A Review on Recent Advances in Transient Liquid Phase (TLP) Bonding for Thermoelectric Power Module

2018 ◽  
Vol 53 (2) ◽  
pp. 147-160 ◽  
Author(s):  
D. H. Jung ◽  
A. Sharma ◽  
M. Mayer ◽  
J. P. Jung
Keyword(s):  
Melting Point ◽  
Liquid Phase ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Isothermal Solidification ◽  
Power Module ◽  
Recent Advances ◽  
Tlp Bonding ◽  
Bonding Technology ◽  
Increasing Demand

Abstract In this study, the authors have reviewed recent advances on the transient liquid phase (TLP) bonding technology for various applications especially power module packaging in view of the recent increasing demand for the production of vehicles, smartphones, semiconductor devices etc. TLP bonding is one of the potential technologies from clean technology that can replace the Pb-base solder technology without causing any serious environmental issues. It is based on the concept of both brazing as well as diffusion bonding. During TLP bonding, the liquid phase is transiently formed at the bonding interface. At this point, the melting point of filler metal increases due to the diffusion of element which degrades the melting point from liquid phase to base metal. Subsequently, the bonding occurs by isothermal solidification at the bonding temperature of liquid phase. Here, after bonding, the melting temperature of the joint layer becomes higher than bonding temperature. This review introduces the various aspects of TLP bonding including its principle, materials, applications, advantages and properties in detail.

scholarly journals Overview of transient liquid phase and partial transient liquid phase bonding

2011 ◽  
Vol 46 (16) ◽  
pp. 5305-5323 ◽  
Author(s):  
Grant O. Cook ◽  
Carl D. Sorensen
Keyword(s):  
Liquid Phase ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Isothermal Solidification ◽  
Bonding Process ◽  
Advantages And Disadvantages ◽  
Tlp Bonding ◽  
Wide Range ◽  
Kinetics Of ◽  
Bonding Kinetics

AbstractTransient liquid phase (TLP) bonding is a relatively new bonding process that joins materials using an interlayer. On heating, the interlayer melts and the interlayer element (or a constituent of an alloy interlayer) diffuses into the substrate materials, causing isothermal solidification. The result of this process is a bond that has a higher melting point than the bonding temperature. This bonding process has found many applications, most notably the joining and repair of Ni-based superalloy components. This article reviews important aspects of TLP bonding, such as kinetics of the process, experimental details (bonding time, interlayer thickness and format, and optimal bonding temperature), and advantages and disadvantages of the process. A wide range of materials that TLP bonding has been applied to is also presented. Partial transient liquid phase (PTLP) bonding is a variant of TLP bonding that is typically used to join ceramics. PTLP bonding requires an interlayer composed of multiple layers; the most common bond setup consists of a thick refractory core sandwiched by thin, lower-melting layers on each side. This article explains how the experimental details and bonding kinetics of PTLP bonding differ from TLP bonding. Also, a range of materials that have been joined by PTLP bonding is presented.

scholarly journals Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni3Al based Superalloy IC10

2018 ◽  
Vol 206 ◽  
pp. 03004 ◽  
Author(s):  
Xiong Yue ◽  
Fengmei Liu ◽  
Hexing Chen ◽  
Di Wan ◽  
Hongbo Qin
Keyword(s):  
Melting Point ◽  
Liquid Phase ◽  
Base Metal ◽  
Microstructure Evolution ◽  
Solidification Rate ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Tlp Bonding ◽  
Point Depressant ◽  
Melting Point Depressant

Transient liquid phase (TLP) bonding of Ni3Al-based superalloy IC10 was carried out using the interlayer based on the base metal which added B and Hf as the melting point depressant elements. The effect of bonding temperature (1250 – 1270 °C) on the microstructure evolution of bonding joints were investigated. Microstructure of bonding joint composed of isothermally solidification zone (ISZ) formed γ’ phase and athermally solidified zone (ASZ) which consists of newly formed γ+γ’ reticular eutectic among with borides and carbides. Boride precipitates are not formed in diffusion affected zone (DAZ) and the boundary between ASZ and ISZ become not obvious. Isothermally solidification rate decreases as the increase of the bonding temperature.

