scholarly journals Recent Progress in the Joining of Titanium Alloys to Ceramics

Metals ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 876 ◽  
Author(s):  
Sónia Simões
Keyword(s):  
Titanium Alloys ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Cost Effective ◽  
Dissimilar Joints ◽  
Tlp Bonding ◽  
Conventional Production ◽  
High Oxidation ◽  
Potential Applications ◽  
High Oxidation Resistance

The prospect of joining titanium alloys to advanced ceramics and producing components with extraordinary and unique properties can expand the range of potential applications. This is extremely attractive in components for the automotive and aerospace industries where combining high temperature resistance, wear resistance and thermal stability with low density materials, good flowability and high oxidation resistance is likely. Therefore, a combination of distinct properties and characteristics that would not be possible through conventional production routes is expected. Due to the differences between the coefficients of thermal expansion (CTE) and Young's modulus of metals and ceramics, the most appropriate methods for such dissimilar bonding are brazing, diffusion bonding, and transient liquid phase (TLP) bonding. For the joining of titanium alloys to ceramics, brazing appears to be the most promising and cost-effective process although diffusion bonding and TLP bonding have clear advantages in the production of reliable joints. However, several challenges must be overcome to successfully produce these dissimilar joints. In this context, the purpose of this review is to point out the same challenges and the most recent advances that have been investigated to produce reliable titanium alloys and ceramic joints.

scholarly journals Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Metals ◽  
2020 ◽  
Vol 10 (7) ◽  
pp. 934
Author(s):  
Hyejun Kang ◽  
Ashutosh Sharma ◽  
Jae Pil Jung
Keyword(s):  
Liquid Phase ◽  
Power Electronics ◽  
Transient Liquid Phase ◽  
Cost Effective ◽  
Ceramic Materials ◽  
Wire Bonding ◽  
Power Module ◽  
Tlp Bonding ◽  
Lower Temperature ◽  
Ultrasonic Wire Bonding

Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging.

scholarly journals Fail-Safe Joints between Copper Alloy (C18150) and Nickel-Based Superalloy (GH4169) Made by Transient Liquid Phase (TLP) Bonding and Using Boron-Nickel (BNi-2) Interlayer

Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1504
Author(s):  
Chengcong Zhang ◽  
Amir Shirzadi
Keyword(s):  
Solid State ◽  
Liquid Phase ◽  
Diffusion Bonding ◽  
Copper Alloy ◽  
Power Plants ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Heat Conducting ◽  
Nickel Based Superalloy ◽  
Tlp Bonding

Joining heat conducting alloys, such as copper and its alloys, to heat resistant nickel-based superalloys has vast applications in nuclear power plants (including future fusion reactors) and liquid propellant launch vehicles. On the other hand, fusion welding of most dissimilar alloys tends to be unsuccessful due to incompatibilities in their physical properties and melting points. Therefore, solid-state processes, such as diffusion bonding, explosive welding, and friction welding, are considered and commercially used to join various families of dissimilar materials. However, the solid-state diffusion bonding of copper alloys normally results in a substantial deformation of the alloy under the applied bonding load. Therefore, transient liquid phase (TLP) bonding, which requires minimal bonding pressure, was considered to join copper alloy (C18150) to a nickel-based superalloy (GH4169) in this work. BNi-2 foil was used as an interlayer, and the optimum bonding time (keeping the bonding temperature constant as 1030 °C) was determined based on microstructural examinations by optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS), tensile testing, and nano-hardness measurements. TLP bonding at 1030 °C for 90 min resulted in isothermal solidification, hence obtained joints free from eutectic phases. All of the tensile-tested samples failed within the copper alloy and away from their joints. The hardness distribution across the bond zone was also studied.

scholarly journals Diffusion Bonding and Transient Liquid Phase (TLP) Bonding of Type 304 and 316 Austenitic Stainless Steel—A Review of Similar and Dissimilar Material Joints

Metals ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 613 ◽  
Author(s):  
Abdulaziz AlHazaa ◽  
Nils Haneklaus
Keyword(s):  
Stainless Steel ◽  
Solid State ◽  
Liquid Phase ◽  
Austenitic Stainless Steel ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Dissimilar Material ◽  
Solid State Diffusion ◽  
Tlp Bonding ◽  
State Diffusion

