Micro-fabrication process of vapor cells for chip-scale atomic clocks

2019 ◽  
Vol 17 (4) ◽  
pp. 040202
Author(s):  
Yanjun Zhang Yanjun Zhang ◽  
Yunchao Li Yunchao Li ◽  
Xuwen Hu Xuwen Hu ◽  
Lu Zhang Lu Zhang ◽  
Zhaojun Liu Zhaojun Liu ◽  
...  
2019 ◽  
Vol 17 (10) ◽  
pp. 100201
Author(s):  
Lu Zhang ◽  
Wendong Zhang ◽  
Shougang Zhang ◽  
Shubin Yan

Author(s):  
Christophe Gorecki ◽  
Nicolas Passilly ◽  
Vincent Maurice ◽  
Sylwester Bargiel ◽  
Ravinder Chutani ◽  
...  
Keyword(s):  

2012 ◽  
Vol 111 (7) ◽  
pp. 07E129 ◽  
Author(s):  
A. A. Omrani ◽  
G. Deng ◽  
A. Radenovic ◽  
A. Kis ◽  
H. M. Rønnow

2011 ◽  
Vol 167 (2) ◽  
pp. 594-601 ◽  
Author(s):  
M. Hasegawa ◽  
R.K. Chutani ◽  
C. Gorecki ◽  
R. Boudot ◽  
P. Dziuban ◽  
...  

2006 ◽  
Vol 326-328 ◽  
pp. 131-134 ◽  
Author(s):  
Hui Min Xie ◽  
Zhan Wei Liu ◽  
Ming Zhang ◽  
Peng Wan Chen ◽  
Feng Lei Huang ◽  
...  

In this paper, a novel nano-moiré grating fabrication technique was proposed for nanometer deformation measurement. The grating fabrication process was performed with the aid of Atomic Force Microscope (AFM) on the basis of micro-fabrication technique. On the analysis of some correlative factors of influencing grating line quality, some important experimental parameters were optimized. In this study, some parallel and cross nano-gratings with frequencies of from 10000lines/mm to 20000lines/mm were fabricated. The successful experimental results demonstrate that the nano-grating fabrication technique is feasible and also indicated that these nano-gratings with nano-moiré method can be applied to deformation measurement, which offers a nanometer sensitivity and spatial resolution.


Author(s):  
Raymond K. Yee ◽  
Gabriel C. Chan

The inherent residual stresses and strains from micro fabrication process can have profound effects on the functionality and reliability of MEMS devices. Surface micromachining fabrication involves a series of sequential steps of addition and subtraction of materials through deposition and etching techniques. For instance, when a typical micro cantilever beam is fabricated, layers of silicon dioxide and polysilicon structures are deposited on top of silicon substrate. Part of the silicon dioxide layer is chemically etched out before the deposition of polysilicon layer. Due to mismatch of coefficients of thermal expansion (CTE) in layered structure, thermal cycle loading during micromachining fabrication can induce significant residual stress within a part from thermal aspect alone. Computational method is used to simulate the micromachining fabrication process for MEMS and to predict the residual stresses/strains in a selected MEMS device. The focus of the study is on the thermal aspect of deposition and etching processes during micromachining. Particular attention is placed on the effects of deposition temperature and polysilicon film thickness on resulting residual stresses.


Author(s):  
Thejesh Bandi ◽  
Matthieu Pellaton ◽  
Danijela Miletic ◽  
Christoph Affolderbach ◽  
Florian Gruet ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document