scholarly journals Structural, Optical and Electrical Characterizations of Midwave Infrared Ga-Free Type-II InAs/InAsSb Superlattice Barrier Photodetector

Photonics ◽  
2020 ◽  
Vol 7 (3) ◽  
pp. 76
Author(s):  
U. Zavala-Moran ◽  
M. Bouschet ◽  
J. Perez ◽  
R. Alchaar ◽  
S. Bernhardt ◽  
...  
Keyword(s):  
Current Density ◽  
Dark Current ◽  
Spectral Response ◽  
Minority Carrier Lifetime ◽  
Peak Position ◽  
Type Ii ◽  
Dark Current Density ◽  
Time Resolved ◽  
Midwave Infrared ◽  
Electrical Characterizations

In this paper, a full set of structural, optical and electrical characterizations performed on midwave infrared barrier detectors based on a Ga-free InAs/InAsSb type-II superlattice, grown by molecular beam epitaxy (MBE) on a GaSb substrate, are reported and analyzed. a Minority carrier lifetime value equal to 1 µs at 80 K, carried out on dedicated structure showing photoluminescence peak position at 4.9 µm, is extracted from a time resolved photoluminescence measurement. Dark current density as low as 3.2 × 10−5 A/cm2 at 150 K is reported on the corresponding device exhibiting a 50% cut-off wavelength around 5 µm. A performance analysis through normalized spectral response and dark current density-voltage characteristics was performed to determine both the operating bias and the different dark current regimes.

scholarly journals Demonstration of Planar Type-II Superlattice-Based Photodetectors Using Silicon Ion-Implantation

Photonics ◽  
2020 ◽  
Vol 7 (3) ◽  
pp. 68
Author(s):  
Arash Dehzangi ◽  
Donghai Wu ◽  
Ryan McClintock ◽  
Jiakai Li ◽  
Alexander Jaud ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Quantum Efficiency ◽  
Current Density ◽  
Dark Current ◽  
Infrared Photodetectors ◽  
Type Ii ◽  
Dark Current Density ◽  
Applied Bias ◽  
Type Ii Superlattice ◽  
Specific Detectivity

In this letter, we report the demonstration of a pBn planar mid-wavelength infrared photodetectors based on type-II InAs/InAs1−xSbx superlattices, using silicon ion-implantation to isolate the devices. At 77 K the photodetectors exhibited peak responsivity of 0.76 A/W at 3.8 µm, corresponding to a quantum efficiency, without anti-reflection coating, of 21.5% under an applied bias of +40 mV with a 100% cut-off wavelength of 4.6 µm. With a dark current density of 5.21 × 10−6 A/cm2, under +40 mV applied bias and at 77 K, the photodetector exhibited a specific detectivity of 4.95 × 1011 cm·Hz1/2/W.

scholarly journals Simulation of AlGaN MSM detector for investigating the effect varying absorber layer thickness

2021 ◽  
Vol 12 (1S) ◽  
pp. 445-451
Author(s):  
Harpreet Kaur, Et. al.
Keyword(s):  
Layer Thickness ◽  
Current Density ◽  
Dark Current ◽  
Spectral Response ◽  
Absorber Layer ◽  
Electron Velocity ◽  
Thickness Variation ◽  
High Signal ◽  
Active Layer Thickness ◽  
Dark Current Density

For detecting feeble Ultra-Violet (UV) signals it is essential that front-illuminated photodetector (PD) should havethick photo-absorbing layer with thin transparent metal electrodes and antireflective coating (ARC) so as to getmore photocurrent and low dark current.Since detector geometry influences its performance, so it is very important to optimize layer thickness parameters. In proposed work fixed area Al0.5Ga0.5N/AlN/ Sapphire based Metal-Semiconductor-Metal (MSM)PDbased has been analyzed for optimum value of active layer thickness and inter-electrode thickness.In addition to take benefit of large Schottky barrierGold material has beenutilized for electrodes. It has been illustrated in past research studies that with the increase in thickness of AlGaN layer, more incident energy can be absorbed for large EHPs generation which lead to increased responsivity.However, few research papers have related the effect of variations inthickness of active layerwith electron velocity which has significant effect on dark current density, recombination rateand additionally on efficiency.So for further development and widespread implementation of AlGaN/GaN based detectors there is need to study the effect of variation in photo-absorber layer thickness on closely related performance parameters so as to select its optimum value.Current Voltage (IV)-characteristics,recombination rate, current density plots and spectral response have been investigated using Atlas-Silvaco simulation tool.In addition for electrode thickness variation,transmission and absorptionplots are alsoinvestigated. For the proposed MSM structure, it has been observed that dark current density tends to increase   beyond the optimum value of thickness of AlGaN layerwith specific absorption coefficient. Good transmission of light with high spectral response can be obtained with optimum value of electrode thickness.These observations can be suitable for improving the detectivity in support of various UV detection applications requiring good sensitivity and high signal to noise ratio.

