Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 ∘C and full melting is completed at 405 ∘C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi2. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.

Study of Zn6Al6Ag Alloy Application in Ultrasonic Soldering of Al2O3–(Al/Al2O3) Joints

The aim of this research is to characterize the soldering alloy Zn6Al6Ag, and to study the ultrasonic soldering of an Al2O3/metal–ceramic composite (Al/Al2O3). Zn6Al6Ag solder presents a quasi-eutectic structure with a melting point around 425 °C. The solder microstructure consists of a (Zn) + (Al) matrix, reinforced with a silver AgZn3 phase. A bond with the metal–ceramic composite was formed due to the dissolution of Al in the liquid Zn solder. The Al2O3 particles were put into motion, and a new composite was formed on the boundary. The Zn6Al6Ag solder also wetted the surface of the Al2O3 ceramic. A decisive effect on bond formation was caused by zinc and aluminum, whose oxides were combined with the oxides of ceramic material during in-air soldering. An adhesive bond was formed. The average joint shear strength of Al2O3/metal–ceramic composite (Al/Al2O3) was found to be 23 MPa.

Topological Optimization of Microstructure of Adhesives under Thermal and Mechanical Loads

The paper presents a mathematical model and method for solving a wide class of problems in topological optimization of an adhesive joint to obtain an optimal microstructure and gradient properties in order to reduce the level of stresses arising from both thermal and mechanical loads therein.Adhesive joints have advantages over alternative bonding methods. The paper shows that the introduction of graduating properties in thickness or along the adhesive layer is the most promising strategy to optimize the adhesive. The approach is to modify the material properties or the geometry of the adhesive, varying along the joint.In all the papers known to authors, the shape of the elements to be joined, or the shape and location of the adhesive layer, were subject to optimization. The topological optimization methods to determine the optimal distribution / change of the gradient properties of the adhesive layer itself were not used.In the paper, the stresses arising in the solder joints are analyzed; it is shown that due to the small solder thickness, shear stresses are basic in it. The shear stresses are concentrated near the ends of the solder, and have the lowest values in the middle. The objective of the optimization problem is to reduce the peak values of the shear and peeling stresses in the solder layer. The topological optimization of the solder microstructure is to find the best distribution of a given amount of solder in the region in order to reach minimum peak values of stresses. The advantage of using topological optimization is that the microstructure of the solder should not be known a priori, and, thus, any designs can be optimized without first studying the effect of the original geometric parameters on the strength of the joint.The algorithm is implemented using the finite element method and the method of movable asymptotes. A number of examples are considered in order to obtain the solder microstructure to be optimal for reducing the peak values of shear stresses and delamination in a three-layer package.The results show that optimal microstructures significantly reduce peak stresses compared to a uniform layer. The obtained results reveal the potential of the developed algorithm and show that it can find practical use.

Improved Reliability and Mechanical Performance of Ag Microalloyed Sn58Bi Solder Alloys

Ag microalloyed Sn58Bi has been investigated in this study as a Pb-free solder candidate to be used in modern electronics industry in order to cope with the increasing demands for low temperature soldering. Microstructural and mechanical properties of the eutectic Sn58Bi and microalloyed Sn57.6Bi0.4Ag solder alloys were compared. With the addition of Ag microalloy, the tensile strength was improved, and this was attributed to a combination of microstructure refinement and an Ag3Sn precipitation hardening mechanism. However, ductility was slightly deteriorated due to the brittle nature of the Ag3Sn intermetallic compounds (IMCs). Additionally, a board level reliability study of Ag microalloyed Sn58Bi solder joints produced utilizing a surface-mount technology (SMT) process, were assessed under accelerated temperature cycling (ATC) conditions. Results revealed that microalloyed Sn57.6Bi0.4Ag had a higher characteristic lifetime with a narrower failure distribution. This enhanced reliability corresponds with improved bulk mechanical properties. It is postulated that Ag3Sn IMCs are located at the Sn–Bi phase boundaries and suppress the solder microstructure from coarsening during the temperature cycling, hereby extending the time to failure.

