transient liquid phase bonding Latest Research Papers

Fabrication of Sn-plated Cu foam for high-efficiency transient-liquid-phase bonding

Materials Today Communications ◽

10.1016/j.mtcomm.2021.103058 ◽

2022 ◽

Vol 30 ◽

pp. 103058

Author(s):

Jiaxin Liu ◽

Zhenyu Lei ◽

Qing Wang ◽

Yun Mou ◽

Mingxiang Chen

Keyword(s):

Liquid Phase ◽

High Efficiency ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Cu Foam

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Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach

Materials Research Bulletin ◽

10.1016/j.materresbull.2021.111713 ◽

2022 ◽

Vol 149 ◽

pp. 111713

Author(s):

Jianhao Wang ◽

Xunda Liu ◽

Fupeng Huo ◽

Kento Kariya ◽

Noriyuki Masago ◽

...

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Die Attach ◽

Bonding Method

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Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-021-07501-1 ◽

2022 ◽

Author(s):

Zih-You Wu ◽

Tzu-Chia Wang ◽

Yu-Ching Wang ◽

Rui-Wen Song ◽

Su-Yueh Tsai ◽

...

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Electronic Packaging ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding

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Microstructure and shear property of Ni-coated carbon nanotubes reinforced InSn-50Ag composite solder joints prepared by transient liquid phase bonding

Journal of Manufacturing Processes ◽

10.1016/j.jmapro.2021.11.001 ◽

2022 ◽

Vol 73 ◽

pp. 177-182

Author(s):

Yaocheng Zhang ◽

Zheng Liu ◽

Li Yang ◽

Yifeng Xiong

Keyword(s):

Carbon Nanotubes ◽

Liquid Phase ◽

Composite Solder ◽

Solder Joints ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Shear Property ◽

Coated Carbon

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Processing of IN718/Ti–6Al–4V bimetallic joint using transient liquid phase bonding: effect of bonding temperature on the microstructure and mechanical properties

The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics ◽

10.1080/14786435.2021.2012612 ◽

2021 ◽

pp. 1-28

Author(s):

B. Binesh ◽

M. Aghaie-Khafri ◽

A. Fayegh

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Bonding Temperature ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Microstructure And Mechanical Properties ◽

Bonding Effect

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Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding

10.1109/eptc53413.2021.9663953 ◽

2021 ◽

Author(s):

Yi Chen ◽

Shuibao Liang ◽

Canyu Liu ◽

Changqing Liu ◽

Zhaoxia Zhou

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Cu Interconnects ◽

Interfacial Characteristics

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Bubble formation and growth during Transient Liquid Phase Bonding in Cu/SnAg system for microelectronic packaging

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-021-07435-8 ◽

2021 ◽

Author(s):

El Mostafa Barik ◽

Charlotte Gillot ◽

Fiqiri Hodaj

Keyword(s):

Liquid Phase ◽

Bubble Formation ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Microelectronic Packaging

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Surface modification of Cu electroplated layers for Cu–Sn transient liquid phase bonding

Materials Chemistry and Physics ◽

10.1016/j.matchemphys.2021.125621 ◽

2021 ◽

pp. 125621

Author(s):

Shao-Yu Hsu ◽

Chih-Ming Chen ◽

Jenn-Ming Song ◽

Hiroshi Nishikawa

Keyword(s):

Surface Modification ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding

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Transient liquid phase bonding of Inconel 625 with Mar-M247 superalloy using Ni–Cr–B interlayer: Microstructure and mechanical properties

Materials Science and Engineering A ◽

10.1016/j.msea.2021.142204 ◽

2021 ◽

pp. 142204

Author(s):

Yingjun Jiao ◽

Guangmin Sheng ◽

Yuntao Zhang ◽

Chuan Xu ◽

Xinjian Yuan

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Inconel 625 ◽

Transient Liquid Phase Bonding ◽

Microstructure And Mechanical Properties

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Microstructural and mechanical properties assessment of transient liquid phase bonding of CoCuFeMnNi high entropy alloy

Transactions of Nonferrous Metals Society of China ◽

10.1016/s1003-6326(21)65715-1 ◽

2021 ◽

Vol 31 (10) ◽

pp. 3063-3074

Author(s):

Mohammad Ali KARIMI ◽

Morteza SHAMANIAN ◽

Mohammad Hossein ENAYATI

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

High Entropy Alloy ◽

High Entropy

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transient liquid phase bonding
Recently Published Documents

TOTAL DOCUMENTS

H-INDEX

Fabrication of Sn-plated Cu foam for high-efficiency transient-liquid-phase bonding

Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach

Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging

Microstructure and shear property of Ni-coated carbon nanotubes reinforced InSn-50Ag composite solder joints prepared by transient liquid phase bonding

Processing of IN718/Ti–6Al–4V bimetallic joint using transient liquid phase bonding: effect of bonding temperature on the microstructure and mechanical properties

Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding

Bubble formation and growth during Transient Liquid Phase Bonding in Cu/SnAg system for microelectronic packaging

Surface modification of Cu electroplated layers for Cu–Sn transient liquid phase bonding

Transient liquid phase bonding of Inconel 625 with Mar-M247 superalloy using Ni–Cr–B interlayer: Microstructure and mechanical properties

Microstructural and mechanical properties assessment of transient liquid phase bonding of CoCuFeMnNi high entropy alloy

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transient liquid phase bondingRecently Published Documents

TOTAL DOCUMENTS

H-INDEX

Fabrication of Sn-plated Cu foam for high-efficiency transient-liquid-phase bonding

Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach

Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging

Microstructure and shear property of Ni-coated carbon nanotubes reinforced InSn-50Ag composite solder joints prepared by transient liquid phase bonding

Processing of IN718/Ti–6Al–4V bimetallic joint using transient liquid phase bonding: effect of bonding temperature on the microstructure and mechanical properties

Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding

Bubble formation and growth during Transient Liquid Phase Bonding in Cu/SnAg system for microelectronic packaging

Surface modification of Cu electroplated layers for Cu–Sn transient liquid phase bonding

Transient liquid phase bonding of Inconel 625 with Mar-M247 superalloy using Ni–Cr–B interlayer: Microstructure and mechanical properties

Microstructural and mechanical properties assessment of transient liquid phase bonding of CoCuFeMnNi high entropy alloy

transient liquid phase bonding
Recently Published Documents