scholarly journals A Through-Hole Lead Connection Method for Thin-Film Thermocouples on Turbine Blades

Sensors ◽  
2019 ◽  
Vol 19 (5) ◽  
pp. 1155 ◽  
Author(s):  
Jinjun Deng ◽  
Weihua Wang ◽  
Liuan Hui ◽  
Jietong Zhang ◽  
Xinhang Jin
Keyword(s):  
Thin Film ◽  
High Temperature ◽  
Turbine Blade ◽  
Turbine Blades ◽  
Temperature Treatment ◽  
Solder Volume ◽  
Thin Film Thermocouple ◽  
Thin Film Thermocouples ◽  
Inner Diameter ◽  
Through Hole

To solve the current problems with thin-film thermocouple signals on turbine blades in ultra-high temperature environments, this study explores the use of a through-hole lead connection technology for high-temperature resistant nickel alloys. The technique includes through-hole processing, insulation layer preparation, and filling and fixing of a high-temperature resistant conductive paste. The through-hole lead connection preparation process was optimized by investigating the influence of the inner diameter of the through-hole, solder volume, and temperature treatment on the contact strength and surface roughness of the thin-film for contact resistance. Finally, the technology was combined with a thin-film thermocouple to perform multiple thermal cycling experiments on the surface of the turbine blade at a temperature of 1000 °C. The results show that the through-hole lead connection technology can achieve a stable output of the thin-film thermocouple signal on the turbine blade.

Experimental and theoretical determination of thermal stress and heat transfer for a turbine blade, using high-temperature thin film thermocouples

1974 ◽  
Vol 6 (7) ◽  
pp. 826-831
Author(s):  
D. F. Simbirskii ◽  
V. G. Bogdanov ◽  
G. N. Tret'yachenko ◽  
R. I. Kuriat ◽  
A. P. Voloshchenko
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Thermal Stress ◽  
High Temperature ◽  
Turbine Blade ◽  
Theoretical Determination ◽  
Thin Film Thermocouples

Research on Failure Mechanism and Thermal Stress of Thin-film Thermocouple at High Temperature

2022 ◽  
Vol 905 ◽  
pp. 184-191
Author(s):  
Ting Chun Hu ◽  
Jia Fei Wang ◽  
Yi Yun Xi ◽  
Yu Feng Sun
Keyword(s):  
Thin Film ◽  
Thermal Stress ◽  
High Temperature ◽  
Failure Mechanism ◽  
Turbine Blades ◽  
Theoretical Models ◽  
Element Analysis ◽  
Film Sensor ◽  
Thin Film Thermocouple ◽  
Layer Thin Film

Aiming at the reliability of thin-film thermocouples applied to turbine blades at high temperatures, combined with high-temperature tests and finite element analysis, this paper studies its failure mechanism and thermal stress under thermal load. Multi-layer thin-film thermocouple samples were prepared on ceramic substrate, and high-temperature tests were carried out under different temperature loads, and the phenomenon of film shedding and cracking was observed using electron microscope. This paper analyzes the failure mechanism of the film sensor based on the function and structure, and uses ANSYS to analyze the thermal stress distribution of the film under high temperature load. Combining several existing theoretical models, this paper analyzes the factors affecting the thermal stress of the film and conducts simulation verification.

scholarly journals Quantitative analysis of annealing-induced instabilities of photo-leakage current and negative-bias-illumination-stress in a-InGaZnO thin-film transistors

2019 ◽  
Vol 10 ◽  
pp. 1125-1130 ◽  
Author(s):  
Dapeng Wang ◽  
Mamoru Furuta
Keyword(s):  
Thin Film ◽  
High Temperature ◽  
Low Temperature ◽  
Leakage Current ◽  
Thin Film Transistors ◽  
Temperature Treatment ◽  
Treatment Temperature ◽  
Negative Bias ◽  
Indium Gallium Zinc Oxide ◽  
Negative Bias Illumination Stress

This study examines the effect of the annealing temperature on the initial electrical characteristics and photo-induced instabilities of amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs). The extracted electrical parameters from transfer curves suggest that a low-temperature treatment maintains a high density of defects in the IGZO bulk, whereas high-temperature annealing causes a quality degradation of the adjacent interfaces. Light of short wavelengths below 460 nm induces defect generation in the forward measurement and the leakage current increases in the reverse measurement, especially for the low-temperature-annealed device. The hysteresis after negative-bias-illumination-stress (NBIS) is quantitatively investigated by using the double-scan mode and a positive gate pulse. Despite the abnormal transfer properties in the low-temperature-treated device, the excited holes are identically trapped at the front interface irrespective of treatment temperature. NBIS-induced critical instability occurs in the high-temperature-annealed TFT.

