scholarly journals Diffusion Bonding and Transient Liquid Phase (TLP) Bonding of Type 304 and 316 Austenitic Stainless Steel—A Review of Similar and Dissimilar Material Joints

Metals ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 613 ◽  
Author(s):  
Abdulaziz AlHazaa ◽  
Nils Haneklaus
Keyword(s):  
Stainless Steel ◽  
Solid State ◽  
Liquid Phase ◽  
Austenitic Stainless Steel ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Dissimilar Material ◽  
Solid State Diffusion ◽  
Tlp Bonding ◽  
State Diffusion

Similar and dissimilar material joints of AISI grade 304 (1.4301) and AISI grade 316 (1.4401) austenitic stainless steel by solid state diffusion bonding and transient liquid phase (TLP) bonding are of interest to academia and industry alike. Appropriate bonding parameters (bonding temperature, bonding time, and bonding pressure) as well as suitable surface treatments, bonding atmosphere (usually high vacuum or protective gas) and interlayers are paramount for successful bonding. The three main parameters (temperature, time, and pressure) are interconnected in a strong non-linear way making experimental data important. This work reviews the three main parameters used for solid state diffusion bonding, TLP bonding and to a smaller degree hot isostatic pressing (HIP) of AISI grade 304 and AISI grade 316 austenitic stainless steel to the aforementioned materials (similar joints) as well as other materials, namely commercially pure titanium, Ti-6A-4V, copper, zircaloy and other non-ferrous metals and ceramic materials (dissimilar joints).

scholarly journals Fail-Safe Joints between Copper Alloy (C18150) and Nickel-Based Superalloy (GH4169) Made by Transient Liquid Phase (TLP) Bonding and Using Boron-Nickel (BNi-2) Interlayer

Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1504
Author(s):  
Chengcong Zhang ◽  
Amir Shirzadi
Keyword(s):  
Solid State ◽  
Liquid Phase ◽  
Diffusion Bonding ◽  
Copper Alloy ◽  
Power Plants ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Heat Conducting ◽  
Nickel Based Superalloy ◽  
Tlp Bonding

Joining heat conducting alloys, such as copper and its alloys, to heat resistant nickel-based superalloys has vast applications in nuclear power plants (including future fusion reactors) and liquid propellant launch vehicles. On the other hand, fusion welding of most dissimilar alloys tends to be unsuccessful due to incompatibilities in their physical properties and melting points. Therefore, solid-state processes, such as diffusion bonding, explosive welding, and friction welding, are considered and commercially used to join various families of dissimilar materials. However, the solid-state diffusion bonding of copper alloys normally results in a substantial deformation of the alloy under the applied bonding load. Therefore, transient liquid phase (TLP) bonding, which requires minimal bonding pressure, was considered to join copper alloy (C18150) to a nickel-based superalloy (GH4169) in this work. BNi-2 foil was used as an interlayer, and the optimum bonding time (keeping the bonding temperature constant as 1030 °C) was determined based on microstructural examinations by optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS), tensile testing, and nano-hardness measurements. TLP bonding at 1030 °C for 90 min resulted in isothermal solidification, hence obtained joints free from eutectic phases. All of the tensile-tested samples failed within the copper alloy and away from their joints. The hardness distribution across the bond zone was also studied.

Partial Transient Liquid Phase Diffusion Bonding of Zircaloy-4 to Stabilized Austenitic Stainless Steel 321 Using Titanium Interlayer

2012 ◽  
Vol 134 (1) ◽  
Author(s):  
M. Mazar Atabaki ◽  
J. Idris
Keyword(s):  
Stainless Steel ◽  
Liquid Phase ◽  
Austenitic Stainless Steel ◽  
Energy Dispersive Spectroscopy ◽  
Diffusion Bonding ◽  
Dynamic Pressure ◽  
Transient Liquid Phase ◽  
Energy Dispersive ◽  
Vacuum Furnace ◽  
Phase Diffusion

In this study, an innovative method was applied for bonding Zircaloy-4 to stabilized austenitic stainless steel 321 using an active titanium interlayer. Specimens were joined by partial transient liquid phase diffusion bonding method in a vacuum furnace at different temperatures under 1 MPa dynamic pressure of contact. The influence of different bonding temperatures on the microstructure, microindentation hardness, joint strength, and interlayer thickness has been studied. Additionally, a simple numerical model was developed to predict the evolution of interlayer during partial transient liquid phase diffusion bonding. Diffusion of Fe, Cr, Ni, and Zr has been investigated by scanning electron microscopy examinations and energy dispersive spectroscopy elemental analyses. Results showed that control of heating and cooling rate and 20 min soaking at 1223 K produces a perfect joint. However, solid state diffusion of the melting point depressant elements into the joint metal causes the solid/liquid interface to advance until the joint is solidified. The tensile strength values of all bonded specimens were found around 480–670 MPa. Energy dispersive spectroscopy studies indicated that the melting occurred along the interface of bonded specimens as a result of transfer of atoms between the interlayer and the matrix during bonding. The evolution of interlayer film thickness indicates a good agreement between the calculation and experimental measurement. This technique provides a reliable method of bonding zirconium alloy to stainless steel.

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