Through Silicon Via Technology: Cost effective Cu-TSV Interconnects by EMC3D and Technical Challenges with Cu-TSV

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 000425-000445
Author(s):  
Paul Siblerud ◽  
Rozalia Beica ◽  
Bioh Kim ◽  
Erik Young
Keyword(s):  
Low Cost ◽  
Cost Effective ◽  
High Yield ◽  
Integrated Process ◽  
Wafer Level ◽  
Through Silicon Via ◽  
Wafer Level Packaging ◽  
Current State ◽  
Future Technologies ◽  
Ic Technology

The development of IC technology is driven by the need to increase performance and functionality while reducing size, power and cost. The continuous pressure to meet those requirements has created innovative, small, cost-effective 3-D packaging technologies. 3-D packaging can offer significant advantages in performance, functionality and form factor for future technologies. Breakthrough in wafer level packaging using through silicon via technology has proven to be technologically beneficial. Integration of several key and challenging process steps with a high yield and low cost is key to the general adoption of the technology. This paper will outline the breakthroughs in cost associated with an iTSV or Via-Mid structure in a integrated process flow. Key process technologies enabling 3-D chip:Via formationInsulator, barrier and seed depositionCopper filling (plating),CMPWafer thinningDie to Wafer/chip alignment, bonding and dicing This presentation will investigate these techniques that require interdisciplinary coordination and integration that previously have not been practiced. We will review the current state of 3-D interconnects and the of a cost effective Via-first TSV integrated process.

Through-Silicon-Via (TSV) for silicon package: ″via-bridge″ approach

2012 ◽  
Vol 2012 (1) ◽  
pp. 000233-000238 ◽  
Author(s):  
Y. Lamy ◽  
S. Joblot ◽  
C. Ferrandon ◽  
J.F. Carpentier ◽  
G. Simon
Keyword(s):  
High Temperature ◽  
Low Cost ◽  
Wafer Level ◽  
Electrical Measurements ◽  
Through Silicon Via ◽  
Wafer Level Packaging ◽  
High Temperature Process ◽  
Bridge Approach ◽  
Different Diameters ◽  
Dry Film

We present in this paper an alternative Through-Silicon-Via approach that can meet the new requirements of Si package. In this wafer level packaging scheme, a thick silicon interposer (200 to 300μm) is directly reported on a PCB. In 200mm Si wafers, we made a two steps TSV composed of two vias: a top via and a bottom via. The top via is etched with DRIE (diameter 60μm, depth 180 μm, Aspect Ratio = AR>3), and insulated with high temperature dielectric. After dry film lithography, the TSV is partially plated with Cu limiting the process costs (short plating time, no CMP) and the stress inside the TSV. After temporary carrier bonding, the wafer is backgrinded so that 15μm remains below the bottom of the main TSV. Backside lithography and DRIE process create the bottom via (four different diameters: 10-20-30 and 40μm) to contact main TSV. A final backside Cu plating of the opening completed the process. This via bridges the gap between via-last (AR<2) and via-middle (AR>7) and combines high temperature process from via-middle and low-cost processing from via-last. The mechanical simulations show that this ″TSV bridge″ has reduced residual stresses inside the TSV. Our electrical measurements exhibit an average single TSV resistance below 10mOhms with excellent yield (∼95% on Kelvin and 82 TSV chains), and low contact resistances (4.7×10−9 Ω.cm2) extrapolated on 4 different contact diameters. This 200μm deep TSV seems therefore very promising for low-cost thick interposer applications.

Application of Epoxy Resin for Improvement of the Banana Stem-Acoustic Panel

2021 ◽  
Vol 15 ◽  
Author(s):  
Mohd Azril Riduan ◽  
Mohd Jumain Jalil ◽  
Intan Suhada Azmi ◽  
Afifudin Habulat ◽  
Danial Nuruddin Azlan Raofuddin ◽  
...  
Keyword(s):  
Oleic Acid ◽  
Kinetic Modelling ◽  
Low Cost ◽  
Cost Effective ◽  
Performic Acid ◽  
High Yield ◽  
Renewable Materials ◽  
Runge Kutta Method ◽  
To Come

