Research on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn–In–Mg

2019 ◽  
Vol 53 (10) ◽  
pp. 1411-1422 ◽  
Author(s):  
Roman Koleňák ◽  
Igor Kostolný ◽  
Jaromír Drápala ◽  
Marián Drienovský ◽  
Martin Sahul
Keyword(s):  
Solid Solution ◽  
Shear Strength ◽  
Grain Boundaries ◽  
Copper Substrate ◽  
Power Ultrasound ◽  
Cu Substrate ◽  
Unstable Phase ◽  
Average Shear Strength ◽  
Average Shear ◽  
Transient Phases

The study aimed at direct flux-free soldering of metal-ceramics composite (MMC) with a copper substrate. Soldering was performed with type Zn10In1Mg Zn-solder. The soldered joints were fabricated using power ultrasound. The solder used consists of a zinc matrix, while the solid solution (In) and MgZn2 phase were segregated on the grain boundaries. The soldered MMC joint is formed due to dissolution of the aluminium matrix in zinc solder. A new composite, composed of matrix consisting mainly of solid solution (Al) is thus formed. Moreover, there is also a solid solution present (In) and Cu3.2Zn0.7Al4.2 phase. The bond with copper substrate is formed due to interaction of Zn and Al from the solder at formation of two transient phases, namely Cu3.2Zn0.7Al4.2 and an unstable phase of Al(Cu,Zn)2. The average shear strength of combined joints of MMC/Cu is 16.5 MPa.

Effect of brazing temperatures on microstructure and properties of TC4/Ti57Zr13Cu21Ni9/316L

2022 ◽  
Vol 119 (1) ◽  
pp. 106
Author(s):  
Mei Yang ◽  
Shuang Li ◽  
Xianju Zhang ◽  
Honglang Yang ◽  
Liping Nie ◽  
...  
Keyword(s):  
Solid Solution ◽  
Titanium Alloy ◽  
Shear Strength ◽  
Energy Dispersive Spectrometer ◽  
Nuclear Industry ◽  
Specific Strength ◽  
Tc4 Titanium Alloy ◽  
Average Shear Strength ◽  
Average Shear ◽  
Different Temperatures

Titanium alloy is an important metal material with excellent specific strength, which is widely used in aerospace field, nuclear industry, chemical medicine, and military industry. In order to investigate the connection conditions of TC4 titanium alloy and 316L stainless steel at different temperatures, the braze welding measurement with Ti57Zr13Cu21Ni9 filler metal was conducted in vacuum. The microstructure, morphology and phase of the joint were characterized by SEM (scanning electron microscope), EDS (Energy Dispersive Spectrometer) and XRD (X-ray diffraction), respectively. Microhardness and shear strength of the joint at room temperature and the bonding mechanism of TC4 and 316L were also investigated. The obtained results revealed that the main phases in the diffusion layer were Ti-based solid solution and Ti-Fe (TiFe and TiFe2) intermetallic compoundsands (IMCs) the center of the braze was mainly composed of Ti-Fe IMCs, (Ti, Zr)2(Ni, Cu), Ti-based solid solution. Additionally, the increase of brazing temperature firstly increased and then decreased the average shear strength with the maximum value of 133.9 MPa at 960 °C.

scholarly journals Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination

Metals ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 27
Author(s):  
Roman Kolenak ◽  
Igor Kostolny ◽  
Jaromir Drapala ◽  
Paulina Babincova ◽  
Martin Sahul
Keyword(s):  
Shear Strength ◽  
Aluminum Alloy ◽  
Copper Substrate ◽  
Eutectic Type ◽  
Two Phase ◽  
Copper Addition ◽  
Alloy Type ◽  
Average Shear Strength ◽  
Average Shear ◽  
Ultrasonic Soldering

