Laser Ablation of Thin Films on Low Temperature Cofired Ceramic

2015 ◽  
Vol 12 (2) ◽  
pp. 72-79 ◽  
Author(s):  
M. A. Girardi ◽  
K. A. Peterson ◽  
P. T. Vianco ◽  
R. Grondin ◽  
D. Wieliczka
Keyword(s):  
Thin Film ◽  
Laser Ablation ◽  
Low Temperature ◽  
Cross Sections ◽  
High Performance ◽  
Ground Plane ◽  
Multichip Modules ◽  
Thin Film Adhesion ◽  
Manufacturing Techniques ◽  
Direct Digital Manufacturing

Direct digital manufacturing techniques such as laser ablation are proposed for the fabrication of lower cost, miniaturized, and lightweight integrated assemblies with high performance requirements. This paper investigates the laser ablation of a Ti/Cu/Pt/Au thin-film metal stack on fired low temperature cofired ceramic (LTCC) surfaces using a 355-nm Nd:YAG diode-pumped laser ablation system. It further investigates laser ablation applications using unfired, or “green,” LTCC materials in the following ways: (1) through one layer of a laminated stack of unfired LTCC tape to a buried thick-film-conductor ground plane, and (2) in unfired Au thick films. The UV-laser power profile and part fixturing were optimized to address defects such as LTCC microcracking, thin-film adhesion failures, and redeposition of Cu and Pt. An alternate design approach to minimize ablation time was tested for efficiency in manufacture. Multichip modules were tested for solderability, solder leach resistance, and wire bondability. Scanning electron microscopy, as well as cross sections and microanalytical techniques, were used in this study.

scholarly journals Laser Ablation of Thin Films on LTCC

2014 ◽  
Vol 2014 (1) ◽  
pp. 000677-000686 ◽  
Author(s):  
M. A. Girardi ◽  
K. A. Peterson ◽  
P. T. Vianco ◽  
R. Grondin ◽  
D. Wieliczka
Keyword(s):  
Thin Film ◽  
Laser Ablation ◽  
Cross Sections ◽  
High Performance ◽  
Ground Plane ◽  
Multichip Modules ◽  
Thin Film Adhesion ◽  
Diode Pumped ◽  
Manufacturing Techniques ◽  
Direct Digital Manufacturing

Direct Digital Manufacturing techniques such as laser ablation are proposed for the fabrication of lower cost, miniaturized, and lightweight integrated assemblies with high performance requirements. This paper investigates the laser ablation of a Ti/Cu/Pt/Au thin film metal stack on fired low temperature cofired ceramic (LTCC) surfaces using a 355 nm Nd:YAG diode pumped laser ablation system. It further investigates laser ablation applications using unfired, or ‘green’, LTCC materials: (1) through one layer of a laminated stack of unfired LTCC tape to a buried thick film conductor ground plane, and (2) in unfired Au thick films. The UV laser power profile and part fixturing were optimized to address defects such as LTCC microcracking, thin film adhesion failures, and redeposition of Cu and Pt. An alternate design approach to minimize ablation time was tested for efficiency in manufacture. Multichip Modules (MCM) were tested for solderability, solder leach resistance, and wire bondability. Scanning electron microscopy (SEM) as well as cross sections and microanalytical techniques were used in this study.

scholarly journals Silver‐Promoted High‐Performance (Ag,Cu)(In,Ga)Se 2 Thin‐Film Solar Cells Grown at Very Low Temperature

Solar RRL ◽  
2021 ◽  
pp. 2100108
Author(s):  
Shih-Chi Yang ◽  
Jordi Sastre ◽  
Maximilian Krause ◽  
Xiaoxiao Sun ◽  
Ramis Hertwig ◽  
...  
Keyword(s):  
Thin Film ◽  
Solar Cells ◽  
Low Temperature ◽  
High Performance ◽  
Thin Film Solar Cells ◽  
Very Low Temperature

Thermodynamic Analysis of Physical Vapor Deposition (PVD) Inorganic Thin Films on Low Temperature Cofired Ceramic (LTCC)

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000175-000182
Author(s):  
Carol Putman ◽  
Rachel Cramm Horn ◽  
Ambrose Wolf ◽  
Daniel Krueger
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Low Temperature ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
High Reliability ◽  
Interface Energy ◽  
Molecular Stability ◽  
Thin Film Adhesion ◽  
Inorganic Thin Films

Abstract Low temperature cofired ceramic (LTCC) has been established as an excellent packaging technology for high reliability, high density microelectronics. The functionality and robustness of rework has been increased through the incorporation of a Physical Vapor Deposition (PVD) thin film Ti/Cu/Pt/Au metallization. PVD metallization is suitable for RF (Radio Frequency) applications as well as digital systems. Adhesion of the Ti “adhesion layer” to the LTCC as-fired surface is not well understood. While past work has established extrinsic parameters for delamination mechanisms of thin films on LTCC substrates, there is incomplete information regarding the intrinsic (i.e. thermodynamic) parameters in literature. This paper analyzes the thermodynamic favorability of adhesion between Ti, Cr, and their oxides coatings on LTCC (assumed as amorphous silica glass and Al2O3). Computational molecular calculations are used to determine interface energy as an indication of molecular stability over a range of temperatures. The end result will expand the understanding of thin film adhesion to LTCC surfaces and assist in increasing the long-term reliability of the interface bonding on RF microelectronic layers.

Thermodynamic Analysis of Physical Vapor Deposited Inorganic Thin Films on Low Temperature Cofired Ceramic

2016 ◽  
Vol 13 (3) ◽  
pp. 95-101 ◽  
Author(s):  
Carol Putman ◽  
Rachel Cramm Horn ◽  
J. Ambrose Wolf ◽  
Daniel Krueger
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Low Temperature ◽  
Physical Vapor Deposition ◽  
High Reliability ◽  
Interface Energy ◽  
Film Adhesion ◽  
Molecular Stability ◽  
Thin Film Adhesion ◽  
Inorganic Thin Films

Low temperature cofired ceramic (LTCC) has been established as an excellent packaging technology for high-reliability, high-density microelectronics. The functionality and robustness of rework have been increased through the incorporation of a physical vapor deposition (PVD) thin film Ti/Cu/Pt/Au metallization. PVD metallization is suitable for radio frequency (RF) applications as well as digital systems. Adhesion of the Ti “adhesion layer” to the LTCC as-fired surface is not well understood. Although previous work has established extrinsic parameters for delamination mechanisms of thin films on LTCC substrates, there is incomplete information regarding the intrinsic (i.e., thermodynamic) parameters in the literature. This article analyzes the thermodynamic favorability of adhesion between Ti, Cr, and their oxide coatings on LTCC (assumed as amorphous silica glass and Al2O3). Computational molecular calculations are used to determine interface energy as an indication of molecular stability between pair of materials at specific temperature. The end result will expand the understanding of thin film adhesion to LTCC surfaces and assist in increasing the long-term reliability of the interface bonding on RF microelectronic layers.

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