Solder Joint Fatigue Life Prediction of Electronic Packages Using Combined FEA and Peridynamics

2016 ◽  
Author(s):  
Forrest Baber ◽  
Ibrahim Guven
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Life Prediction ◽  
Fatigue Life Prediction ◽  
Electronic Packages ◽  
Solder Joint Fatigue

Application of Artificial Neural Network for Fatigue Life Prediction

2005 ◽  
Vol 297-300 ◽  
pp. 96-101
Author(s):  
Ishak Abdul Azid ◽  
Lee Kor Oon ◽  
Ong Kang Eu ◽  
K.N. Seetharamu ◽  
Ghulam Abdul Quadir
Keyword(s):  
Neural Network ◽  
Finite Element ◽  
Fatigue Life ◽  
Solder Joint ◽  
Finite Element Simulation ◽  
Life Prediction ◽  
Fatigue Life Prediction ◽  
Element Simulation ◽  
Parametric Studies ◽  
Solder Joint Fatigue

An extensively published and correlated solder joint fatigue life prediction methodology is incorporated by which finite element simulation results are translated into estimated cycles to failure. This study discusses the analysis methodologies as implemented in the ANSYSTM finite element simulation software tool. Finite element models are used to study the effect of temperature cycles on the solder joints of a flip chip ball grid array package. Through finite element simulation, the plastic work or the strain-energy density of the solder joints are determined. Using an established methodology, the plastic work obtained through simulation is translated into solder joint fatigue life [1]. The corresponding results for the solder joint fatigue life are used for parametric studies. Artificial Neural Network (ANN) has been used to consolidate the parametric studies.

The Effect of Intermetallic Compound in Solder Joint Fatigue Life Prediction Using Finite Element Modeling

2003 ◽  
Author(s):  
Mohammad Masum Hossain ◽  
Dereje Agonafer ◽  
Puligandla Viswanadham ◽  
Tommi Reinikainen
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Finite Element Modeling ◽  
Life Prediction ◽  
Temperature Cycling ◽  
Fatigue Life Prediction ◽  
Element Modeling ◽  
Solder Joint Fatigue

The life-prediction modeling of an electronic package requires a sequence of critical assumptions concerning the finite element models. The solder structures accommodate the bulk of the plastic strain that is generated during accelerated temperature cycling due to the thermal expansion mismatch between the various materials that constitute the package. Finite element analysis is extensively used for simulating the effect of accelerated temperature cycling on electronic packages. There are a number of issues that need to be addressed to improve the current FEM models. One of the limitations inherent to the presently available models is the accuracy in property values of eutectic 63Sn/37Pb solder or other solder materials (i.e. 62Sn/36Pb/2Ag). Life prediction methodologies for high temperature solders (90Pb/10Sn, 95Pb/5Sn, etc.) or lead-free based inter-connects materials, are almost non-existent due to their low volume use or relative infancy. [1] Another major limitation for the models presently available is excluding the effect of intermetallic compound (Cu6Sn5, Cu3Sn) formation and growth between solder joint and Cu pad due to the reflow processes, rework and during the thermal aging. The mechanical reliability of these intermetallic compounds clearly influences the mechanical integrity of the interconnection. The brittle failures of solder balls have been identified with the growth of a number of intermetallic compounds both at the interfaces between metallic layers and in the bulk solder balls. In this paper, the effect of intermetallic compound in fatigue life prediction using finite element modeling is described. A Chip Scale Package 3D Quarter model is chosen to do the FE analysis. Accelerated temperature cycling is performed to obtain the plastic work due to thermal expansion mismatch between the various materials. Solder joint fatigue life prediction methodologies were incorporated so that finite element simulation results were translated into estimated cycles to failure. The results are compared with conventional models that do not include intermetallic effects. Conventionally available material properties are assumed for the eutectic 63Sn/37Pb solder and the intermetallic material properties. The importance of including intermetallic effect in finite element modeling will be discussed.

J-Lead Solder Joint Thermal Fatigue Life Model

1999 ◽  
Vol 121 (3) ◽  
pp. 186-190 ◽  
Author(s):  
T. E. Wong ◽  
L. A. Kachatorian ◽  
H. M. Cohen
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Prediction Model ◽  
Thermal Cycling ◽  
Failure Probability ◽  
Life Prediction ◽  
Fatigue Life Prediction ◽  
Thermal Fatigue Life ◽  
Solder Joint Fatigue ◽  
Life Prediction Model

A thermal fatigue life prediction model of J-lead solder joint assembly has been developed. This model is evolved from an empirically derived formula based on modified Manson-Coffin fatigue life Prediction theory. To estimate solder joint fatigue life, nonlinear finite element analysis (FEA) was conducted using the ABAQUS™ computer code. The analysis results show that cracks are initiated and propagated from both the heel and the toe of the solder joint toward the center portion of the joint. This condition results in the solder joint fatigue life degradation and is included in the model development. The fatigue life prediction model is then calibrated to life cycling test results, which were provided by Jet Propulsion Laboratory (JPL/NASA). The developed life prediction model, combined with the nonelastic strains derived from FEA and Miner’s cumulative damage law, was used to predict the cumulative damage index of the solder joint under NASA’s thermal cycling environment (between −55°C and 100°C). The analysis results indicate that this solder joint has a 50 percent failure probability when the solder joint is exposed up to 5206 thermal cycles. To shorten the test time, a modified thermal cycling profile was proposed. This profile is the same as the NASA thermal cycling environment except using the high end of the dwell temperature at 125°C. The analysis results show that a 50 percent failure probability of the solder joint would occur after the solder joint is exposed to 3500 cycles of the NASA thermal environment and followed by 1063 cycles of the modified thermal profile. In conclusion, the developed life prediction model is recommended to serve as an effective tool to integrate the process of design selection, quality inspection, and qualification testing in a concurrent engineering process. It is also recommended to conduct a micro-section in the solder joint to verify the solder crack paths and further validate the life prediction model. When additional thermal cycles have been added into the test specimens, recalibrating this model by test is also recommended.

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