scholarly journals Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

2021 ◽  
Vol 11 (13) ◽  
pp. 6098
Author(s):  
Konstantinos Papatryfonos ◽  
David R. Selviah ◽  
Avi Maman ◽  
Kobi Hasharoni ◽  
Antoine Brimont ◽  
...  
Keyword(s):  
Flip Chip ◽  
Slow Light ◽  
Low Cost ◽  
Building Blocks ◽  
Light Modulation ◽  
Technology Platform ◽  
Growth Characterization ◽  
Efficient Performance ◽  
The Matrix ◽  
Dfb Laser

We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light modulation were developed to assist in achieving an efficient performance of the module. Integration of DFB laser sources within each cell in the matrix was demonstrated as well using wafer bonding between the InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization and gain stack designs were developed. Packaging of these 2D photonic arrays in a chiplet configuration was demonstrated using a vertical integration approach in which the optical interconnect matrix was flip-chip assembled on top of a CMOS mimic chip with 2D vertical fiber coupling. The optical chiplet was further assembled on a substrate to facilitate integration with the multi-chip module of the co-packaged system with a switch surrounded by several such optical chiplets. We summarize the features of the L3MATRIX co-package technology platform and its holistic toolbox of technologies to address the next generation of computing challenges.

scholarly journals From 1D to 3D: a new route to fabricate tridimensional structures via photo-generation of silver networks

RSC Advances ◽  
2015 ◽  
Vol 5 (36) ◽  
pp. 28633-28642 ◽  
Author(s):  
Huaizhong Shen ◽  
Yuxin Wu ◽  
Liping Fang ◽  
Shunsheng Ye ◽  
Zhaoyi Wang ◽  
...  
Keyword(s):  
Low Cost ◽  
Building Blocks ◽  
Top Down ◽  
Time Saving ◽  
Bottom Up ◽  
3D Structures ◽  
The Matrix

A time-saving and low-cost method is established to construct stacked 3D structures through the combination of bottom-up and top-down techniques which enables us to create building blocks freely and to precisely adjust the matrix feature.

FOAMING AND MOISTURE CROSSLINKING OF VINYL TRIETHOXY SILANE GRAFTED ETHYLENE–PROPYLENE–DIENE TERPOLYMER

2022 ◽  
Author(s):  
Zhengwei Lin ◽  
Qinghong Zhang ◽  
Gongliang Wang ◽  
Jie Mao ◽  
Martin Hoch ◽  
...  
Keyword(s):  
High Efficiency ◽  
Low Cost ◽  
Side Reaction ◽  
High Energy ◽  
Expansion Ratio ◽  
Ethylene Propylene ◽  
Foaming Process ◽  
The Matrix ◽  
High Energy Absorption ◽  
Ethylene Propylene Diene Terpolymer

ABSTRACT Moisture crosslinking of polyolefins has attracted increasing attention because of its high efficiency, low cost, and easy processing. However, the crucial shortcoming of moisture crosslinking is that the side reaction of peroxide scorch (precrosslinking) simultaneously occurs in silane grafting. It has been recognized that making peroxide precrosslinking useful is an effective way to broaden the application of moisture crosslinking. A novel foaming process combined with moisture crosslinking is proposed. The matrix of ethylene–propylene–diene terpolymer grafted with silane vinyl triethoxysilane (EPDM-g-VTES) was prepared by melt grafting, with dicumyl peroxide as initiator. Foaming was then carried out with azodicarbonamide (AC) as the blowing agent by making use of precrosslinking. Subsequently, the EPDM-g-VTES foams were immersed in a water bath to achieve moisture crosslinking with dibutyl tin dilaurate as the catalyst. The results showed that VTES was grafted onto EPDM and the EPDM-g-VTES foams were successfully crosslinked by moisture. The EPDM-g-VTES compounds with AC obtained great cells by compression molding with the help of precrosslinking. The mechanical property of the EPDM-g-VTES foam was improved by moisture crosslinking. The moisture-cured foam with 4 wt% AC had an expansion ratio of about three times, which could bear large deformation and showed a high energy-absorption effect.

Percolation Theory Applied to Study the Effect of Shape and Size of the Filler Particles in Thermal Interface Materials

2000 ◽  
Author(s):  
Amit Devpura ◽  
Patrick E. Phelan ◽  
Ravi S. Prasher
Keyword(s):  
Percolation Theory ◽  
Flip Chip ◽  
Filler Concentration ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Chip Technology ◽  
The Matrix ◽  
Different Shapes ◽  
Filler Particles ◽  
Interface Materials

Abstract An important aspect in electronic packaging is the heat dissipation. Flip-chip technology is widely being used to increase the rate of heat transfer from the chip. A method to further enhance the thermal conductivity is by the use of a thermal interface material between the device and the heat sink attached to it in the flip-chip technology. Percolation theory holds a key to understanding the behavior of thermal interface materials. Percolation, used widely in electrical engineering, is a physical phenomenon in which the highly conducting particles distributed randomly in the matrix form at least one continuous chain connecting the opposite faces of the matrix. This phenomenon was simulated using the matrix method, to study the effect of different shapes and size of the filler particles. The different shapes considered were spherical, vertical or horizontal rods, and flakes in horizontal or vertical orientation. The effect of the size of these particles was also examined. The results indicate that the composites with particles having the largest side in the direction of heat flow will always have a better conductivity than the particles oriented normal to it. Also, from the results, we can choose the best filler size in the composite if we know the filler concentration we are aiming at.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

scholarly journals Practical Implementation of an Indoor Robot Localization and Identification System using an Array of Anchor Nodes

