A Unified Approach to Solder Joint Life Prediction

2000 ◽  
Author(s):  
Zhengfang Qian ◽  
Ling Shi ◽  
Sheng Liu
Keyword(s):  
Solder Joint ◽  
Life Prediction ◽  
Unified Approach

Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction

2002 ◽  
Author(s):  
Krishna Tunga ◽  
James Pyland ◽  
Raghuram V. Pucha ◽  
Suresh K. Sitaraman
Keyword(s):  
Experimental Data ◽  
Fatigue Life ◽  
Solder Joint ◽  
Predictive Models ◽  
Life Prediction ◽  
Constitutive Models ◽  
Ball Grid Array ◽  
Time Dependent ◽  
Dependent Behavior ◽  
Ball Grid Array Packages

Various constitutive and fatigue-life predictive models for lead-tin solders in SBGA (Super Ball Grid Array) packages are studied and compared with the results from experimental data. Two solder compositions, 62Sn/36Pb/2Ag and 63Sn/37Pb are studied in this work. The fatigue life of 62Sn/36Pb/2Ag solder is studied using different constitutive models that take into consideration both the time-independent and time-dependent behavior of the solder. The fatigue life of 62Sn/36Pb/2Ag solder is predicted using an energy-based predictive model and compared with the experimental data. The choice of various predictive models on the solder joint life is studied using 63Sn/37Pb solder. Various predictive models, available in the literature, for eutectic and near eutectic solder compositions are studied to predict the fatigue life. Guidelines are provided for selecting constitutive and predictive models with appropriate damage metrics.

Application of Artificial Neural Network for Fatigue Life Prediction

2005 ◽  
Vol 297-300 ◽  
pp. 96-101
Author(s):  
Ishak Abdul Azid ◽  
Lee Kor Oon ◽  
Ong Kang Eu ◽  
K.N. Seetharamu ◽  
Ghulam Abdul Quadir
Keyword(s):  
Neural Network ◽  
Finite Element ◽  
Fatigue Life ◽  
Solder Joint ◽  
Finite Element Simulation ◽  
Life Prediction ◽  
Fatigue Life Prediction ◽  
Element Simulation ◽  
Parametric Studies ◽  
Solder Joint Fatigue

An extensively published and correlated solder joint fatigue life prediction methodology is incorporated by which finite element simulation results are translated into estimated cycles to failure. This study discusses the analysis methodologies as implemented in the ANSYSTM finite element simulation software tool. Finite element models are used to study the effect of temperature cycles on the solder joints of a flip chip ball grid array package. Through finite element simulation, the plastic work or the strain-energy density of the solder joints are determined. Using an established methodology, the plastic work obtained through simulation is translated into solder joint fatigue life [1]. The corresponding results for the solder joint fatigue life are used for parametric studies. Artificial Neural Network (ANN) has been used to consolidate the parametric studies.

The Effect of Intermetallic Compound in Solder Joint Fatigue Life Prediction Using Finite Element Modeling

2003 ◽  
Author(s):  
Mohammad Masum Hossain ◽  
Dereje Agonafer ◽  
Puligandla Viswanadham ◽  
Tommi Reinikainen
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Finite Element Modeling ◽  
Life Prediction ◽  
Temperature Cycling ◽  
Fatigue Life Prediction ◽  
Element Modeling ◽  
Solder Joint Fatigue

The life-prediction modeling of an electronic package requires a sequence of critical assumptions concerning the finite element models. The solder structures accommodate the bulk of the plastic strain that is generated during accelerated temperature cycling due to the thermal expansion mismatch between the various materials that constitute the package. Finite element analysis is extensively used for simulating the effect of accelerated temperature cycling on electronic packages. There are a number of issues that need to be addressed to improve the current FEM models. One of the limitations inherent to the presently available models is the accuracy in property values of eutectic 63Sn/37Pb solder or other solder materials (i.e. 62Sn/36Pb/2Ag). Life prediction methodologies for high temperature solders (90Pb/10Sn, 95Pb/5Sn, etc.) or lead-free based inter-connects materials, are almost non-existent due to their low volume use or relative infancy. [1] Another major limitation for the models presently available is excluding the effect of intermetallic compound (Cu6Sn5, Cu3Sn) formation and growth between solder joint and Cu pad due to the reflow processes, rework and during the thermal aging. The mechanical reliability of these intermetallic compounds clearly influences the mechanical integrity of the interconnection. The brittle failures of solder balls have been identified with the growth of a number of intermetallic compounds both at the interfaces between metallic layers and in the bulk solder balls. In this paper, the effect of intermetallic compound in fatigue life prediction using finite element modeling is described. A Chip Scale Package 3D Quarter model is chosen to do the FE analysis. Accelerated temperature cycling is performed to obtain the plastic work due to thermal expansion mismatch between the various materials. Solder joint fatigue life prediction methodologies were incorporated so that finite element simulation results were translated into estimated cycles to failure. The results are compared with conventional models that do not include intermetallic effects. Conventionally available material properties are assumed for the eutectic 63Sn/37Pb solder and the intermetallic material properties. The importance of including intermetallic effect in finite element modeling will be discussed.

Fatigue Mechanics: An Assessment of a Unified Approach to Life Prediction

2009 ◽  
pp. 5-5-23 ◽  
Author(s):  
JC Newman ◽  
EP Phillips ◽  
MH Swain ◽  
RA Everett
Keyword(s):  
Life Prediction ◽  
Unified Approach
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