scholarly journals Laser Ablation of Thin Films on LTCC

2014 ◽  
Vol 2014 (1) ◽  
pp. 000677-000686 ◽  
Author(s):  
M. A. Girardi ◽  
K. A. Peterson ◽  
P. T. Vianco ◽  
R. Grondin ◽  
D. Wieliczka
Keyword(s):  
Thin Film ◽  
Laser Ablation ◽  
Cross Sections ◽  
High Performance ◽  
Ground Plane ◽  
Multichip Modules ◽  
Thin Film Adhesion ◽  
Diode Pumped ◽  
Manufacturing Techniques ◽  
Direct Digital Manufacturing

Direct Digital Manufacturing techniques such as laser ablation are proposed for the fabrication of lower cost, miniaturized, and lightweight integrated assemblies with high performance requirements. This paper investigates the laser ablation of a Ti/Cu/Pt/Au thin film metal stack on fired low temperature cofired ceramic (LTCC) surfaces using a 355 nm Nd:YAG diode pumped laser ablation system. It further investigates laser ablation applications using unfired, or ‘green’, LTCC materials: (1) through one layer of a laminated stack of unfired LTCC tape to a buried thick film conductor ground plane, and (2) in unfired Au thick films. The UV laser power profile and part fixturing were optimized to address defects such as LTCC microcracking, thin film adhesion failures, and redeposition of Cu and Pt. An alternate design approach to minimize ablation time was tested for efficiency in manufacture. Multichip Modules (MCM) were tested for solderability, solder leach resistance, and wire bondability. Scanning electron microscopy (SEM) as well as cross sections and microanalytical techniques were used in this study.

Laser Ablation of Thin Films on Low Temperature Cofired Ceramic

2015 ◽  
Vol 12 (2) ◽  
pp. 72-79 ◽  
Author(s):  
M. A. Girardi ◽  
K. A. Peterson ◽  
P. T. Vianco ◽  
R. Grondin ◽  
D. Wieliczka
Keyword(s):  
Thin Film ◽  
Laser Ablation ◽  
Low Temperature ◽  
Cross Sections ◽  
High Performance ◽  
Ground Plane ◽  
Multichip Modules ◽  
Thin Film Adhesion ◽  
Manufacturing Techniques ◽  
Direct Digital Manufacturing

Direct digital manufacturing techniques such as laser ablation are proposed for the fabrication of lower cost, miniaturized, and lightweight integrated assemblies with high performance requirements. This paper investigates the laser ablation of a Ti/Cu/Pt/Au thin-film metal stack on fired low temperature cofired ceramic (LTCC) surfaces using a 355-nm Nd:YAG diode-pumped laser ablation system. It further investigates laser ablation applications using unfired, or “green,” LTCC materials in the following ways: (1) through one layer of a laminated stack of unfired LTCC tape to a buried thick-film-conductor ground plane, and (2) in unfired Au thick films. The UV-laser power profile and part fixturing were optimized to address defects such as LTCC microcracking, thin-film adhesion failures, and redeposition of Cu and Pt. An alternate design approach to minimize ablation time was tested for efficiency in manufacture. Multichip modules were tested for solderability, solder leach resistance, and wire bondability. Scanning electron microscopy, as well as cross sections and microanalytical techniques, were used in this study.

TEM Study of the Effect of the Sapphire Substrate Surface Orientation on the Microstructure of Tin Dioxide Films

2001 ◽  
Vol 7 (S2) ◽  
pp. 1220-1221
Author(s):  
J. E. Dominguez ◽  
L. Fu ◽  
X. Q. Pan
Keyword(s):  
Thin Film ◽  
Laser Ablation ◽  
High Performance ◽  
Tin Dioxide ◽  
Substrate Surface ◽  
Sensor Arrays ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
Oxide Thin Film ◽  
Thin Film Sensors

Tin dioxide (SnO2) has been extensively studied and used as gas sensors to detect toxic gases such as CO, NOxand flammable gases like H2.[l] Recently, considerable researches have focused on thin film sensors due to their high performance as well as their integration compatibility with semiconductor technology for making microsensors and sensor arrays. [2] The performance of thin film sensors is remarkably influenced by the way they were fabricated.[3] Among various deposition techniques, pulsed laser deposition (PLD) has shown great prominence in the deposition of a wide variety of oxide thin film materials such as high Tc superconductors, semiconductors and dielectrics. in this work we present our experimental results on tin dioxide films deposited using pulsed laser ablation on sapphire (α -Al2O3) substrates with different surface orientations.Tin oxide films with a thickness of 100 nm were deposited on the (1012) and (0001) sapphire by pulsed laser ablation of ceramic SnO2 targets.