Improved Reliability and Mechanical Performance of Sn58Bi Solder Alloys

Microstructural and mechanical properties of the eutectic Sn58Bi and micro-alloyed Sn57.6Bi0.4Ag solder alloys were compared. With the addition of Ag micro-alloy, the tensile strength was improved and this is attributed to a combination of microstructure refinement and an Ag3Sn precipitation hardening mechanism. However, ductility is slightly deteriorated due to the brittle nature of the Ag3Sn intermetallic compounds (IMCs). Additionally, a board level reliability study of Ag micro-alloyed Sn58Bi solder joints produced utilising a surface-mount technology (SMT) process, were assessed under accelerated temperature cycling (ATC) conditions. Results reveal that micro-alloyed Sn57.6Bi0.4Ag has a higher characteristic lifetime with a narrower failure distribution. This enhanced reliability corresponds with improved bulk mechanical properties. It is postulated that Ag3Sn IMCs are located at the Sn-Bi phase boundaries and suppress the solder microstructure from coarsening during the temperature cycling, hereby extending the time to failure.

STUDY INTO STRUCTURE AND PROPERTIES OF SOLDERS BASED ON ALUMINUM AND ZINC IN THE FORM OF SMALL-SECTION CAST BARS

The study covers Al–Cu–Si (A34 grade) and Zn–Al–Cu (Welco52 grade) solders. It is found that A34 solder (Al–28%Cu–6%Si) melts and crystallizes in a narrow range of temperatures (~18 °C). Solidus and liquidus temperatures of A34 solder are ~508 °С and ~526 °С, respectively. Zn–Al–Cu (Zn–4%Al–2,5% Cu) solder has a eutectic composition, so it melts and crystallizes at a constant temperature of ~389 °С. Densities of investigated solders in their liquid and solid states are studied. A34 solder has a density of 3,02 and 3,32 g/cm3 , respectively. Zinc solder density is 6,28 g/cm3 in the liquid state, and 6,69 g/cm3 in the solid state. The influence of casting conditions on the structure of cast alloys in the form of bars with cross sections of 13, 10, and 5 mm2 was investigated. Main structural components of solder alloys reduce in size as cross sections decrease. The aluminium-based solid solution dendrites and CuAl2 phase are reduced in the A34 solder microstructure. In zinc solders, the most severely reduced ones are zinc-based solid solution dendrites. The best castability is observed in melts obtained from 5 mm2 section bar solders with studied sample gaps of 2,0, 1,5 and 1,0 mm. Eutectic zinc solder features better castability in comparison with A34: castability of the melt obtained from the 5 mm2 section zinc solder rod with a sample gap width of 2,0 mm is 100 % (for A34 melt solder obtained from a rod of the same cross section it was 98 %). Experiments on soldering AK12 alloy plates and 3003 alloy sheets demonstrated that there is a tight border in the solder/base material system and no any defects such as pores or unsoldered areas. There was a slight interpenetration of solder alloys into base materials, especially when soldering AK12 cast plates.

Microstructure Evolution of Sn-Cu Based Solder Paste with Different Cu Concentration Subjected to Multiple Reflows

The evolution in microstructure of Sn-Cu based solder paste with different copper (Cu) content subjected to multiple reflow cycles was investigated. In this study, the Sn-0.7Cu (SC) solder paste was used as based material. The Cu particles were added into SC solder paste to produce new Sn-4Cu and Sn-10Cu solder paste. After that, the solder paste was then reflowed on Cu-OSP surface finished and subjected to six times reflows. Characterization focuses on the bulk solder microstructure, morphology and intermetallic compound (IMC) thickness after multiple reflows. Results reveal that solder composition significantly affect the microstructure formation and growth of IMC.

Investigation of Multicomponent Lead-Free Solders

According to the directives (RoHS and WEEE) adopted by the European Union, lead has been banned from the manufacturing processes because of its health and environmental hazards. Therefore, the development of lead-free solders is one of the most important research areas of the electronic industry. This paper investigates multicomponent Sn-Ag-Cu based lead-free solders with different compositions. The properties of the six-component Innolot (SAC+BiSbNi) and two low-Ag containing alloys were compared with the widespread used SAC307 solder. Microstructure investigations and X-ray diffraction measurements were performed to analyze and identify the formed phases, furthermore, tensile tests and microhardness measurements were executed to determine the mechanical properties of the examined solders.