High-temperature stable thin-film thermocouples

1971 ◽  
Vol 14 (7) ◽  
pp. 1025-1027 ◽  
Author(s):  
L. S. Palatnik ◽  
A. F. Bogdanova ◽  
L. S. Grigor'ev ◽  
Ya. I. Kagan ◽  
B. I. Kolesnik ◽  
...  
Keyword(s):  
Thin Film ◽  
High Temperature ◽  
Thin Film Thermocouples

WRe26–In2O3 probe-type thin film thermocouples applied to high temperature measurement

2020 ◽  
Vol 91 (7) ◽  
pp. 074901
Author(s):  
Bian Tian ◽  
Yan Liu ◽  
Zhongkai Zhang ◽  
Libo Zhao ◽  
Zhaojun Liu ◽  
...  
Keyword(s):  
Thin Film ◽  
High Temperature ◽  
Temperature Measurement ◽  
Probe Type ◽  
High Temperature Measurement ◽  
Thin Film Thermocouples

High Temperature Silicide Thin-Film Thermocouples

1993 ◽  
Vol 322 ◽  
Author(s):  
Kenneth G. Kreider
Keyword(s):  
Thin Film ◽  
High Temperature ◽  
Seebeck Coefficient ◽  
Harsh Environments ◽  
Thin Film Sensors ◽  
Film Instability ◽  
Potential Applications ◽  
Thin Film Thermocouples ◽  
Sputter Deposited ◽  
Excellent Stability

AbstractHigh-temperature silicides have been used in mechanical structures, heating elements, and electronic, CMOS applications. Their stability in high temperature oxidizing environments and excellent electrical conductivity may also make them useful as high temperature thin-film sensors in harsh environments. We have investigated sputter deposited MoSi2, ReSi2, TaSi2, TiSi2, and WSi2 thin films and characterized their performance as thermoelements and stability up to 1200 °C. A multilayer technique was developed to ensure constant silicide stoichiometry during oxidation thereby maintaining a constant Seebeck coefficient. In addition techniques were developed to suppress the formation of metal oxides from the silicides. The results indicated excellent stability of Seebeck coefficient up to 1200 °C. These results are compared with the problems of thin film instability in the Seebeck coefficient found in noble metal thermocouples. Potential applications for temperature and heat transfer measurements will be discussed.

Experimental and theoretical determination of thermal stress and heat transfer for a turbine blade, using high-temperature thin film thermocouples

1974 ◽  
Vol 6 (7) ◽  
pp. 826-831
Author(s):  
D. F. Simbirskii ◽  
V. G. Bogdanov ◽  
G. N. Tret'yachenko ◽  
R. I. Kuriat ◽  
A. P. Voloshchenko
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Thermal Stress ◽  
High Temperature ◽  
Turbine Blade ◽  
Theoretical Determination ◽  
Thin Film Thermocouples

scholarly journals A Through-Hole Lead Connection Method for Thin-Film Thermocouples on Turbine Blades

Sensors ◽  
2019 ◽  
Vol 19 (5) ◽  
pp. 1155 ◽  
Author(s):  
Jinjun Deng ◽  
Weihua Wang ◽  
Liuan Hui ◽  
Jietong Zhang ◽  
Xinhang Jin
Keyword(s):  
Thin Film ◽  
High Temperature ◽  
Turbine Blade ◽  
Turbine Blades ◽  
Temperature Treatment ◽  
Solder Volume ◽  
Thin Film Thermocouple ◽  
Thin Film Thermocouples ◽  
Inner Diameter ◽  
Through Hole

To solve the current problems with thin-film thermocouple signals on turbine blades in ultra-high temperature environments, this study explores the use of a through-hole lead connection technology for high-temperature resistant nickel alloys. The technique includes through-hole processing, insulation layer preparation, and filling and fixing of a high-temperature resistant conductive paste. The through-hole lead connection preparation process was optimized by investigating the influence of the inner diameter of the through-hole, solder volume, and temperature treatment on the contact strength and surface roughness of the thin-film for contact resistance. Finally, the technology was combined with a thin-film thermocouple to perform multiple thermal cycling experiments on the surface of the turbine blade at a temperature of 1000 °C. The results show that the through-hole lead connection technology can achieve a stable output of the thin-film thermocouple signal on the turbine blade.

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