An Overview of Multichip Module Technology for low Power Applications

1992 ◽  
Vol 264 ◽  
Author(s):  
Chung W. Ho ◽  
Sharon McAfee-Hunter
Keyword(s):  
Thin Film ◽  
Low Power ◽  
Manufacturing Process ◽  
High Performance ◽  
Low Cost ◽  
High Density ◽  
Point Of View ◽  
Multichip Module ◽  
Multichip Modules

AbstractThin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology that can be implemented on top of several substrate materials. Tradeoffs will be discussed related to using different substrate materials and the corresponding implications from the assembly point of view. The MCM-D manufacturing process is reviewed and the subsequent reliability results are discussed.

Observations on the growth of YBa2Cu3O7-δ thin films on MgO by pulsed-laser ablation

1991 ◽  
Vol 49 ◽  
pp. 1068-1069
Author(s):  
M. Grant Norton ◽  
C. Barry Carter
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Laser Ablation ◽  
Substrate Surface ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Laser Ablation Process ◽  
Deposition Parameters

Pulsed-laser ablation has been widely used to produce high-quality thin films of YBa2Cu3O7-δ on a range of substrate materials. The nonequilibrium nature of the process allows congruent deposition of oxides with complex stoichiometrics. In the high power density regime produced by the UV excimer lasers the ablated species includes a mixture of neutral atoms, molecules and ions. All these species play an important role in thin-film deposition. However, changes in the deposition parameters have been shown to affect the microstructure of thin YBa2Cu3O7-δ films. The formation of metastable configurations is possible because at the low substrate temperatures used, only shortrange rearrangement on the substrate surface can occur. The parameters associated directly with the laser ablation process, those determining the nature of the process, e g. thermal or nonthermal volatilization, have been classified as ‘primary parameters'. Other parameters may also affect the microstructure of the thin film. In this paper, the effects of these ‘secondary parameters' on the microstructure of YBa2Cu3O7-δ films will be discussed. Examples of 'secondary parameters' include the substrate temperature and the oxygen partial pressure during deposition.

High-resolution scanning electron microscopy of thin-film magnetic media of magnetic recording disk

1992 ◽  
Vol 50 (2) ◽  
pp. 1334-1335
Author(s):  
K. Ogura ◽  
H. Nishioka ◽  
N. Ikeo ◽  
T. Kanazawa ◽  
J. Teshima
Keyword(s):  
Thin Film ◽  
Fine Structure ◽  
High Resolution ◽  
Magnetic Recording ◽  
High Performance ◽  
Magnetic Hysteresis ◽  
Grain Structure ◽  
Magnetic Media ◽  
Cross Sectional ◽  
Resolution Observation

Structural appraisal of thin film magnetic media is very important because their magnetic characters such as magnetic hysteresis and recording behaviors are drastically altered by the grain structure of the film. However, in general, the surface of thin film magnetic media of magnetic recording disk which is process completed is protected by several-nm thick sputtered carbon. Therefore, high-resolution observation of a cross-sectional plane of a disk is strongly required to see the fine structure of the thin film magnetic media. Additionally, observation of the top protection film is also very important in this field.Recently, several different process-completed magnetic disks were examined with a UHR-SEM, the JEOL JSM 890, which consisted of a field emission gun and a high-performance immerse lens. The disks were cut into approximately 10-mm squares, the bottom of these pieces were carved into more than half of the total thickness of the disks, and they were bent. There were many cracks on the bent disks. When these disks were observed with the UHR-SEM, it was very difficult to observe the fine structure of thin film magnetic media which appeared on the cracks, because of a very heavy contamination on the observing area.

The Structure and Properties of MoSi2 Thin Film in Mos Process

1980 ◽  
Vol 38 ◽  
pp. 326-327
Author(s):  
C.K. Wu ◽  
P. Chang ◽  
N. Godinho
Keyword(s):  
Thin Film ◽  
Integrated Circuits ◽  
High Performance ◽  
Large Scale ◽  
Process Development ◽  
Structure And Properties ◽  
Metal Silicides ◽  
High Oxidation ◽  
Important Approach ◽  
High Oxidation Resistance

Recently, the use of refractory metal silicides as low resistivity, high temperature and high oxidation resistance gate materials in large scale integrated circuits (LSI) has become an important approach in advanced MOS process development (1). This research is a systematic study on the structure and properties of molybdenum silicide thin film and its applicability to high performance LSI fabrication.

Sign in / Sign up

Export Citation Format

Share Document