Background: Greener epoxidation by using vegetable oil to create an eco-friendly epoxide is being studied because it is a more cost-effective and environmentally friendly commodity that is safer than non-renewable materials. The aim of this research is to come up with low-cost solutions for banana trunk acoustic panels with kinetic modelling of epoxy-based palm oil. Method: In this study, the epoxidation of palm oleic acid was carried out by in situ performic acid to produce epoxidized palm oleic acid. Results: Banana trunk acoustic panel was successfully innovated based on the performance when the epoxy was applied. Lastly, a mathematical model was developed by using the numerical integration of the 4th order Runge-Kutta method, and the results showed that there is a good agreement between the simulation and experimental data, which validates the kinetic model. Conclusion: Overall, the peracid mechanism was effective in producing a high yield of epoxy from palm oleic acid that is useful for the improvement of acoustic panels based on the banana trunk.

scholarly journals An Efficient and Improved Methodology for the Screening of Industrially Valuable Xylano-Pectino-Cellulolytic Microbes

2015 ◽  
Vol 2015 ◽  
pp. 1-7 ◽  
Author(s):  
Avtar Singh ◽  
Amanjot Kaur ◽  
Anita Dua ◽  
Ritu Mahajan
Keyword(s):  
Low Cost ◽  
Cost Effective ◽  
Industrial Sector ◽  
Agricultural Residues ◽  
High Yield ◽  
Cellulolytic Enzymes ◽  
Cellulolytic Activity ◽  
Nutrient Media ◽  
First Report ◽  
Primary Screening

Xylano-pectino-cellulolytic enzymes are valuable enzymes of the industrial sector. In our earlier study, we have reported a novel and cost effective methodology for the qualitative screening of cellulase-free xylano-pectinolytic microorganisms by replacing the commercial, highly expensive substrates with agricultural residues, but the microorganisms with xylanolytic, pectinolytic, cellulolytic, xylano-pectinolytic, xylano-cellulolytic, pectino-cellulolytic, and xylano-pectino-cellulolytic potential were obtained. The probability of getting the desired combination was low, so efforts were made to further improve this cost effective methodology for obtaining the high yield of the microbes capable of producing desired combination of enzymes. By inclusion of multiple enrichment steps in sequence, using only practically low cost substrates and without any nutrient media till primary screening stage, this improved novel protocol for screening gave only the desired microorganisms with xylano-pectino-cellulolytic activity. Using this rapid, efficient, cost effective, and improved methodology, microbes with required combination of enzymes can be obtained and the probability of getting the desired microorganisms is cent percent. This is the first report presenting the methodology for the isolation of xylano-pectino-cellulolytic positive microorganisms at low cost and consuming less time.

Characterization of a Semiconductor Packaging System utilizing Through Glass Via (TGV) Technology

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 001378-001407
Author(s):  
Tim Mobley ◽  
Roupen Keusseyan ◽  
Tim LeClair ◽  
Konstantin Yamnitskiy ◽  
Regi Nocon
Keyword(s):  
Low Cost ◽  
Glass Wafer ◽  
Wafer Level ◽  
Packaging System ◽  
Thin Glass ◽  
Wafer Level Packaging ◽  
Recent Developments ◽  
And Performance ◽  
New Generation ◽  
Semiconductor Packaging

Recent developments in hole formations in glass, metalizations in the holes, and glass to glass sealing are enabling a new generation of designs to achieve higher performance while leveraging a wafer level packaging approach for low cost packaging solutions. The need for optical transparency, smoother surfaces, hermetic vias, and a reliable platform for multiple semiconductors is growing in the areas of MEMS, Biometric Sensors, Medical, Life Sciences, and Micro Display packaging. This paper will discuss the types of glass suitable for packaging needs, hole creation methods and key specifications required for through glass vias (TGV's). Creating redistribution layers (RDL) or circuit layers on both sides of large thin glass wafer poses several challenges, which this paper will discuss, as well as, performance and reliability of the circuit layers on TGV wafers or substrates. Additionally, there are glass-to-glass welding techniques that can be utilized in conjunction with TGV wafers with RDL, which provide ambient glass-to-glass attachments of lids and standoffs, which do not outgas during thermal cycle and allow the semiconductor devices to be attached first without having to reflow at lower temperatures. Fabrication challenges, reliability testing results, and performance of this semiconductor packaging system will be discussed in this paper.

