties of the tomato, and rough and porous surface of the cardboard. ATP luciferase UltrasnapTM swab test showed 9/9 “pass” results for sterile liquid DP and BPW, while 9/9 “fail” results were observed with liquid peptone and BPW contaminated at ca. 9.0 log10 CFU.mL-1 E. coli O157:H7. Cardboard squares treated and dried, with sterile DP, showed 8/9 “pass” ATP luciferase results, and 1/9 “warning”, while cardboard squares with contaminated DP showed 9/9 “fail” result. Cardboard squares treated and dried, with sterile BPW, showed 7/9 “pass” ATP luciferase results, and 2/9 “warning”, while cardboard squares with contaminated BPW showed 9/9 “fail” result. Luminometer can simplify detection of microbial load, as well as organic residues, helping to check cardboard boxes for cleanness.


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