Phase Transformations during Transient Liquid Phase Bonding of NiAl

1997 ◽  
Vol 3 (2) ◽  
pp. 130-138
Author(s):  
W.F. Gale ◽  
Y. Guan ◽  
S.V. Orel
Keyword(s):  
Liquid Phase ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Isothermal Solidification ◽  
Substrate Material ◽  
General Applicability ◽  
Tlp Bonding ◽  
Transmission Electron ◽  
Standard Models ◽  
Boride Phases

Abstract: Transient liquid phase (TLP) bonding is a joining process in which a liquid-forming interlayer is placed between the substrates to be joined. At the bonding temperature, the interlayer initially liquates. Subsequently, interdiffusion between the liquid interlayer and the adjacent substrates results in a change in the overall composition of the joint, such that isothermal resolidification of the joint takes place. Standard models of the TLP process assume the sequential occurrence of discrete dissolution, isothermal solidification, and homogenization processes. This study uses edge-on transmission electron microscopy investigations to challenge the general applicability of such standard models to the TLP bonding of a variety of systems involving the B2 type intermetallic compound NiAl as a substrate material. This article considers the formation of boride phases apparently at the bonding temperature in NiAl/Ni-Si-B/Ni bonds. The precipitation of repeating sequences of phases in NiAl/Cu/Ni joints and the reliquation of the NiTi substrate in NiAl/Cu/NiTi bonds after the completion of isothermal solidification are examined.

Microstructural Evolution of TLP Bonded Ti3Al-Nb Alloy Joints

2014 ◽  
Vol 33 (6) ◽  
pp. 525-529 ◽  
Author(s):  
X.Y. Gu ◽  
Z.Z. Duan ◽  
X.P. Gu ◽  
D.Q. Sun
Keyword(s):  
Solid Solution ◽  
Liquid Phase ◽  
Microstructural Evolution ◽  
Bonding Temperature ◽  
Pure Copper ◽  
Transient Liquid Phase ◽  
Base Material ◽  
Isothermal Solidification ◽  
Bonding Time ◽  
Solid Solution Phase

AbstractIn the present study microstructural evolution in transient liquid phase (TLP) bonded Ti3Al-Nb alloy joints using a pure copper as interlayer was investigated. TLP bonded Ti3Al-Nb alloy joints composed of intermetallic compound layers were produced. Microstructural evolution of joints depended on both bonding time and bonding temperature. With increasing bonding time and bonding temperature, the joint width increased and amount of compounds in the joint decreased. The joint microstructure at 1173 K × 1 min mainly consisted of Ti (solid solution) + Ti2Cu + TiCu + Ti3Cu4 + Ti2Cu3 + TiCu4 + Cu (solid solution) phase and it changed to Ti (solid solution) + Ti2Cu + TiCu at 1223 K × 60 min. Compounds formed on cooling from the bonding temperature by liquid phase were eliminated from the joint at 1223 K × 60 min due to isothermal solidification of liquid phase. The increase of the width of joint is attributed to the composition difference between the isothermal solidification production and its adjacent base material.

Transient Liquid Phase Bonding of High Strength Low Alloy Steel Coiled Tubing

2010 ◽  
Vol 442 ◽  
pp. 66-73 ◽  
Author(s):  
A. Javadzadeh ◽  
T.I. Khan
Keyword(s):  
Liquid Phase ◽  
Hsla Steel ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
High Strength ◽  
Oil And Gas Industry ◽  
Tube Steel ◽  
Joint Region ◽  
Coiled Tubing ◽  
Tlp Bonding