Innovative 3D Structures Utilizing Wafer Level Fan-Out (WLFO) Technology

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001486-001519
Author(s):  
Curtis Zwenger ◽  
JinYoung Khim ◽  
YoonJoo Khim ◽  
SeWoong Cha ◽  
SeungJae Lee ◽  
...  
Keyword(s):  
Low Cost ◽  
Ease Of Use ◽  
Wafer Level ◽  
3D Structures ◽  
Wafer Level Packaging ◽  
Functional Convergence ◽  
3D Packaging ◽  
Improved Design ◽  
On Chip ◽  
Mobile Handset

The tremendous growth in the mobile handset, tablet, and networking markets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integration of IC devices, resulting in the need for more complex and sophisticated packaging techniques. A variety of advanced IC interconnect technologies are addressing this growing need, such as Thru Silicon Via (TSV), Chip-on Chip (CoC), and Package-on-Package (PoP). In particular, the emerging Wafer Level Fan-Out (WLFO) technology provides unique and innovative extensions into the 3D packaging realm. Wafer Level Fan-Out is a package technology designed to provide increased I/O density within a reduced footprint and profile for low density single & multi-die applications at a lower cost. The improved design capability of WLFO is due, in part, to the fine feature capabilities associated with wafer level packaging. This can allow much more aggressive design rules to be applied compared to competing laminate-based technologies. In addition, the unique characteristics of WLFO enable innovative 3D structures to be created that address the need for IC integration in emerging mobile and networking applications. This paper will review the development of WLFO and its extension into unique 3D structures. In addition, the advantages of these WLFO designs will be reviewed in comparison to current competing packaging technologies. Process & material characterization, design simulation, and reliability data will be presented to show how WLFO is poised to provide robust, reliable, and low cost 3D packaging solutions for advanced mobile and networking products.

Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging

2017 ◽  
Vol 2017 (DPC) ◽  
pp. 1-37 ◽  
Author(s):  
Amy Lujan
Keyword(s):  
Flip Chip ◽  
Cost Effective ◽  
Cost Comparison ◽  
Cost Modeling ◽  
Wafer Level ◽  
Design Features ◽  
Wafer Level Packaging ◽  
Flip Chip Packaging ◽  
The Right ◽  
The Cost

In recent years, there has been increased focus on fan-out wafer level packaging with the growing inclusion of a variety of fan-out wafer level packages in mobile products. While fan-out wafer level packaging may be the right solution for many designs, it is not always the lowest cost solution. The right packaging choice is the packaging technology that meets design requirements at the lowest cost. Flip chip packaging, a more mature technology, continues to be an alternative to fan-out wafer level packaging. It is important for many in the electronic packaging industry to be able to determine whether flip chip or fan-out wafer level packaging is the most cost-effective option. This paper will compare the cost of flip chip and fan-out wafer level packaging across a variety of designs. Additionally, the process flows for each technology will be introduced and the cost drivers highlighted. A variety of package sizes, die sizes, and design features will be covered by the cost comparison. Yield is a key component of cost and will also be considered in the analysis. Activity based cost modeling will be used for this analysis. With this type of cost modeling, a process flow is divided into a series of activities, and the total cost of each activity is accumulated. The cost of each activity is determined by analyzing the following attributes: time required, labor required, material required (consumable and permanent), capital required, and yield loss. The goal of this cost comparison is to determine which design features drive a design to be packaged more cost-effectively as a flip chip package, and which design features result in a lower cost fan-out wafer level package.

