Low Activation Temperature Au/Ti Getter Films for Wafer-Level Vacuum Packaging

2014 ◽  
Vol 64 (5) ◽  
pp. 297-304 ◽  
Author(s):  
M. Wu ◽  
J. Moulin ◽  
G. Agnus ◽  
A. Bosseboeuf
Keyword(s):  
Vacuum Packaging ◽  
Wafer Level ◽  
Activation Temperature

Die-Level Vacuum Packaging of Mems Devices with Non-Evaporating Getters

2021 ◽  
Vol 23 (5) ◽  
pp. 238-242
Author(s):  
V.I. Laukart ◽  
O.A. Filin ◽  
S.V. Kuznetsov ◽  
M.S. Stepychev
Keyword(s):  
Original Method ◽  
Vacuum Packaging ◽  
Mems Devices ◽  
Wafer Level ◽  
Activation Temperature ◽  
Automatic Mode ◽  
Mems Gyroscopes ◽  
Programmable Device ◽  
Full Power ◽  
Device Lifetime

In this article original method of vacuum packaging in ceramic package 5142.48-A with non-evaporating getter inside is described. Some MEMS devices such as gyroscopes, accelerometers and resonators often require high and stable vacuum for operational capability. It is known two main approaches to the vacuum packaging of MEMS devices: hermetization on the wafer level and on the die level. Die-level vacuum packaging can be implemented by sealing the die in ceramic package providing excellent hermeticity with sufficiently low leak rate. However, because of outgassing from materials of the package it is difficult to achieve stable vacuum over all MEMS device lifetime. To prevent vacuum degradation it is necessary to use special materials that can remove active gases from the package by chemical sorption named getters. In this work tablet-shaped non-evaporating getter with thickness of 0.7 mm made of titan-vanadium alloy with activation temperature near 525 °C was used. For the vacuum packaging workflow new special vacuum chamber is designed. It may contain four MEMS devices simultaneously. During the process of getter activation heating was provided by halogen lamps G12 35 Wplaced over the caps of the ceramic packages with a little gap. It is defined that in deep vacuum full power of one lamp can heat the cap of the package to the temperature more than 600 °C. Probable overheating is excluded by means of the newly-designed programmable device — power switch, which can maintain required temperature in automatic mode for the necessary time. Temperature control is realized by no-contact pyrometrical method. During the experiment all necessary parameters providing specified temperature profile of the process were determined. Efficiency of the developed vacuum packaging workflow is successfully confirmed by the high and stable Q-factor of fabricated MEMS gyroscopes.

scholarly journals A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging

Sensors ◽  
2015 ◽  
Vol 15 (9) ◽  
pp. 24257-24268 ◽  
Author(s):  
Bo Xie ◽  
Yonghao Xing ◽  
Yanshuang Wang ◽  
Jian Chen ◽  
Deyong Chen ◽  
...  
Keyword(s):  
Vacuum Packaging ◽  
Glass Wafer ◽  
Wafer Level

scholarly journals Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames

Micromachines ◽  
2018 ◽  
Vol 9 (4) ◽  
pp. 181 ◽  
Author(s):  
Koki Tanaka ◽  
Hideki Hirano ◽  
Masafumi Kumano ◽  
Joerg Froemel ◽  
Shuji Tanaka
Keyword(s):  
Atomic Hydrogen ◽  
Vacuum Packaging ◽  
Wafer Level ◽  
Cu Bonding

Wafer-level hermetic vacuum packaging by bonding with a copper–tin thin film sealing ring

2018 ◽  
Vol 28 (4) ◽  
pp. 044002 ◽  
Author(s):  
Teruhisa Akashi ◽  
Hirofumi Funabashi ◽  
Hideki Takagi ◽  
Yoshiteru Omura ◽  
Yoshiyuki Hata
Keyword(s):  
Thin Film ◽  
Vacuum Packaging ◽  
Wafer Level ◽  
Sealing Ring

Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

2013 ◽  
Vol 60 ◽  
pp. 251-259 ◽  
Author(s):  
Fredrik Forsberg ◽  
Niclas Roxhed ◽  
Andreas C. Fischer ◽  
Björn Samel ◽  
Per Ericsson ◽  
...  
Keyword(s):  
Focal Plane ◽  
Large Scale ◽  
Vacuum Packaging ◽  
Focal Plane Arrays ◽  
Heterogeneous Integration ◽  
Wafer Level

Wafer-Level Vacuum Packaging by Thermocompression Bonding Using Silver after Fly-Cut Planarization

2016 ◽  
Vol 75 (9) ◽  
pp. 291-297 ◽  
Author(s):  
C. Liu ◽  
H. Hirano ◽  
J. Froemel ◽  
S. Tanaka
Keyword(s):  
Vacuum Packaging ◽  
Wafer Level ◽  
Thermocompression Bonding

The Design and Simulation of Vibratory Ring Gyroscope

2014 ◽  
Vol 609-610 ◽  
pp. 1029-1032 ◽  
Author(s):  
Mei Yu Meng ◽  
Wen Dong Zhang
Keyword(s):  
Modeling And Simulation ◽  
Quality Factor ◽  
Resonant State ◽  
Vacuum Packaging ◽  
Q Factor ◽  
Wafer Level ◽  
Temperature Drift ◽  
High Quality ◽  
Small Temperature ◽  
Packaging Technology

This paper deals with design and simulation of vibratory ring gyroscope which has good performance as resisting vibration, resisting impact, small temperature drift because of the inherent symmetry of structure. The good performance of gyroscope has verified by detailed modeling and simulation. The manufacture of gyroscope using wafer level vacuum packaging technology making the gyroscope has high quality factor .At last we test the gyroscope and the Q factor is 20300 by detecting the resonant state of the gyroscope.

Wafer level vacuum packaging of micro-mirrors with buried signal lines

2015 ◽  
Vol 21 (5) ◽  
pp. 1021-1028
Author(s):  
S. Langa ◽  
C. Drabe ◽  
A. Herrmann ◽  
T. Ludewig ◽  
A. Rieck ◽  
...  
Keyword(s):  
Vacuum Packaging ◽  
Wafer Level
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