2018 20th International Conference on Electronic Materials and Packaging (EMAP)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781538656426

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Die attach module by Cu sheet interconnect for high temperature applications

2018 20th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2018.8660911 ◽

2018 ◽

Author(s):

Chuantong Chen ◽

Dongjin Kim ◽

Zheng Zhang ◽

Katsuaki Suganuma

Keyword(s):

High Temperature ◽

Die Attach ◽

Temperature Applications

Download Full-text

ILD Interlaminar Strength Evaluation for WLCSP

2018 20th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2018.8660853 ◽

2018 ◽

Author(s):

Weiqiang LI ◽

Yueqi Wang ◽

Koh Sau Wee ◽

Fuwei Zhang

Keyword(s):

Strength Evaluation

Download Full-text

Synthesis of iron sulfide by using electrodeposition method and discussion of the influence of solvent

2018 20th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2018.8660938 ◽

2018 ◽

Author(s):

Haruka Tamura ◽

Naoki Okamoto ◽

Takeyasu Saito

Keyword(s):

Iron Sulfide ◽

Electrodeposition Method ◽

Influence Of Solvent

Download Full-text

High frequency simulation of through-silicon via(TSV) failure

2018 20th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2018.8660779 ◽

2018 ◽

Author(s):

Chih-Yu Yu ◽

Yu-Hao Long ◽

Chung-Long Pan ◽

Yu-Jung Huang ◽

Shih-Ting Cheng ◽

...

Keyword(s):

High Frequency ◽

Through Silicon Via

Download Full-text

Improved Thermal Conductive Property of Pine Needle Derived Carbon for Thermal Management Applications

2018 20th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2018.8660901 ◽

2018 ◽

Cited By ~ 1

Author(s):

Ying Wang ◽

Chao Ji ◽

Changzeng Yan ◽

Rong Sun ◽

Ching-ping Wong

Keyword(s):

Thermal Management ◽

Pine Needle ◽

Conductive Property

Download Full-text

Three-Point Bending Strength and Failure of Window Glass Substrate by Considering Edge Stress Distribution

2018 20th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2018.8660891 ◽

2018 ◽

Cited By ~ 1

Author(s):

H. J. Chen ◽

J. H. Yeh ◽

M. Y. Tsai

Keyword(s):

Stress Distribution ◽

Glass Substrate ◽

Bending Strength ◽

Window Glass ◽

Three Point Bending ◽

Edge Stress

Download Full-text

2018 20th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2018.8660845 ◽

2018 ◽

Download Full-text

Effects of Moisture and Temperature on Quad Flat No-lead (QFN) Package

2018 20th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2018.8660958 ◽

2018 ◽

Author(s):

Mei-Ling Wu ◽

Chung-Kuei Wang

Download Full-text

Stress Analysis of Rollable OLED Display Considering Boundary Conditions Based on Finite Element Method

2018 20th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2018.8660948 ◽

2018 ◽

Author(s):

Boo Soo Ma ◽

Taek-Soo Kim

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Boundary Conditions ◽

Stress Analysis ◽

Oled Display ◽

Element Method

Download Full-text

Simulation of High Bandwidth Package on Package (HBPoP) Warpage and its effect on Thermal Cycling

2018 20th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2018.8660930 ◽

2018 ◽

Cited By ~ 1

Author(s):

Jia-Shen Lan ◽

Mei-Ling Wu

Keyword(s):

Thermal Cycling ◽

High Bandwidth

Download Full-text

2018 20th International Conference on Electronic Materials and Packaging (EMAP)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Die attach module by Cu sheet interconnect for high temperature applications

ILD Interlaminar Strength Evaluation for WLCSP

Synthesis of iron sulfide by using electrodeposition method and discussion of the influence of solvent

High frequency simulation of through-silicon via(TSV) failure

Improved Thermal Conductive Property of Pine Needle Derived Carbon for Thermal Management Applications

Three-Point Bending Strength and Failure of Window Glass Substrate by Considering Edge Stress Distribution

Table of contents

Effects of Moisture and Temperature on Quad Flat No-lead (QFN) Package

Stress Analysis of Rollable OLED Display Considering Boundary Conditions Based on Finite Element Method

Simulation of High Bandwidth Package on Package (HBPoP) Warpage and its effect on Thermal Cycling

Export Citation Format

2018 20th International Conference on Electronic Materials and Packaging (EMAP)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Die attach module by Cu sheet interconnect for high temperature applications

ILD Interlaminar Strength Evaluation for WLCSP

Synthesis of iron sulfide by using electrodeposition method and discussion of the influence of solvent

High frequency simulation of through-silicon via(TSV) failure

Improved Thermal Conductive Property of Pine Needle Derived Carbon for Thermal Management Applications

Three-Point Bending Strength and Failure of Window Glass Substrate by Considering Edge Stress Distribution

Table of contents

Effects of Moisture and Temperature on Quad Flat No-lead (QFN) Package

Stress Analysis of Rollable OLED Display Considering Boundary Conditions Based on Finite Element Method

Simulation of High Bandwidth Package on Package (HBPoP) Warpage and its effect on Thermal Cycling

2018 20th International Conference on Electronic Materials and Packaging (EMAP)
Latest Publications