The oil and gas industry of Alberta, Canada use coiled tubing made from high strength low alloyed steel (HSLA) to extract oil from reservoirs deep beneath the earth’s surface. The repeated use of the coiled tubing in down-hole wells results in fatigue failure of the tube material. In order to repair the coiled tube, a section of tubing is fusion welded using tungsten inert gas welding onto the remaining tube steel. However, the fusion weld often fails within the weld region and therefore, alternative joining methods need to be explored to minimize detrimental changes at the joint region. In this study transient liquid phase (TLP) bonding is used with the aid of metal interlayers based on the Ag-Cu and Ni-P systems. These interlayers form a liquid at the melting point and the gradual diffusion of alloying elements into the joint and the diffusion of elements out of the joint region induces isothermal solidification whilst the joint is held at the bonding temperature. The TLP bonding behaviour of the HSLA steel as a function of bonding parameters was investigated and the quality of the joint region determined using metallurgical techniques (light and scanning electron microscopy, energy dispersive spectroscopy) and mechanical testing.

Effect of Heating Rate on Transient Liquid Phase Diffusion Bonding of Ni-Based Superalloy GTD-111

2004 ◽  
Vol 449-452 ◽  
pp. 133-136 ◽  
Author(s):  
Woo Hyuk Choi ◽  
Sung Wook Kim ◽  
Chang Hee Lee ◽  
Jung Cheol Jang
Keyword(s):  
Liquid Phase ◽  
Heating Rate ◽  
Diffusion Bonding ◽  
Completion Time ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Isothermal Solidification ◽  
Solidification Behavior ◽  
Phase Diffusion ◽  
Time Required

This study was carried out to investigate the effect of heating rate on dissolution and solidification behavior during transient liquid phase diffusion bonding of Ni-based superalloy GTD-111. The heating rate was varied by 0.1K/sec, 1K/sec, 10K/sec to the bonding temperatures 1373K and 1423K in vacuum. When the heating rate was slower and the bonding temperature was higher, the completion time of dissolution after reaching bonding temperature decreased. When the heating rate was very slow, the solidification proceeded before reaching bonding temperature and the time required for the completion of isothermal solidification was shorter. However, when the total time required for completion of solidification from the beginning of heating was considered, heating at 0.1K/sec was nearly the same as heating at 10K/sec.

Comparison of Au-In Transient Liquid Phase Bonding Designs for SiC Power Semiconductor Device Packaging

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000077-000083 ◽  
Author(s):  
Brian Grummel ◽  
Habib A. Mustain ◽  
Z. John Shen ◽  
Allen R. Hefner
Keyword(s):  
Liquid Phase ◽  
Semiconductor Device ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Wide Bandgap ◽  
Thermal Reliability ◽  
Power Semiconductor ◽  
Tlp Bonding ◽  
Die Attach ◽  
Order Of Magnitude

Transient liquid phase (TLP) bonding is an advanced die-attach technique for wide-bandgap power semiconductor and high-temperature packaging. TLP bonding advances current soldering techniques by raising the melting point to over 500 °C without detrimental high-lead materials. The bond also has greater reliability and rigidity due in part to a bonding temperature of 200 °C that drastically lowers the peak bond stresses. Furthermore, the thermal conductivity is increased 67 % while the bond thickness is substantially reduced, lowering the thermal resistance by an order of magnitude. This work provides an in-depth examination of the TLP fabrication methodology utilizing mechanical and thermal experimental characterization data along with thermal reliability results.

scholarly journals Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Metals ◽  
2020 ◽  
Vol 10 (7) ◽  
pp. 934
Author(s):  
Hyejun Kang ◽  
Ashutosh Sharma ◽  
Jae Pil Jung
Keyword(s):  
Liquid Phase ◽  
Power Electronics ◽  
Transient Liquid Phase ◽  
Cost Effective ◽  
Ceramic Materials ◽  
Wire Bonding ◽  
Power Module ◽  
Tlp Bonding ◽  
Lower Temperature ◽  
Ultrasonic Wire Bonding

Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging.

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