Packaging Materials for 2.5/3D Technology

2013 ◽  
Vol 2013 (1) ◽  
pp. 000276-000284 ◽  
Author(s):  
Brian Schmaltz
Keyword(s):  
High Reliability ◽  
Low Cost ◽  
High Yield ◽  
Wafer Level ◽  
Reflow Process ◽  
Thermal Compression ◽  
Conductive Films ◽  
Cu Pillar ◽  
Advanced Packaging ◽  
Capillary Underfill

The age of advanced mobile devices is on the direct horizon, are we ready for it? Less power consumption, faster processing, high reliability, high yield, low cost are words engineers are all too familiar with. 2.5/3D utilizing interposer technology, Thru Silicon Via (TSV), sub-50μm die thickness are a few of the latest techniques engineers use to solve these issues. As technology progresses to smaller process generations, new packaging applications are being demanded. The standard solder reflow process is being pushed by advancements in Cu pillar bumps, thermal compression bonding (TCB) and wafer level / pre-applied materials. This presentation will centralize around the latest advancements in NAMICS Materials for Advanced Packaging Technology; Capillary Underfill (CUF), Pre-Applied Material, Non-Conductive Paste (NCP), Non-Conductive Films (NCF).

Wafer Level Assembly Technique Development for Fine Pitch Flip Chip 3D Die-to-Wafer Integration

2010 ◽  
Vol 2010 (1) ◽  
pp. 000548-000553
Author(s):  
Zhaozhi Li ◽  
Brian J. Lewis ◽  
Paul N. Houston ◽  
Daniel F. Baldwin ◽  
Eugene A. Stout ◽  
...  
Keyword(s):  
Flip Chip ◽  
Low Cost ◽  
Three Dimensional ◽  
Cost Effective ◽  
Market Demand ◽  
Wafer Level ◽  
Packaging Technology ◽  
Fine Pitch ◽  
3D Packaging ◽  
Assembly Technique

Three Dimensional (3D) Packaging has become an industry obsession as the market demand continues to grow toward higher packaging densities and smaller form factor. In the meanwhile, the 3D die-to-wafer (D2W) packaging structure is gaining popularity due to its high manufacturing throughput and low cost per package. In this paper, the development of the assembly process for a 3D die-to-wafer packaging technology, that leverages the wafer level assembly technique and flip chip process, is introduced. Research efforts were focused on the high-density flip chip wafer level assembly techniques, as well as the challenges, innovations and solutions associated with this type of 3D packaging technology. Processing challenges and innovations addressed include flip chip fluxing methods for very fine-pitch and small bump sizes; wafer level flip chip assembly program creation and yield improvements; and set up of the Pb-free reflow profile for the assembled wafer. 100% yield was achieved on the test vehicle wafer that has totally 1,876 flip chip dies assembled on it. This work has demonstrated that the flip chip 3D die-to-wafer packaging architecture can be processed with robust yield and high manufacturing throughput, and thus to be a cost effective, rapid time to market alternative to emerging 3D wafer level integration methodologies.

scholarly journals Fabrication of Multiscale-Structure Wafer-Level Microlens Array Mold

2019 ◽  
Vol 9 (3) ◽  
pp. 487 ◽  
Author(s):  
Shuping Xie ◽  
Xinjun Wan ◽  
Xiaoxiao Wei
Keyword(s):  
Low Cost ◽  
Form Factors ◽  
Cost Effective ◽  
Microlens Array ◽  
Practical Method ◽  
Reduced Form ◽  
Wafer Level ◽  
Polycrystalline Aluminum ◽  
Microlens Arrays ◽  
Multiscale Structure

The design and manufacture of cost-effective miniaturized optics at wafer level, usingadvanced semiconductor-like techniques, enables the production of reduced form-factor cameramodules for optical devices. However, suppressing the Fresnel reflection of wafer-level microlensesis a major challenge. Moth-eye nanostructures not only satisfy the antireflection requirementof microlens arrays, but also overcome the problem of coating fracture. This novel fabricationprocess, based on a precision wafer-level microlens array mold, is designed to meet the demandfor small form factors, high resolution, and cost effectiveness. In this study, three different kinds ofaluminum material, namely 6061-T6 aluminum alloy, high-purity polycrystalline aluminum, and purenanocrystalline aluminum were used to fabricate microlens array molds with uniform nanostructures.Of these three materials, the pure nanocrystalline aluminum microlens array mold exhibited auniform nanostructure and met the optical requirements. This study lays a solid foundation for theindustrial acceptation of novel and functional multiscale-structure wafer-level microlens arrays andprovides a practical method for the low-cost manufacture of large, high-quality wafer-level molds.

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