Cu/photosensitive-BCB thin-film multilayer technology for high-performance multichip modules

1995 ◽  
Vol 18 (1) ◽  
pp. 18-22 ◽  
Author(s):  
T. Shimoto ◽  
K. Matsui ◽  
K. Utsumi
Keyword(s):  
Thin Film ◽  
High Performance ◽  
Multichip Modules ◽  
Multilayer Technology

An Overview of Multichip Module Technology for low Power Applications

1992 ◽  
Vol 264 ◽  
Author(s):  
Chung W. Ho ◽  
Sharon McAfee-Hunter
Keyword(s):  
Thin Film ◽  
Low Power ◽  
Manufacturing Process ◽  
High Performance ◽  
Low Cost ◽  
High Density ◽  
Point Of View ◽  
Multichip Module ◽  
Multichip Modules

AbstractThin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology that can be implemented on top of several substrate materials. Tradeoffs will be discussed related to using different substrate materials and the corresponding implications from the assembly point of view. The MCM-D manufacturing process is reviewed and the subsequent reliability results are discussed.

scholarly journals Laser Ablation of Thin Films on LTCC

2014 ◽  
Vol 2014 (1) ◽  
pp. 000677-000686 ◽  
Author(s):  
M. A. Girardi ◽  
K. A. Peterson ◽  
P. T. Vianco ◽  
R. Grondin ◽  
D. Wieliczka
Keyword(s):  
Thin Film ◽  
Laser Ablation ◽  
Cross Sections ◽  
High Performance ◽  
Ground Plane ◽  
Multichip Modules ◽  
Thin Film Adhesion ◽  
Diode Pumped ◽  
Manufacturing Techniques ◽  
Direct Digital Manufacturing

Direct Digital Manufacturing techniques such as laser ablation are proposed for the fabrication of lower cost, miniaturized, and lightweight integrated assemblies with high performance requirements. This paper investigates the laser ablation of a Ti/Cu/Pt/Au thin film metal stack on fired low temperature cofired ceramic (LTCC) surfaces using a 355 nm Nd:YAG diode pumped laser ablation system. It further investigates laser ablation applications using unfired, or ‘green’, LTCC materials: (1) through one layer of a laminated stack of unfired LTCC tape to a buried thick film conductor ground plane, and (2) in unfired Au thick films. The UV laser power profile and part fixturing were optimized to address defects such as LTCC microcracking, thin film adhesion failures, and redeposition of Cu and Pt. An alternate design approach to minimize ablation time was tested for efficiency in manufacture. Multichip Modules (MCM) were tested for solderability, solder leach resistance, and wire bondability. Scanning electron microscopy (SEM) as well as cross sections and microanalytical techniques were used in this study.

Laser Ablation of Thin Films on Low Temperature Cofired Ceramic

2015 ◽  
Vol 12 (2) ◽  
pp. 72-79 ◽  
Author(s):  
M. A. Girardi ◽  
K. A. Peterson ◽  
P. T. Vianco ◽  
R. Grondin ◽  
D. Wieliczka
Keyword(s):  
Thin Film ◽  
Laser Ablation ◽  
Low Temperature ◽  
Cross Sections ◽  
High Performance ◽  
Ground Plane ◽  
Multichip Modules ◽  
Thin Film Adhesion ◽  
Manufacturing Techniques ◽  
Direct Digital Manufacturing

Direct digital manufacturing techniques such as laser ablation are proposed for the fabrication of lower cost, miniaturized, and lightweight integrated assemblies with high performance requirements. This paper investigates the laser ablation of a Ti/Cu/Pt/Au thin-film metal stack on fired low temperature cofired ceramic (LTCC) surfaces using a 355-nm Nd:YAG diode-pumped laser ablation system. It further investigates laser ablation applications using unfired, or “green,” LTCC materials in the following ways: (1) through one layer of a laminated stack of unfired LTCC tape to a buried thick-film-conductor ground plane, and (2) in unfired Au thick films. The UV-laser power profile and part fixturing were optimized to address defects such as LTCC microcracking, thin-film adhesion failures, and redeposition of Cu and Pt. An alternate design approach to minimize ablation time was tested for efficiency in manufacture. Multichip modules were tested for solderability, solder leach resistance, and wire bondability. Scanning electron microscopy, as well as cross sections and microanalytical techniques, were used in this study.

High-resolution scanning electron microscopy of thin-film magnetic media of magnetic recording disk

1992 ◽  
Vol 50 (2) ◽  
pp. 1334-1335
Author(s):  
K. Ogura ◽  
H. Nishioka ◽  
N. Ikeo ◽  
T. Kanazawa ◽  
J. Teshima
Keyword(s):  
Thin Film ◽  
Fine Structure ◽  
High Resolution ◽  
Magnetic Recording ◽  
High Performance ◽  
Magnetic Hysteresis ◽  
Grain Structure ◽  
Magnetic Media ◽  
Cross Sectional ◽  
Resolution Observation

Structural appraisal of thin film magnetic media is very important because their magnetic characters such as magnetic hysteresis and recording behaviors are drastically altered by the grain structure of the film. However, in general, the surface of thin film magnetic media of magnetic recording disk which is process completed is protected by several-nm thick sputtered carbon. Therefore, high-resolution observation of a cross-sectional plane of a disk is strongly required to see the fine structure of the thin film magnetic media. Additionally, observation of the top protection film is also very important in this field.Recently, several different process-completed magnetic disks were examined with a UHR-SEM, the JEOL JSM 890, which consisted of a field emission gun and a high-performance immerse lens. The disks were cut into approximately 10-mm squares, the bottom of these pieces were carved into more than half of the total thickness of the disks, and they were bent. There were many cracks on the bent disks. When these disks were observed with the UHR-SEM, it was very difficult to observe the fine structure of thin film magnetic media which appeared on the cracks, because of a very heavy contamination on the observing area.

The Structure and Properties of MoSi2 Thin Film in Mos Process

1980 ◽  
Vol 38 ◽  
pp. 326-327
Author(s):  
C.K. Wu ◽  
P. Chang ◽  
N. Godinho
Keyword(s):  
Thin Film ◽  
Integrated Circuits ◽  
High Performance ◽  
Large Scale ◽  
Process Development ◽  
Structure And Properties ◽  
Metal Silicides ◽  
High Oxidation ◽  
Important Approach ◽  
High Oxidation Resistance

Recently, the use of refractory metal silicides as low resistivity, high temperature and high oxidation resistance gate materials in large scale integrated circuits (LSI) has become an important approach in advanced MOS process development (1). This research is a systematic study on the structure and properties of molybdenum silicide thin film and its applicability to high performance LSI fabrication.

A Proposal of High Performance Organic Thin Film Transistors

2010 ◽  
Vol 130 (2) ◽  
pp. 161-166
Author(s):  
Yoshinori Ishikawa ◽  
Yasuo Wada ◽  
Toru Toyabe ◽  
Ken Tsutsui
Keyword(s):  
Thin Film ◽  
Thin Film Transistors ◽  
High Performance ◽  
Organic Thin Film Transistors ◽  
Organic Thin Film

Thin Film 2-d Photonic Crystals High-Performance Light-Emitting Diodes

1999 ◽  
Author(s):  
Eli Yablonovitch ◽  
Misha Boroditsky ◽  
Rutger Vrijen ◽  
Thomas F. Krauss ◽  
Roberto Coccioli
Keyword(s):  
Thin Film ◽  
Photonic Crystals ◽  
High Performance ◽  
Light Emitting Diodes ◽  
Light Emitting
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