scholarly journals Temperature Distribution of HBC Fuses with Asymmetric Electric Current Ratios Through Fuselinks

Energies ◽  
2018 ◽  
Vol 11 (8) ◽  
pp. 1990
Author(s):  
Adrian Plesca
Keyword(s):  
Electric Current ◽  
Cross Section ◽  
Power Distribution ◽  
Thermal Model ◽  
3D Model ◽  
Industrial Applications ◽  
Experimental Simulation ◽  
Maximum Temperature ◽  
Power Distribution Network ◽  
Thermal Distribution

In many industrial applications high breaking capacity (HBC) fuses are used to protect electrical installations against overcurrents, especially in the power distribution network. At high rated current, HBC fuses have more parallel fuselinks mounted inside. The technological and mounting processes of the fuselinks inside the fuse results in an asymmetrical current distribution through the parallel fuselinks. In this article a model of a high breaking capacity fuse using two parallel fuselinks is proposed. The influence of electric current, cross-section of the notches, distance between notches and current imbalance through fuselinks on the maximum temperature rise of both fuselinks, has been investigated. Also, a 3D thermal model for the same HBC fuse has been developed. The temperature spread into the fuse and its elements has been obtained. In order to prove the validity of the mathematical and 3D model different tests have been considered. The experimental, simulation and computed results give similar values and it results that this model can also be used for fuses with many parallel fuselinks and it permits the design of new fuse elements with optimal thermal distribution.

scholarly journals An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias

Micromachines ◽  
2021 ◽  
Vol 12 (10) ◽  
pp. 1223
Author(s):  
Guangbao Shan ◽  
Guoliang Li ◽  
Dongdong Chen ◽  
Zifeng Yang ◽  
Di Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Finite Element Method ◽  
Thermal Model ◽  
Maximum Temperature ◽  
The Finite Element Method ◽  
Equivalent Thermal Conductivity ◽  
Thermal Distribution ◽  
Mathematical Expressions ◽  
Proposed Model ◽  
Silicon Vias

An accurate equivalent thermal model is proposed to calculate the equivalent thermal conductivity (ETC) of shield differential through-silicon via (SDTSV). The mathematical expressions of ETC in both horizontal and vertical directions are deduced by considering the anisotropy of SDTSV. The accuracy of the proposed model is verified by the finite element method (FEM), and the average errors of temperature along the X-axis, Y-axis, diagonal line, and vertical directions are 1.37%, 3.42%, 1.76%, and 0.40%, respectively. Compared with COMSOL, the proposed model greatly improves the computational efficiency. Moreover, the effects of different parameters on the thermal distribution of SDTSV are also investigated. The thermal conductivity is decreased with the increase in thickness of SiO2. With the increase in pitch, the maximum temperature of SDTSV increases very slowly when β = 0°, and decreases very slowly when β = 90°. The proposed model can be used to accurately and quickly describe the thermal distribution of SDTSV, which has a great prospect in the design of 3D IC.

scholarly journals Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

Energies ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2968 ◽  
Author(s):  
Valentin Bissuel ◽  
Frédéric Joly ◽  
Eric Monier-Vinard ◽  
Alain Neveu ◽  
Olivier Daniel
Keyword(s):  
Numerical Model ◽  
Power Distribution ◽  
Thermal Model ◽  
Integrated Design ◽  
Ball Grid Array ◽  
Physical Models ◽  
Maximum Temperature ◽  
Board Structure ◽  
Large Set ◽  
Design Environment

The concept of a single-input/multi-output thermal network was proposed by the Development of Libraries of Physical models for an Integrated design environment (DELPHI) consortium more than twenty years ago. The present work highlights the recent improvements made to efficiently derive a low-computing-effort model from a fully detailed numerical model and to characterize its performances. The temperature predictions of a deduced ball-grid-array (BGA) dynamic compact thermal model are compared to those of a realistic three-dimensional representation, including the large set of internal copper traces, as well as its board structure, which has been validated by experiment. The current study discloses a method for creating an amalgam reduced-order modal model (AROMM) for that electronic component family that allows the preservation of the geometry integrity and shortening scenarios computation. Typically, the AROMM method reduces by a factor of 600 the computation time needed to obtain the solution while keeping the error on the maximum temperature below 2%. Then, a meta-heuristic optimization is run to derive a more practical low-order resistor capacitor model that enables a thermo-fluidic analysis at the board level. Based on the calibrated numerical model, a novel AROMM method was investigated in order to address the chip behavior submitted to multiple heat sources. The first results highlight the capability to enforce a non-uniform power distribution on the upper surface of the silicon chip. Thus, the chip design layout can be analyzed and optimized to prevent thermal and reliability issues.

Research on transformer vibration monitoring and diagnosis based on Internet of things

2021 ◽  
Vol 30 (1) ◽  
pp. 677-688
Author(s):  
Zhenzhuo Wang ◽  
Amit Sharma
Keyword(s):  
Internet Of Things ◽  
Power Distribution ◽  
Vibration Analysis ◽  
Vibration Monitoring ◽  
Power Transformers ◽  
Normal Operation ◽  
Analysis Method ◽  
Power Distribution Network ◽  
Monitoring And Diagnosis ◽  
Distribution Transformers

Abstract A recent advent has been seen in the usage of Internet of things (IoT) for autonomous devices for exchange of data. A large number of transformers are required to distribute the power over a wide area. To ensure the normal operation of transformer, live detection and fault diagnosis methods of power transformers are studied. This article presents an IoT-based approach for condition monitoring and controlling a large number of distribution transformers utilized in a power distribution network. In this article, the vibration analysis method is used to carry out the research. The results show that the accuracy of the improved diagnosis algorithm is 99.01, 100, and 100% for normal, aging, and fault transformers. The system designed in this article can effectively monitor the healthy operation of power transformers in remote and real-time. The safety, stability, and reliability of transformer operation are improved.

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