The aim of the research was to characterize the soldering alloy type Zn–Al–Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate. The Zn–Al–Cu solder is of the close-to-eutectic type with two phase transformations: the eutectic transformation at 378 °C and the eutectoid transformation at 285 °C. The solder microstructure is formed of a matrix composed of the solid solutions of aluminum (Al) and zinc (Zn) in which the copper phases CuZn4 and CuAl2 are precipitated. The shear strength of the soldering alloy type Zn5Al with copper addition reaches values from 167 to 187 MPa and it depends on the copper content in the solder. The bond with aluminum alloy type Al7075 is formed due to the solubility of Al in zinc solder at the formation of solid solution Al. Contrary to this observation, the bond with the copper substrate is in this case formed due to the interaction of zinc and aluminum with the copper substrate. Two new intermetallic phases, namely Al(Cu,Zn)2 and Cu3.2Zn0.7Al4.2, were formed. The average shear strength of Al7075/Zn5Al3Cu/Cu joints attained was 134.5 MPa. For comparison, the Cu/Zn5Al3Cu/Cu joint attained an average shear strength of 136.5 MPa.

scholarly journals Direct Ultrasonic Soldering of AlN Ceramics with Copper Substrate Using Zn–Al–Mg Solder

Metals ◽  
2020 ◽  
Vol 10 (2) ◽  
pp. 160 ◽  
Author(s):  
Roman Kolenak ◽  
Igor Kostolny ◽  
Jaromir Drapala ◽  
Paulina Zackova ◽  
Marcel Kuruc
Keyword(s):  
Solid Solution ◽  
Shear Strength ◽  
Substrate Surface ◽  
Bond Formation ◽  
Copper Substrate ◽  
Magnesium Content ◽  
Substantial Effect ◽  
Cu Substrate ◽  
Ultrasonic Soldering ◽  
Maximum Shear Strength

This research aims to develop the direct soldering of aluminum nitride (AlN) ceramics with a copper substrate using Zn–Al–Mg solder. The solder type, Zn5Al3Mg, has a close-to eutectic composition with a melting point of 359 °C. The microstructure of Zn–Al–Mg solder is composed of solid solution (Al), solid solution (Zn), an Mg2Zn11 phase and a minority MgZn2 phase. The tensile strength is from 82 to 169 MPa and depends on the magnesium content. The bond with AlN ceramics is formed due to the interaction of active Zn, Al and Mg metals with the substrate surface without forming a new transition phase. Zn and Al elements exert a substantial effect on bond formation with the Cu substrate. Magnesium does not contribute to bond formation with the Cu substrate. Two new phases, CuZn4-ε and Cu33Al17/Cu9Al4/Cu5Zn8- γ, were observed, and form the transition zone of the joint. The maximum shear strength of the AlN/Cu joint fabricated using Zn5Al3Mg solder is 47 MPa. The maximum shear strength of the Cu/Cu joint fabricated using the same solder is 93 MPa.

scholarly journals The Determining Role of Nb Interlayer on Interfacial Microstructure and Mechanical Properties of Ti/Steel Clad Plate by Vacuum Rolling Cladding

Materials ◽  
2018 ◽  
Vol 11 (10) ◽  
pp. 1983 ◽  
Author(s):  
Guang-ming Xie ◽  
De-han Yang ◽  
Zong-an Luo ◽  
Ming Li ◽  
Ming-kun Wang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Solid Solution ◽  
Shear Strength ◽  
Heating Temperature ◽  
Interfacial Microstructure ◽  
Electron Probe Micro Analyzer ◽  
Average Shear Strength ◽  
Average Shear ◽  
Nb Interlayer

