scholarly journals Direct Ultrasonic Soldering of AlN Ceramics with Copper Substrate Using Zn–Al–Mg Solder

Metals ◽  
2020 ◽  
Vol 10 (2) ◽  
pp. 160 ◽  
Author(s):  
Roman Kolenak ◽  
Igor Kostolny ◽  
Jaromir Drapala ◽  
Paulina Zackova ◽  
Marcel Kuruc
Keyword(s):  
Solid Solution ◽  
Shear Strength ◽  
Substrate Surface ◽  
Bond Formation ◽  
Copper Substrate ◽  
Magnesium Content ◽  
Substantial Effect ◽  
Cu Substrate ◽  
Ultrasonic Soldering ◽  
Maximum Shear Strength

This research aims to develop the direct soldering of aluminum nitride (AlN) ceramics with a copper substrate using Zn–Al–Mg solder. The solder type, Zn5Al3Mg, has a close-to eutectic composition with a melting point of 359 °C. The microstructure of Zn–Al–Mg solder is composed of solid solution (Al), solid solution (Zn), an Mg2Zn11 phase and a minority MgZn2 phase. The tensile strength is from 82 to 169 MPa and depends on the magnesium content. The bond with AlN ceramics is formed due to the interaction of active Zn, Al and Mg metals with the substrate surface without forming a new transition phase. Zn and Al elements exert a substantial effect on bond formation with the Cu substrate. Magnesium does not contribute to bond formation with the Cu substrate. Two new phases, CuZn4-ε and Cu33Al17/Cu9Al4/Cu5Zn8- γ, were observed, and form the transition zone of the joint. The maximum shear strength of the AlN/Cu joint fabricated using Zn5Al3Mg solder is 47 MPa. The maximum shear strength of the Cu/Cu joint fabricated using the same solder is 93 MPa.

Research on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn–In–Mg

2019 ◽  
Vol 53 (10) ◽  
pp. 1411-1422 ◽  
Author(s):  
Roman Koleňák ◽  
Igor Kostolný ◽  
Jaromír Drápala ◽  
Marián Drienovský ◽  
Martin Sahul
Keyword(s):  
Solid Solution ◽  
Shear Strength ◽  
Grain Boundaries ◽  
Copper Substrate ◽  
Power Ultrasound ◽  
Cu Substrate ◽  
Unstable Phase ◽  
Average Shear Strength ◽  
Average Shear ◽  
Transient Phases

The study aimed at direct flux-free soldering of metal-ceramics composite (MMC) with a copper substrate. Soldering was performed with type Zn10In1Mg Zn-solder. The soldered joints were fabricated using power ultrasound. The solder used consists of a zinc matrix, while the solid solution (In) and MgZn2 phase were segregated on the grain boundaries. The soldered MMC joint is formed due to dissolution of the aluminium matrix in zinc solder. A new composite, composed of matrix consisting mainly of solid solution (Al) is thus formed. Moreover, there is also a solid solution present (In) and Cu3.2Zn0.7Al4.2 phase. The bond with copper substrate is formed due to interaction of Zn and Al from the solder at formation of two transient phases, namely Cu3.2Zn0.7Al4.2 and an unstable phase of Al(Cu,Zn)2. The average shear strength of combined joints of MMC/Cu is 16.5 MPa.

Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition

2017 ◽  
Vol 29 (3) ◽  
pp. 121-132 ◽  
Author(s):  
Roman Kolenak
Keyword(s):  
Shear Strength ◽  
Bond Formation ◽  
Copper Substrate ◽  
Metallic Materials ◽  
Ultrasonic Activation ◽  
Content Type ◽  
Lower Shear ◽  
Sic Ceramics ◽  
Cu Substrates ◽  
Ultrasonic Soldering

Purpose This paper aims to investigate the effect of solder alloying with a small amount of La and Y on bond formation with the Si and Cu substrates. Design/methodology/approach Bi2La and Bi2Y solders were studied. Soldering was performed using a fluxless method in air and with ultrasonic activation. Findings It was found that in the process of ultrasonic soldering, the La and Y were distributed at the interface with Si and Cu substrates, which enhanced the bond formation. Addition of La or Y elements in a Bi-based solder also ensured wetting of non-metallic materials such as Si, Al2O3 and SiC ceramics. Originality/value The addition of lanthanides offers a method for ensuring wetting of non-metallic materials. The bond with Si was of an adhesive character without the formation of a new contact interlayer. This resulted in lower shear strength of the bond with Si (8-10 MPa). The shear strength of the bond with a Cu substrate was 22-30 MPa.

