Damage pre-cursor based life prediction of the effect of mean temperature of thermal cycle on the SnAgCu solder joint reliability

2014 ◽  
Author(s):  
Pradeep Lall ◽  
Kazi Mirza ◽  
Jeff Suhling
Keyword(s):  
Solder Joint ◽  
Thermal Cycle ◽  
Life Prediction ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability ◽  
Mean Temperature

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Experimental Evaluation ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability

Physics-of-Failure Design-for-Reliability of a Bidirectional Multi-Output DC-DC Power Converter

2010 ◽  
Author(s):  
Vibhash Jha ◽  
F. Patrick McCluskey
Keyword(s):  
Solder Joint ◽  
Heat Sink ◽  
Thermal Cycle ◽  
Power Converter ◽  
Power Module ◽  
Solder Joint Reliability ◽  
Physics Of Failure ◽  
Design For Reliability ◽  
Joint Reliability ◽  
Dc Power

The design of a prototype power converter was evaluated and improved using the physics-of-failure based design-for-reliability approach. Thermal simulation of the power module board with the heat sink has been carried out and these results have been used further for estimating the overall thermal cycle reliability. The solder joint reliability has been investigated using two different kinds of solders — SnAgCu (SAC305) and SnPb eutectic solder.

Potential of Zn-Al Solder Alloy for High Temperature SiC Power Module

2017 ◽  
Vol 2017 (HiTEN) ◽  
pp. 000197-000200 ◽  
Author(s):  
Hidekazu Tanisawa ◽  
Fumiki Kato ◽  
Hiroki Takahashi ◽  
Kenichi Koui ◽  
Shinji Sato ◽  
...  
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Thermal Cycle ◽  
Small Area ◽  
Base Plate ◽  
Power Module ◽  
Large Area ◽  
Solder Joint Reliability ◽  
Eutectic Solder ◽  
Joint Reliability

Abstract We are developing SiC power module which can operate at high temperature. At present, SiC devices are attached by Au-Ge eutectic solder. In terms of cost, we are considering using Zn-Al solder instead of Au-Ge eutectic solder. For Zn-Al solder, joint reliability is reported for a small area bonding such as device connection. However, as far as we know, there is no report on the bonding reliability of large area such as base plate and substrate. Therefore, we report crack propagation by thermal cycle test on solder thickness.

scholarly journals Improving the Solder Joint Reliability Prediction Accuracy for Quad Flat No Lead Packages

2021 ◽  
pp. 81-89
Author(s):  
Jefferson Talledo
Keyword(s):  
Solder Joint ◽  
Prediction Model ◽  
Life Prediction ◽  
Correlation Equation ◽  
Experimental Result ◽  
Reliability Prediction ◽  
Element Analysis ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Finite Element Analysis Simulation

This paper discusses the modeling approach used in improving the solder joint reliability prediction for Quad Flat No Lead (QFN) packages. A new power equation fatigue prediction model was developed based on the accumulated creep strain energy density from FEA (finite element analysis) simulation and the corresponding actual experimental result in terms of solder characteristic life of different QFN packages. The new curve fitted fatigue life correlation equation was then used in the solder joint reliability modeling together with the use of a hyperbolic sine constitutive model for lead-free solder. The model prediction using the new curve fitted equation was compared with the result from using the equation previously published. Based on the results, the new curve-fitted life prediction equation was able to improve the accuracy of solder life prediction. This study shows that solder joint reliability prediction could be improved by developing a prediction model based on actual data and consistent FEA modeling considerations in terms of methodology, material model and properties.

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