Similar and dissimilar material joints of AISI grade 304 (1.4301) and AISI grade 316 (1.4401) austenitic stainless steel by solid state diffusion bonding and transient liquid phase (TLP) bonding are of interest to academia and industry alike. Appropriate bonding parameters (bonding temperature, bonding time, and bonding pressure) as well as suitable surface treatments, bonding atmosphere (usually high vacuum or protective gas) and interlayers are paramount for successful bonding. The three main parameters (temperature, time, and pressure) are interconnected in a strong non-linear way making experimental data important. This work reviews the three main parameters used for solid state diffusion bonding, TLP bonding and to a smaller degree hot isostatic pressing (HIP) of AISI grade 304 and AISI grade 316 austenitic stainless steel to the aforementioned materials (similar joints) as well as other materials, namely commercially pure titanium, Ti-6A-4V, copper, zircaloy and other non-ferrous metals and ceramic materials (dissimilar joints).

The Structure and Properties of MoSi2 Thin Film in Mos Process

1980 ◽  
Vol 38 ◽  
pp. 326-327
Author(s):  
C.K. Wu ◽  
P. Chang ◽  
N. Godinho
Keyword(s):  
Thin Film ◽  
Integrated Circuits ◽  
High Performance ◽  
Large Scale ◽  
Process Development ◽  
Structure And Properties ◽  
Metal Silicides ◽  
High Oxidation ◽  
Important Approach ◽  
High Oxidation Resistance

Recently, the use of refractory metal silicides as low resistivity, high temperature and high oxidation resistance gate materials in large scale integrated circuits (LSI) has become an important approach in advanced MOS process development (1). This research is a systematic study on the structure and properties of molybdenum silicide thin film and its applicability to high performance LSI fabrication.

COLMONOY No. 21

Alloy Digest ◽  
1996 ◽  
Vol 45 (3) ◽  
Keyword(s):  
Cast Iron ◽  
Physical Properties ◽  
Oxidation Resistance ◽  
Base Alloy ◽  
Nickel Base Alloy ◽  
Powder Metal ◽  
High Oxidation ◽  
High Oxidation Resistance ◽  
Nickel Base

Abstract Colmonoy No. 21 is a nickel-base alloy for repairing cast iron parts. The deposit has high oxidation resistance, develops a hardness of Rockwell C 26-31, and is easily finished by filing or grinding. This datasheet provides information on composition, physical properties, and hardness. It also includes information on machining, joining, and powder metal forms. Filing Code: Ni-504. Producer or source: Wall Colmonoy Corporation.

scholarly journals Ultra-high oxidation resistance of nano-structured thin films

2021 ◽  
Vol 201 ◽  
pp. 109499
Author(s):  
E. Aschauer ◽  
T. Wojcik ◽  
P. Polcik ◽  
O. Hunold ◽  
M. Arndt ◽  
...  
Keyword(s):  
Thin Films ◽  
Oxidation Resistance ◽  
High Oxidation ◽  
High Oxidation Resistance

scholarly journals Black Phosphorus-Molybdenum Disulfide Hetero-Junctions Formed with Ink-Jet Printing for Potential Solar Cell Applications with Indium-Tin-Oxide

Crystals ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 560
Author(s):  
Ravindra Ketan Mehta ◽  
Anupama Bhat Kaul
Keyword(s):  
Electrical Properties ◽  
Molybdenum Disulfide ◽  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Cost Effective ◽  
Contact Materials ◽  
Ito Glass ◽  
The Future ◽  
Potential Applications ◽  
Jet Printing

In this work, we implemented liquid exfoliation to inkjet-print two-dimensional (2D) black phosphorous (BP) and molybdenum disulfide (MoS2) p–n heterojunctions on a standard indium tin oxide (ITO) glass substrate in a vertical architecture. We also compared the optical and electrical properties of the inkjet-printed BP layer with that of the MoS2 and the electrical properties of the mechanically exfoliated MoS2 with that of the inkjet-printed MoS2. We found significant differences in the optical characteristics of the inkjet-printed BP and MoS2 layers attributed to the differences in their underlying crystal structure. The newly demonstrated liquid exfoliated and inkjet-printed BP–MoS2 2D p–n junction was also compared with previous reports where mechanically exfoliated BP–MoS2 2D p–n junction were used. The electronic transport properties of mechanically exfoliated MoS2 membranes are typically better compared to inkjet-printed structures but inkjet printing offers a cost-effective and quicker way to fabricate heterostructures easily. In the future, the performance of inkjet-printed structures can be further improved by employing suitable contact materials, amongst other factors such as modifying the solvent chemistries. The architecture reported in this work has potential applications towards building solar cells with solution processed 2D materials in the future.

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