We elucidate here the determining role of Nb interlayer on mechanical properties of Ti/steel clad plate fabricated by vacuum rolling cladding (VRC) as a function of different heating temperatures. A critical analysis on the clad interface via electron probe micro-analyzer, X-ray diffractometer and shear testing were conducted to investigate the influence of TiC, Fe-Nb and TiFe compounds and Nb-Ti solid solution on microstructural evolution and shear properties of Ti/steel clad plate. The inter-diffusion between Ti, C and Fe was effectively restrained by adding the Nb interlayer at heating temperature of 800 °C, and average shear strength of 279 MPa was achieved. With increase of heating temperature, Nb-Ti solid solution was formed at the Ti/Nb interface, which reduced mechanical properties of clad plate at 900 °C. At 1000 °C, TiC and Nb-Fe compounds and Nb-Ti solid solution were formed at the interface, and minimum average shear strength of 152 MPa was achieved. The detailed analysis on the clad interface suggested that ideal shear strength can be obtained through the addition of Nb interlayer and selecting appropriate heating temperature.

scholarly journals Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Metals ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 33
Author(s):  
Duy Le Han ◽  
Yu-An Shen ◽  
Fupeng Huo ◽  
Hiroshi Nishikawa
Keyword(s):  
Shear Strength ◽  
Additional Stress ◽  
Alloy Matrix ◽  
Cu Substrate ◽  
Cu Content ◽  
Flexible Devices ◽  
Average Shear Strength ◽  
Average Shear ◽  
Fine Microstructure ◽  
Rich Alloy

The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu6(In,Sn)5 near the Cu substrate and the Cu-deficient Cu(In,Sn)2 near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint.

scholarly journals Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

Metals ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 624
Author(s):  
Roman Kolenak ◽  
Igor Kostolny ◽  
Jaromir Drapala ◽  
Paulina Babincova ◽  
Peter Gogola
Keyword(s):  
Eutectic Reaction ◽  
Research Work ◽  
Copper Substrate ◽  
Liquid Bismuth ◽  
Alloy Type ◽  
Average Shear Strength ◽  
Average Shear ◽  
The Matrix ◽  
Solder Microstructure ◽  
Ultrasonic Soldering

The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 ∘C and full melting is completed at 405 ∘C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi2. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.

Vacuum Brazing Incoloy 800 Using the Copper Foil

2015 ◽  
Vol 1101 ◽  
pp. 99-103
Author(s):  
Cheng Yen Wang ◽  
Ren Kae Shiue
Keyword(s):  
Shear Strength ◽  
Copper Foil ◽  
Vacuum Furnace ◽  
Vacuum Brazing ◽  
Average Shear Strength ◽  
Average Shear ◽  
Incoloy 800 ◽  
Brazed Joints ◽  
Brazed Joint ◽  
Time Average

The purpose of this research is focused on vacuum furnace brazing Incoloy 800 (IN-800) using the copper filler foil. Microstructural evolution and shear strength of brazed joints for various brazing conditions has been evaluated in the experiment. The Cu-rich matrix dominates entire brazed joint. The width of Cu-rich matrix is decreased with increasing the brazing temperature and/or time. Average shear strength of the joint is approximately 215 MPa. Dimple dominated fracture is widely observed for the specimen brazed below 1160oC. However, cleavage dominated fracture is found for the specimen brazed at 1200oC. It is advised that copper brazing IN-800 alloy should be confined below 1160oC.

Shear strength and cracking behavior of Cr coatings on zirconium alloy fuel claddings at different strain rates

2021 ◽  
pp. 2150194
Author(s):  
Xiulin Yan ◽  
Ruiqian Zhang ◽  
Yan Liu ◽  
Yunhua Zhang ◽  
Hui Chen
Keyword(s):  
Shear Strength ◽  
Interfacial Shear Strength ◽  
Strain Rates ◽  
Cracking Behavior ◽  
Shear Lag Model ◽  
Loading Direction ◽  
Average Shear Strength ◽  
Average Shear ◽  
Lag Model ◽  
Cr Coating

Cr coating on Zr-based fuel tubes is a potential approach for the development of accident tolerant fuels (ATF). To settle the cracking behavior and quantitative evaluation of shear strength of Cr coating under different loading conditions, the average shear strength between Cr coating and zircaloy substrate has been estimated using a modified shear-lag model in this paper. Its key parameters are determined experimentally, and the tensile method has been used to research the cracking behavior of Cr coating under different strain rates. The results show that with the increase of strain rate, the interfacial shear strength increases because of the decrease of cracking spacing, while the shear strength changes erratically with the coating thickness increases. Furthermore, abundant two unequal-crack-spacings and few two equal-crack-spacings are observed which are perpendicular to the loading direction.

