scholarly journals Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Metals ◽  
2020 ◽  
Vol 10 (7) ◽  
pp. 934
Author(s):  
Hyejun Kang ◽  
Ashutosh Sharma ◽  
Jae Pil Jung
Keyword(s):  
Liquid Phase ◽  
Power Electronics ◽  
Transient Liquid Phase ◽  
Cost Effective ◽  
Ceramic Materials ◽  
Wire Bonding ◽  
Power Module ◽  
Tlp Bonding ◽  
Lower Temperature ◽  
Ultrasonic Wire Bonding

Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging.

A Review on Recent Advances in Transient Liquid Phase (TLP) Bonding for Thermoelectric Power Module

2018 ◽  
Vol 53 (2) ◽  
pp. 147-160 ◽  
Author(s):  
D. H. Jung ◽  
A. Sharma ◽  
M. Mayer ◽  
J. P. Jung
Keyword(s):  
Melting Point ◽  
Liquid Phase ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Isothermal Solidification ◽  
Power Module ◽  
Recent Advances ◽  
Tlp Bonding ◽  
Bonding Technology ◽  
Increasing Demand

Abstract In this study, the authors have reviewed recent advances on the transient liquid phase (TLP) bonding technology for various applications especially power module packaging in view of the recent increasing demand for the production of vehicles, smartphones, semiconductor devices etc. TLP bonding is one of the potential technologies from clean technology that can replace the Pb-base solder technology without causing any serious environmental issues. It is based on the concept of both brazing as well as diffusion bonding. During TLP bonding, the liquid phase is transiently formed at the bonding interface. At this point, the melting point of filler metal increases due to the diffusion of element which degrades the melting point from liquid phase to base metal. Subsequently, the bonding occurs by isothermal solidification at the bonding temperature of liquid phase. Here, after bonding, the melting temperature of the joint layer becomes higher than bonding temperature. This review introduces the various aspects of TLP bonding including its principle, materials, applications, advantages and properties in detail.

Transient liquid phase (TLP) bonding of TiAl/Ti6242 with Ti–Cu foil

2004 ◽  
Vol 9 (6) ◽  
pp. 525-531 ◽  
Author(s):  
H. Duan ◽  
M. Koçak ◽  
K.-H. Bohm ◽  
V. Ventzke
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Tlp Bonding ◽  
Cu Foil

scholarly journals Recent Progress in the Joining of Titanium Alloys to Ceramics

Metals ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 876 ◽  
Author(s):  
Sónia Simões
Keyword(s):  
Titanium Alloys ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Cost Effective ◽  
Dissimilar Joints ◽  
Tlp Bonding ◽  
Conventional Production ◽  
High Oxidation ◽  
Potential Applications ◽  
High Oxidation Resistance

The prospect of joining titanium alloys to advanced ceramics and producing components with extraordinary and unique properties can expand the range of potential applications. This is extremely attractive in components for the automotive and aerospace industries where combining high temperature resistance, wear resistance and thermal stability with low density materials, good flowability and high oxidation resistance is likely. Therefore, a combination of distinct properties and characteristics that would not be possible through conventional production routes is expected. Due to the differences between the coefficients of thermal expansion (CTE) and Young's modulus of metals and ceramics, the most appropriate methods for such dissimilar bonding are brazing, diffusion bonding, and transient liquid phase (TLP) bonding. For the joining of titanium alloys to ceramics, brazing appears to be the most promising and cost-effective process although diffusion bonding and TLP bonding have clear advantages in the production of reliable joints. However, several challenges must be overcome to successfully produce these dissimilar joints. In this context, the purpose of this review is to point out the same challenges and the most recent advances that have been investigated to produce reliable titanium alloys and ceramic joints.

Synthesis and Refinement of β-SiAlON by Nitriding and Post-Sintering of Si Mixture

2008 ◽  
Vol 403 ◽  
pp. 95-96
Author(s):  
Young Jo Park ◽  
Eun Ah Noh ◽  
Joong Ho Ahn ◽  
Hai Doo Kim
Keyword(s):  
Silicon Nitride ◽  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Cost Effective ◽  
Xrd Analysis ◽  
Sintering Process ◽  
Reaction Bonding ◽  
Heating Up

A cost-effective route to synthesize β-SiAlONs from Si mixture by reaction bonding followed by post-sintering was investigated. Three different z values, 0.45, 0.92 and 1.87 in Si6-zAlzOzN8-z, without excess liquid phase were selected to elucidate the mechanism of both SiAlON formation and densification. For the RBSN(reaction-bonded silicon nitride) specimens, nitridation rate of more than 90% was achieved by multistep heating up to 1400oC in flowing 5%H2-95%N2 and residual Si was not detected by XRD analysis. Increase in density was observed with z values for the post-sintered specimens and this tendency was well explained by the presence of higher amount of transient liquid phase with larger z values. Measured z values of the synthesized -SiAlONs were nearly similar to calculated values using starting compositions. The slight deviation in the two z values was successfully explained by the reasonable assessment of nitriding and post-sintering process.

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