scholarly journals Micro-fabrication process for small transport devices of layered manganite

2012 ◽  
Vol 111 (7) ◽  
pp. 07E129 ◽  
Author(s):  
A. A. Omrani ◽  
G. Deng ◽  
A. Radenovic ◽  
A. Kis ◽  
H. M. Rønnow
Keyword(s):  
Fabrication Process ◽  
Micro Fabrication

Nano-Grating Fabrication Technique

2006 ◽  
Vol 326-328 ◽  
pp. 131-134 ◽  
Author(s):  
Hui Min Xie ◽  
Zhan Wei Liu ◽  
Ming Zhang ◽  
Peng Wan Chen ◽  
Feng Lei Huang ◽  
...  
Keyword(s):  
Atomic Force Microscope ◽  
Spatial Resolution ◽  
Deformation Measurement ◽  
Fabrication Process ◽  
Fabrication Technique ◽  
Micro Fabrication ◽  
Grating Fabrication ◽  
Atomic Force ◽  
Experimental Parameters ◽  
Moire Method

In this paper, a novel nano-moiré grating fabrication technique was proposed for nanometer deformation measurement. The grating fabrication process was performed with the aid of Atomic Force Microscope (AFM) on the basis of micro-fabrication technique. On the analysis of some correlative factors of influencing grating line quality, some important experimental parameters were optimized. In this study, some parallel and cross nano-gratings with frequencies of from 10000lines/mm to 20000lines/mm were fabricated. The successful experimental results demonstrate that the nano-grating fabrication technique is feasible and also indicated that these nano-gratings with nano-moiré method can be applied to deformation measurement, which offers a nanometer sensitivity and spatial resolution.

Computational Simulation on Thermal Aspect of Micro-Fabrication Process for MEMS Device

2005 ◽  
Author(s):  
Raymond K. Yee ◽  
Gabriel C. Chan
Keyword(s):  
Residual Stresses ◽  
Silicon Dioxide ◽  
Computational Simulation ◽  
Fabrication Process ◽  
Computational Method ◽  
Mems Devices ◽  
Micro Fabrication ◽  
Polysilicon Film ◽  
Mems Device ◽  
Micro Cantilever

The inherent residual stresses and strains from micro fabrication process can have profound effects on the functionality and reliability of MEMS devices. Surface micromachining fabrication involves a series of sequential steps of addition and subtraction of materials through deposition and etching techniques. For instance, when a typical micro cantilever beam is fabricated, layers of silicon dioxide and polysilicon structures are deposited on top of silicon substrate. Part of the silicon dioxide layer is chemically etched out before the deposition of polysilicon layer. Due to mismatch of coefficients of thermal expansion (CTE) in layered structure, thermal cycle loading during micromachining fabrication can induce significant residual stress within a part from thermal aspect alone. Computational method is used to simulate the micromachining fabrication process for MEMS and to predict the residual stresses/strains in a selected MEMS device. The focus of the study is on the thermal aspect of deposition and etching processes during micromachining. Particular attention is placed on the effects of deposition temperature and polysilicon film thickness on resulting residual stresses.

scholarly journals Design, Fabrication, and Testing of a Monolithically Integrated Tri-Axis High-Shock Accelerometer in Single (111)-Silicon Wafer

Micromachines ◽  
2019 ◽  
Vol 10 (4) ◽  
pp. 227
Author(s):  
Shengran Cai ◽  
Wei Li ◽  
Hongshuo Zou ◽  
Haifei Bao ◽  
Kun Zhang ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Fabrication Process ◽  
Single Chip ◽  
Micro Fabrication ◽  
Monolithically Integrated ◽  
Shock Testing ◽  
High Shock ◽  
Cantilever Structure ◽  
Micro Systems

In this paper, a monolithic tri-axis piezoresistive high-shock accelerometer has been proposed that has been single-sided fabricated in a single (111)-silicon wafer. A single-cantilever structure and two dual-cantilever structures are designed and micromachined in one (111)-silicon chip to detect Z-axis and X-/Y-axis high-shock accelerations, respectively. Unlike the previous tri-axis sensors where the X-/Y-axis structure was different from the Z-axis one, the herein used similar cantilever sensing structures for tri-axis sensing facilitates design of uniform performance among the three elements for different sensing axes and simplifies micro-fabrication for the multi-axis sensing structure. Attributed to the tri-axis sensors formed by using the single-wafer single-sided fabrication process, the sensor is mechanically robust enough to endure the harsh high-g shocking environment and can be compatibly batch-fabricated in standard semiconductor foundries. After the single-sided process to form the sensor, the untouched chip backside facilitates simple and reliable die-bond packaging. The high-shock testing results of the fabricated sensor show linear sensing outputs along X-/Y-axis and Z-axis, with the sensitivities (under DC 5 V supply) as about 0.80–0.88 μV/g and 1.36 μV/g, respectively. Being advantageous in single-chip compact integration of the tri-axis accelerometers, the proposed monolithic tri-axis sensors are promising to be embedded into detection micro-systems for high-shock measurement applications.

Proposal of a Micro-Fabrication Process for Al Nanostructures

1997 ◽  
Vol 36 (Part 1, No. 6B) ◽  
pp. 4049-4052 ◽  
Author(s):  
Tadatsugu Hoshino ◽  
Nobuyuki Enomoto ◽  
Kaori Okano ◽  
Minoru Tsuda
Keyword(s):  
Fabrication Process ◽  
Micro Fabrication
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