The Preparation of Ag Nanopaste with Silver-Plated Diamond by Low-Temperature Pressureless Sintering

2021 ◽  
Vol 16 (6) ◽  
pp. 933-940
Author(s):  
Rongjiang Tang ◽  
Hong He ◽  
Xiong Jiang ◽  
Fabing Zeng ◽  
Haidong Yan ◽  
...  
Keyword(s):  
Shear Strength ◽  
Sintering Temperature ◽  
Copper Substrate ◽  
Solvent System ◽  
Pressureless Sintering ◽  
Sintered Diamond ◽  
Sintering Properties ◽  
The Impact ◽  
Maximum Shear Strength ◽  
Organic Solvent System

Diamond/Ag nanopaste has been prepared by mixing Ag nanoparticles, silver-plated diamond particles, and an organic solvent system. Then, we characterized and studied the sintering properties of diamond/Ag nanopaste. Meanwhile, the impact factor of sintering temperature on the sintered microstructure of the diamond/Ag nanopaste on direct bonding copper (DBC) substrate was investigated. The influences of sintering temperature on the shear strength of diamond/Ag nanopaste connection layer for attaching silicon chip on the silver-plated copper substrate were analyzed. The results show that silver plating on the surface of the diamond can significantly strengthen the bonding ability between the diamond and nano-silver. When the pressureless sintering temperature increased from 150 °C to 350 °C, the porosity of diamond/Ag nanopaste decreased from 29.8% to 8.9%, and the sintered diamond/Ag joint with uniform and dense connection layer showed the maximum shear strength of 15.26 MPa as sintering at 350 °C.

scholarly journals Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination

Metals ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 27
Author(s):  
Roman Kolenak ◽  
Igor Kostolny ◽  
Jaromir Drapala ◽  
Paulina Babincova ◽  
Martin Sahul
Keyword(s):  
Shear Strength ◽  
Aluminum Alloy ◽  
Copper Substrate ◽  
Eutectic Type ◽  
Two Phase ◽  
Copper Addition ◽  
Alloy Type ◽  
Average Shear Strength ◽  
Average Shear ◽  
Ultrasonic Soldering

The aim of the research was to characterize the soldering alloy type Zn–Al–Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate. The Zn–Al–Cu solder is of the close-to-eutectic type with two phase transformations: the eutectic transformation at 378 °C and the eutectoid transformation at 285 °C. The solder microstructure is formed of a matrix composed of the solid solutions of aluminum (Al) and zinc (Zn) in which the copper phases CuZn4 and CuAl2 are precipitated. The shear strength of the soldering alloy type Zn5Al with copper addition reaches values from 167 to 187 MPa and it depends on the copper content in the solder. The bond with aluminum alloy type Al7075 is formed due to the solubility of Al in zinc solder at the formation of solid solution Al. Contrary to this observation, the bond with the copper substrate is in this case formed due to the interaction of zinc and aluminum with the copper substrate. Two new intermetallic phases, namely Al(Cu,Zn)2 and Cu3.2Zn0.7Al4.2, were formed. The average shear strength of Al7075/Zn5Al3Cu/Cu joints attained was 134.5 MPa. For comparison, the Cu/Zn5Al3Cu/Cu joint attained an average shear strength of 136.5 MPa.

scholarly journals Study of Direct Bonding Ceramics with Metal Using Sn2La Solder

2015 ◽  
Vol 2015 ◽  
pp. 1-13 ◽  
Author(s):  
Roman Koleňák ◽  
Igor Kostolný
Keyword(s):  
Shear Strength ◽  
Thin Layer ◽  
Ceramic Material ◽  
Bond Formation ◽  
Ceramic Materials ◽  
Ultrasonic Activation ◽  
Cu Substrate ◽  
Soldering Process ◽  
Sic Ceramics ◽  
Increased Strength

The aim of this research was to study the direct bonding of ceramic materials, mainly Al2O3and selected metals, with primary attention given to Cu substrate. Soldering was performed with Sn-based solder alloyed with 2% La. We found that the bond formation between Sn2La solder and Al2O3occurs at the activation of lanthanum phases in solder by ultrasound. Lanthanum in the solder becomes oxidised in air during the soldering process. However, due to ultrasonic activation, the lanthanum particles are distributed to the boundary with ceramic material. A uniformly thin layer containing La, 1.5 µm in thickness, is formed on the boundary with Al2O3material, ensuring both wetting and joint formation. The shear strength with Al2O3ceramics is 7.5 MPa. Increased strength to 13.5 MPa was observed with SiC ceramics.