Semiconductor Photodetectors

2020 ◽  
pp. 527-584
Author(s):  
Vurgaftman Igor
Keyword(s):  
Current Density ◽  
Dark Current ◽  
High Speed ◽  
Resonant Cavity ◽  
Infrared Photodetectors ◽  
Type Ii ◽  
Dark Current Density ◽  
Quantum Well Infrared Photodetectors ◽  
Photovoltaic Detectors ◽  
Lower Responsivity

This chapter describes the operating principles of photoconductive and photovoltaic detectors based on III–V semiconductors. The electrical characteristics of both photodiodes and majority carrier barrier structures are discussed starting with the diffusion equation. The chapter outlines the figures of merit used to evaluate the performance of infrared photodetectors including the responsivity, dark current density, and normalized detectivity. It discusses bulk-like and type II superlattice photodetectors and how the multistage arrangement of interband cascade detectors (ICDs) can reduce the dark current density at the expense of a lower responsivity. Detectors that employ intersubband optical transitions, namely, quantum-well infrared photodetectors and quantum cascade detectors, are also discussed. The chapter considers how the dark-current density can be suppressed in resonant-cavity and thin waveguide-based detectors. It concludes with a discussion of the requirements for high-speed operation and an overview of novel types of detectors that draw their inspiration from III–V semiconductor devices.

Short-wave infrared detector with double barrier structure and low dark current density

2016 ◽  
Vol 14 (2) ◽  
pp. 022501-22505
Author(s):  
Yu Dong Yu Dong ◽  
Guanglong Wang Guanglong Wang ◽  
Haiqiao Ni Haiqiao Ni ◽  
Kangming Pei Kangming Pei ◽  
Zhongtao Qiao Zhongtao Qiao ◽  
...  
Keyword(s):  
Current Density ◽  
Dark Current ◽  
Infrared Detector ◽  
Short Wave ◽  
Barrier Structure ◽  
Dark Current Density ◽  
Double Barrier ◽  
Short Wave Infrared ◽  
Double Barrier Structure

Demonstration of Fabricated Midwave Infrared InAs/GaSb Type-II Superlattice-based Focal Plane Arrays

2017 ◽  
Vol 67 (2) ◽  
pp. 149 ◽  
Author(s):  
K.C. Goma Kumari ◽  
H.M. Rawool ◽  
S. Chakrabarti
Keyword(s):  
Low Temperature ◽  
Focal Plane ◽  
Spectral Response ◽  
Low Noise ◽  
Focal Plane Arrays ◽  
Type Ii ◽  
Type Ii Superlattice ◽  
Pixel Detectors ◽  
Midwave Infrared ◽  
Single Pixel

In this study, fabricated 320 × 256 infrared focal plane arrays (FPAs) were realised using a GaSb/InAs-based type-II superlattice heterostructure for midwave infrared (MWIR) imaging. We report here the optimized fabrication and characterization of single-pixel infrared detectors and FPAs. MWIR spectral response up to 5 μm of these single-pixel detectors was evident up to 250 K. Responsivity was measured to be 1.62 A/W at 0.8 V and 80 K. Current–voltage characteristics at room temperature (300 K) and at low temperature (18 K) revealed the resistance and dark current variation of the device in the operating bias region. Moreover, good thermal images were obtained at device temperatures up to 150 K for low-temperature targets. Low noise equivalent difference in temperature was measured to be 58 mK at 50 K and 117 mK at 120 K.

A Novel Surface Preparation and Post-Etch Removal Technique for InGaAs Sidewalls

1997 ◽  
Vol 477 ◽  
Author(s):  
S. A. Tabatabaei ◽  
G. A. Porkolab ◽  
S. Agarwala ◽  
F. G. Johnson ◽  
S. A. Merritt ◽  
...  
Keyword(s):  
Current Density ◽  
Dark Current ◽  
High Speed ◽  
Surface Preparation ◽  
Reverse Bias Voltage ◽  
Dark Current Density ◽  
Term Stability ◽  
Long Term Stability ◽  
Removal Technique

ABSTRACTThis paper describes in detail a surface preparation, and post-etch removal technique developed for InGaAs sidewalls. It illustrates the results demonstrating the effect of sidewall post-etch, surface preparation, and surface passivation on the performance of high speed InGaAs detectors. Dark current density for circular diodes with a diameter size varying between 10 and 100 μm was measured at a reverse bias voltage of −5 V. The effectiveness of various surface preparation techniques was studied by measuring the immediate improvement in dark current density, as well as its long-term stability. The benefits of this new technique compared to other techniques we have investigated include improved device characteristics, long-term stability, as well as a much less critical process to achieve optimum surface properties.

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