Wafer-Level Vacuum Packaging by Thermocompression Bonding Using Silver after Fly-Cut Planarization

2016 ◽  
Vol 75 (9) ◽  
pp. 291-297 ◽  
Author(s):  
C. Liu ◽  
H. Hirano ◽  
J. Froemel ◽  
S. Tanaka
Keyword(s):  
Vacuum Packaging ◽  
Wafer Level ◽  
Thermocompression Bonding

scholarly journals A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging

Sensors ◽  
2015 ◽  
Vol 15 (9) ◽  
pp. 24257-24268 ◽  
Author(s):  
Bo Xie ◽  
Yonghao Xing ◽  
Yanshuang Wang ◽  
Jian Chen ◽  
Deyong Chen ◽  
...  
Keyword(s):  
Vacuum Packaging ◽  
Glass Wafer ◽  
Wafer Level

Low Activation Temperature Au/Ti Getter Films for Wafer-Level Vacuum Packaging

2014 ◽  
Vol 64 (5) ◽  
pp. 297-304 ◽  
Author(s):  
M. Wu ◽  
J. Moulin ◽  
G. Agnus ◽  
A. Bosseboeuf
Keyword(s):  
Vacuum Packaging ◽  
Wafer Level ◽  
Activation Temperature

scholarly journals Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames

Micromachines ◽  
2018 ◽  
Vol 9 (4) ◽  
pp. 181 ◽  
Author(s):  
Koki Tanaka ◽  
Hideki Hirano ◽  
Masafumi Kumano ◽  
Joerg Froemel ◽  
Shuji Tanaka
Keyword(s):  
Atomic Hydrogen ◽  
Vacuum Packaging ◽  
Wafer Level ◽  
Cu Bonding

Wafer-level hermetic vacuum packaging by bonding with a copper–tin thin film sealing ring

2018 ◽  
Vol 28 (4) ◽  
pp. 044002 ◽  
Author(s):  
Teruhisa Akashi ◽  
Hirofumi Funabashi ◽  
Hideki Takagi ◽  
Yoshiteru Omura ◽  
Yoshiyuki Hata
Keyword(s):  
Thin Film ◽  
Vacuum Packaging ◽  
Wafer Level ◽  
Sealing Ring

Assembly Equipment Requirements for Next Generation Advanced Packaging

2016 ◽  
Vol 2016 (1) ◽  
pp. 000321-000325
Author(s):  
Bob Chylak ◽  
Horst Clauberg ◽  
Tom Strothmann
Keyword(s):  
Capital Investment ◽  
Flip Chip ◽  
High Volume ◽  
Electrical Performance ◽  
Wafer Level ◽  
Considerable Uncertainty ◽  
Thermocompression Bonding ◽  
Advanced Packaging ◽  
The Impact ◽  
3D Package

Abstract Device packaging is undergoing a proliferation of assembly options within the ever-expanding category of Advanced Packaging. Fan Out-Wafer Level Packages are achieving wide adoption based on improved performance and reduced package size and new System in Package products are coming to market in FOWLP, 2.5D and 3D package formats with the full capability to leverage heterogeneous integration in small package profiles. While the wide-spread adoption of thermocompression bonding and 2.5D packages predicted several years ago has not materialized to the extent predicted, advanced memory modules assembled by TCB are in high volume manufacturing, as are some high-end GPUs with integrated memory on Si interposer. High accuracy flip chip has been pushed to fine pitches that were difficult to imagine only three years ago and innovation in substrates and bonder technology is pushing the throughput and pitch capability even further. The packaging landscape, once dominated by a few large assembly providers, now includes turn-key packaging initiatives from the foundries with an expanding set of fan-out packing options. The fan-out processes include face-up and face-down methods, die first and die last methods and 2.5D or 3D package options. Selection of the most appropriate packaging technology from the combined aspects of electrical performance, form-factor, yield and cost presents a complex problem with considerable uncertainty and high risk for capital investment. To address this problem, the industry demands flexible manufacturing solutions that can be modified and upgraded to accommodate a changing assembly environment. This presentation will present the assembly process flows for various packaging options and discuss the key aspects of the process that influence throughput, accuracy and other key quality metrics, such as package warpage. These process flows in turn impose design constraints on submodules of the bonder. It will be shown that thoughtfully designed machine architecture allows for interchangeable and upgradeable submodules that can support nearly the entire range of assembly options. As an example, a nimble, low weight, medium force, constant heat bondhead for high throughput FOWLP can be interchanged with a high force, pulse heater bondhead to support low stress/low warpage thermocompression bonding. The various configuration options for a flexible advanced packaging bonder will be reviewed along with the impact of configuration changes on throughput and accuracy.

Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

2013 ◽  
Vol 60 ◽  
pp. 251-259 ◽  
Author(s):  
Fredrik Forsberg ◽  
Niclas Roxhed ◽  
Andreas C. Fischer ◽  
Björn Samel ◽  
Per Ericsson ◽  
...  
Keyword(s):  
Focal Plane ◽  
Large Scale ◽  
Vacuum Packaging ◽  
Focal Plane Arrays ◽  
Heterogeneous Integration ◽  
Wafer Level

scholarly journals Al-Al wafer-level thermocompression bonding applied for MEMS

2017 ◽  
Author(s):  
M.M. Visser Taklo ◽  
K. Schjolberg-Henriksen ◽  
N. Malik ◽  
E. Poppe ◽  
S.T. Moe ◽  
...  
Keyword(s):  
Wafer Level ◽  
Thermocompression Bonding

The Design and Simulation of Vibratory Ring Gyroscope

2014 ◽  
Vol 609-610 ◽  
pp. 1029-1032 ◽  
Author(s):  
Mei Yu Meng ◽  
Wen Dong Zhang
Keyword(s):  
Modeling And Simulation ◽  
Quality Factor ◽  
Resonant State ◽  
Vacuum Packaging ◽  
Q Factor ◽  
Wafer Level ◽  
Temperature Drift ◽  
High Quality ◽  
Small Temperature ◽  
Packaging Technology

This paper deals with design and simulation of vibratory ring gyroscope which has good performance as resisting vibration, resisting impact, small temperature drift because of the inherent symmetry of structure. The good performance of gyroscope has verified by detailed modeling and simulation. The manufacture of gyroscope using wafer level vacuum packaging technology making the gyroscope has high quality factor .At last we test the gyroscope and the Q factor is 20300 by detecting the resonant state of the gyroscope.

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