High-temperature stable thin-film thermocouples

1971 ◽  
Vol 14 (7) ◽  
pp. 1025-1027 ◽  
Author(s):  
L. S. Palatnik ◽  
A. F. Bogdanova ◽  
L. S. Grigor'ev ◽  
Ya. I. Kagan ◽  
B. I. Kolesnik ◽  
...  
Keyword(s):  
Thin Film ◽  
High Temperature ◽  
Thin Film Thermocouples

scholarly journals Indium Tin Oxide Thin-Film Thermocouple Probe Based on Sapphire Microrod

Sensors ◽  
2020 ◽  
Vol 20 (5) ◽  
pp. 1289 ◽  
Author(s):  
Jinjun Deng ◽  
Linwei Zhang ◽  
Liuan Hui ◽  
Xinhang Jin ◽  
Binghe Ma
Keyword(s):  
Thin Film ◽  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Gas Turbines ◽  
Oxide Thin Film ◽  
Main Challenge ◽  
Thin Film Thermocouple ◽  
Thin Film Thermocouples ◽  
Thermocouple Probe

Indium tin oxide (ITO) thin-film thermocouples monitor the temperature of hot section components in gas turbines. As an in situ measuring technology, the main challenge of a thin-film thermocouple is its installation on complex geometric surfaces. In this study, an ITO thin-film thermocouple probe based on a sapphire microrod was used to access narrow areas. The performance of the probe, i.e., the thermoelectricity and stability, was analyzed. This novel sensor resolves the installation difficulties of thin-film devices.

Development of Cutting Tools with Built-in Thin Film Thermocouple for Monitoring Machining Temperature

2011 ◽  
Vol 189-193 ◽  
pp. 3170-3174
Author(s):  
Qi Yong Zeng ◽  
Xiao Feng Zheng ◽  
Gao Hui Zhang ◽  
Le Chen
Keyword(s):  
Thin Film ◽  
Cubic Boron Nitride ◽  
Cutting Tools ◽  
Vital Role ◽  
Polycrystalline Cubic Boron Nitride ◽  
Thin Film Thermocouple ◽  
Thin Film Thermocouples ◽  
Pcbn Tools ◽  
Deposition Conditions

Temperature plays a vital role in the machining industry today. NiCr/NiSi thin-film thermocouples have been deposited on the rake face of polycrystalline cubic boron nitride (PCBN) tools by magnetron sputtering. The typical deposition conditions are summarized. Static and dynamic calibrations of the NiCr/NiSi thin-film thermocouples are presented. The Seebeck coefficient of the TFTC is 37.3 μV/°C. The response time is about 3.9 ms. The testing results indicate that the developed NiCr/NiSi thin-film thermocouple sensors perform excellently when machining A3 steel in situ.

Research on Interfacial Diffusion Reliability Model of Thin Film Thermocouple

2021 ◽  
Vol 881 ◽  
pp. 77-85
Author(s):  
Dong Yang Lei ◽  
Yu Feng Sun ◽  
Yu Qing Xue ◽  
Guang Yan Zhao
Keyword(s):  
Thin Film ◽  
High Temperature ◽  
Diffusion Model ◽  
Great Influence ◽  
Protective Layer ◽  
Reliability Model ◽  
Interfacial Diffusion ◽  
Parallel Diffusion ◽  
High Temperature Measurement ◽  
Thin Film Thermocouple

Thin film thermocouple (TFTC) is widely used in high temperature measurement, which is of short response time, less heat residual and integrated structure. Due to the ultra-thin structure of TFTC, the interfacial diffusion has a great influence on its reliability when exposed to high temperature environment, which leads to its performance degradation. Taking thermocouple on the turbine blade as research object, the parallel diffusion model of multilayer thermocouple is proposed based on Fick’s law. The reliability model of the protective layer, the sensitive layer and the insulating layer are established in the basis of the parallel diffusion model. According to the logical correlation among the multilayer films of TFTC, the TTF model of TFTC is given. Finally, an example of reliability model based on multilayer diffusion is simulated by Monte Carlo method, which demonstrates the feasibility of the method and model.

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