Surface Roughness and Wettability of SAC/CNT Lead Free Solder

2016 ◽  
Vol 857 ◽  
pp. 73-75 ◽  
Author(s):  
Norliza Ismail ◽  
Roslina Ismail ◽  
Nik Khairul Amilin Nik Ubaidillah ◽  
Azman Jalar ◽  
Norazwani Muhammad Zain
Keyword(s):  
Surface Roughness ◽  
Contact Angle ◽  
Substrate Surface ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Substrate Surface Roughness ◽  
Free Solder

The effect of substrate surface roughness on the wettability of SAC237 (Sn 99.9%, Ag 0.3%, Cu 0.7%) with difference percentage of CNT on copper substrate was investigated. Solder paste of SAC 237 without CNT, 0.01% and 0.04% of CNT were reflowed at 270°C on different surface roughness of Cu substrate (abrasive number 240, 400, 600, 800). Contact angle of soldered samples measured by Infinite Focus Microscope (IFM). As a result, contact angle value of investigated solders range 7° to 20°. Contact angle obtained decreases with the increasing surface roughness of Cu substrate. This demonstrates that rougher substrate enhance the wettability of the solders. Addition of CNT also effects the wettability of investigated solders. Higher composition of CNT show better wettability.

Effects of In/Ce to Sn-3.5Ag Lead-Free Solder on Microstructures and Properties

2013 ◽  
Vol 749 ◽  
pp. 198-204 ◽  
Author(s):  
En Jia Chen ◽  
Xiu Chen Zhao ◽  
Ying Liu ◽  
Dong Mei Li ◽  
Jing Wei Cheng ◽  
...  
Keyword(s):  
Shear Strength ◽  
Melting Point ◽  
Solder Joint ◽  
Lead Free ◽  
Cu Substrate ◽  
Substrate Interface ◽  
Smelting Method ◽  
Joint Element ◽  
Free Solder ◽  
Maximum Shear Strength

The Sn-3.5Ag based lead-free electronic solder doped with element In /Ce were prepared respectively using a smelting method with protection by molten salt (SMPMS). The effects of In addition and Ce addition on microstructure, melting point and wettability of Sn-3.5Ag solder were investigated comparatively. And the effects of addition on the intermetallic compound (IMC) layer formed at solder/Cu substrate interface and the shear strength of solder joint were also studied. The results showed that appropriate In or Ce addition can refine Ag3Sn grains and improve the shear strength of solder joint. Element In can significantly reduce the melting point, narrow the melting range of the solder alloy and improve wettability on Cu substrate. When the content of In was 3%, the spreading area was the largest and the wettability was the best. The addition of Ce can efficiently reduce the thickness of the IMC layer grown at the solder/Cu substrate interface and improve the shear strength of solder joint. When the content of Ce was 0.5%, the solder joint had the minimum average IMC thickness and the maximum shear strength.

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

scholarly journals Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

Materials ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 776
Author(s):  
Nur Syahirah Mohamad Zaimi ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Andrei Victor Sandu ◽  
Mohd Mustafa Al Bakri Abdullah ◽  
Norainiza Saud ◽  
...  
Keyword(s):  
Shear Strength ◽  
Composite Solder ◽  
Printed Circuit Board ◽  
Microwave Sintering ◽  
Copper Substrate ◽  
Bulk Diffusion ◽  
Circuit Board ◽  
Sac305 Solder ◽  
Lap Shear ◽  
Isothermal Ageing

This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.

scholarly journals Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

Metals ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 624
Author(s):  
Roman Kolenak ◽  
Igor Kostolny ◽  
Jaromir Drapala ◽  
Paulina Babincova ◽  
Peter Gogola
Keyword(s):  
Eutectic Reaction ◽  
Research Work ◽  
Copper Substrate ◽  
Liquid Bismuth ◽  
Alloy Type ◽  
Average Shear Strength ◽  
Average Shear ◽  
The Matrix ◽  
Solder Microstructure ◽  
Ultrasonic Soldering

The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 ∘C and full melting is completed at 405 ∘C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi2. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.

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