Thermal management of microfabricated vapor cells for chip scale atomic clocks

Author(s):  
Runqi Han ◽  
Zheng You ◽  
Fan Zhang ◽  
Yong Ruan
Author(s):  
Alexander Laws ◽  
Richard Y. J. Chang ◽  
Victor M. Bright ◽  
Y. C. Lee

Power dissipation of chip-scale atomic clocks is one of the major design considerations. The largest power dissipation is for temperature control of the vertical-cavity surface-emitting laser (VCSEL) and cesium vapor cell. For example, the temperature of the VCSEL and Cs cell have to both be at 70±0.1°C or there will be frequency shift which will ruin the lock of the clock. These temperatures have to be maintained even under a large temperature variation such as −40°C to 50°C. There are three major thermal designs to consider: a) micro-heaters to fine-tune the temperatures of VCSEL and Cs cell, b) use of waste heat from other units to heat the system when outside temperature is low, and c) use of a thermal switch to release any extra waste heat when ambient temperatures are high. These three thermal designs have been incorporated in to a thermal test vehicle, which will be used to develop a thermal management design for the clock. This paper describes the proposed clock design, creation of the thermal test vehicle and development of a bimetallic snap based thermal conduction switch. The switch has been demonstrated to change thermal resistance from 52.9±2.8 K/W when the switch is open to 19.5±1.1 K/W with the switch closed.


Author(s):  
Christophe Gorecki ◽  
Nicolas Passilly ◽  
Vincent Maurice ◽  
Sylwester Bargiel ◽  
Ravinder Chutani ◽  
...  
Keyword(s):  

2011 ◽  
Vol 167 (2) ◽  
pp. 594-601 ◽  
Author(s):  
M. Hasegawa ◽  
R.K. Chutani ◽  
C. Gorecki ◽  
R. Boudot ◽  
P. Dziuban ◽  
...  

Author(s):  
Thejesh Bandi ◽  
Matthieu Pellaton ◽  
Danijela Miletic ◽  
Christoph Affolderbach ◽  
Florian Gruet ◽  
...  

2005 ◽  
Vol 30 (18) ◽  
pp. 2351 ◽  
Author(s):  
S. Knappe ◽  
V. Gerginov ◽  
P. D.D. Schwindt ◽  
V. Shah ◽  
H. G. Robinson ◽  
...  

Author(s):  
Gilhwan Cha ◽  
Y. Sungtaek Ju

Ability to establish and break thermal contacts in a reversible manner is important in a wide range of applications. These include active thermal conductance control for bolometers [1], pulsed thermoelectric cooling [2], chip scale atomic clocks, and thermal energy harvesting, and thermally reconfigurable networks for satellite thermal management [3]. The last is particularly interesting as it potentially has significant near- as well as long-term technical impact.


Sign in / Sign up

Export Citation Format

Share Document