scholarly journals Infrared Brazing of CoCrFeMnNi Equiatomic High Entropy Alloy Using Nickel-Based Braze Alloys

Entropy ◽  
2019 ◽  
Vol 21 (3) ◽  
pp. 283 ◽  
Author(s):  
Chieh Lin ◽  
Ren-Kae Shiue ◽  
Shyi-Kaan Wu ◽  
Huai-Li Huang
Keyword(s):  
Shear Strength ◽  
Grain Boundary ◽  
High Entropy Alloy ◽  
Solidification Shrinkage ◽  
Vacuum Brazing ◽  
High Entropy ◽  
Average Shear Strength ◽  
Average Shear ◽  
Brazed Joints ◽  
Liquidus Temperatures

Infrared vacuum brazing of CoCrFeMnNi high entropy alloy (HEA) using BNi-2 and MBF601 fillers has been investigated. Both brazes show poor wettability at temperatures only 20 °C above their liquidus temperatures. However, the wettability of BNi-2 and MBF601 fillers on CoCrFeMnNi HEA is greatly improved with increasing the test temperatures, 50 °C above their liquidus temperatures. The BNi-2 brazed joints are dominated by Ni-rich matrix with huge CrB and a few tiny boride precipitates. Average shear strengths of joints increase with increasing brazing temperature and/or time, and fracture location changes from blocky CrB in the brazed zone to grain boundary boride in the substrate. The MBF601 brazed joints are composed of CoCrFeMnNi-based matrix, particles of B/Co/Cr/Fe/Mn/Ni/P compounds, and some phosphides form along the grain boundaries of the substrate. The specimen brazed with MBF601 filler foil at 1050 °C for 600 s has the highest average shear strength of 321 MPa, while that brazed at 1080 °C for 600 s has a lower average shear strength of 271 MPa due to the presence of solidification shrinkage voids.

Diffusion Barrier Effect of Carbide Layer on Bonding Characteristics of Ti/Steel Clad

1996 ◽  
Vol 458 ◽  
Author(s):  
Y. Morizono ◽  
M. Nishida ◽  
A. Chiba
Keyword(s):  
Stainless Steel ◽  
Shear Strength ◽  
Reaction Layer ◽  
Holding Time ◽  
Barrier Effect ◽  
Parent Materials ◽  
Prolonged Annealing ◽  
Average Shear Strength ◽  
Average Shear ◽  
Bonding Characteristics

ABSTRACTBonding characteristics and interfacial microstructures in explosively welded Ti/stainless steel clad of the as-welded and annealed states were investigated. In case of Ti/SUS430 ferritic stainless steel combination, the average shear strength of an as-welded clad was 555 MPa, and metastable phases such as amorphous and fine crystalline phases were observed at the interface. These were considered to be the trace of melting and subsequently rapid solidification at the contact surface of both the parent materials. By annealing below 1173 K, the strength gradually decreased with increasing holding time. The average shear strength of the clad annealed at 1073 K for 360 ks was 242 MPa, while that of the clad annealed at 1273 K abruptly decreased down to 107 MPa with increasing holding time up to 360 ks. The reaction layer formed at the interface consisted only of TiC in the former. On the other hand, the coexistence of TiC, TiFe, TiFe2 and χ was observed at the interface in the latter. The TiC in the former was considered to serve as a barrier for diffusion of Ti, Fe and Cr across the interface and to suppress the formation of intermetallic compounds. As a result, the growth of reaction layer was inhibited and high bonding strength was preserved even after prolonged annealing. The results of the Combination of Ti and SUS304 austenitic stainless steel were also discussed.

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