2020 ◽  
Vol 16 (1) ◽  
pp. 1-8 ◽  
Author(s):  
Israa AL-Forati ◽  
Abdulmuttalib Rashid
Keyword(s):  
Search Algorithm ◽  
Low Cost ◽  
Binary Search ◽  
Practical Implementation ◽  
Identification System ◽  
Robot Localization ◽  
Light Emitting ◽  
The Matrix ◽  
Anchor Nodes ◽  
Binary Search Algorithm

This paper proposes a low-cost Light Emitting Diodes (LED) system with a novel arrangement that allows an indoor multi-robot localization. The proposed system uses only a matrix of low-cost LED installed uniformly on the ground of an environment and low-cost Light Dependent Resistor (LDR), each equipped on bottom of the robot for detection. The matrix of LEDs which are driven by a modified binary search algorithm are used as active beacons. The robot localizes itself based on the signals it receives from a group of neighbor LEDs. The minimum bounded circle algorithm is used to draw a virtual circle from the information collected from the neighbor LEDs and the center of this circle represents the robot’s location. The propose system is practically implemented on an environment with (16*16) matrix of LEDs. The experimental results show good performance in the localization process.

Fabrication of Low Cost 1D CdSe Nanowires using Near-field Electrospinning

2011 ◽  
Vol 1302 ◽  
Author(s):  
Leroy Magwood ◽  
Binil Starly
Keyword(s):  
Quantum Dots ◽  
Fluorescence Microscopy ◽  
Fiber Diameter ◽  
Low Cost ◽  
Near Field ◽  
Light Attenuation ◽  
Dimethyl Formamide ◽  
Cdse Quantum Dot ◽  
The Matrix ◽  
Cdse Nanowires

ABSTRACTWell-aligned, 1D CdSe quantum dot (QD) fibers (0.3μm to 2.5μm) containing up to 20wt% fluorescent quantum dots (QDs) were prepared by near-field electrospinning (NFES) process. Electrospun solutions were prepared using PVAc as the matrix polymer, dimethyl formamide (DMF) solvent and colloidal QDs in chloroform (CHCl3). The diameter of the fibers decreased as the ratio of DMF/CHCl3 is varied. QDs showed good dispersion and a linear relationship between QD loading and fiber diameter, as determined by the morphology measurements taken using TEM and SEM, respectively. Fluorescence microscopy shows that there is light attenuation throughout the fibers. Results also show that the NFES process may be used as a method to create aligned, 1D fibers of QDs and potentially other nanofibers.

Physical and Fuzzy Logic Modeling of a Flip-Chip Thermocompression Bonding Process

1993 ◽  
Vol 115 (1) ◽  
pp. 63-70 ◽  
Author(s):  
Sa-Yoon Kang ◽  
H. Xie ◽  
Y. C. Lee
Keyword(s):  
Fuzzy Logic ◽  
Flip Chip ◽  
Low Cost ◽  
Distribution Patterns ◽  
Logic Model ◽  
Physical Models ◽  
High Yield ◽  
Yield Model ◽  
Physical Yield ◽  
Fuzzy Logic Model

Flip-Chip connections using gold-to-gold, gold-to-aluminum, or gold-to-solder bondings or contacts enhanced by epoxy are low-cost alternatives to soldering. To assist their technology advancements, we have developed yield models for a representative assembly process with flip-chip, thermocompression bondings. Based on bonding mechanics, a physical yield model has been developed to characterize the process. Then, a fuzzy logic model has been established to improve the modeling’s accuracy by including experimental data. The physical yield model can predict the assembly yield as a function of forces and planarities of the end effector, bump height variations, bump geometries, mechanical properties corresponding to different materials and temperatures, and distribution patterns of bumps. Consistent with our experimental experience, the calculated force level for a high-yield process was around 3000 gmf for a 30-gold-bump chip with a bump diameter of 60 μm and a height of 50 μm. The fuzzy logic model can be trained and adjusted by the results of physical models and experiments. It correlates very well to the nonlinear relationships between the yield and the assembly parameters, and has a self-learning capability to update itself with new data. Such capabilities have been demonstrated by studying the bonding on a substrate with or without a compliant layer.

Exploration Study of Multifunctional Metallic Nanocomposite Utilizing Single-Walled Carbon Nanotubes for Micro/Nano Devices

2005 ◽  
Vol 219 (2) ◽  
pp. 67-72 ◽  
Author(s):  
Quanfang Chen ◽  
Guang Chai ◽  
Bo Li
Keyword(s):  
Carbon Nanotubes ◽  
Energy Transport ◽  
Metallic Matrix ◽  
Building Blocks ◽  
Copper Matrix ◽  
Interfacial Bonding ◽  
Single Walled Carbon ◽  
The Matrix ◽  
Raman Scattering Spectra ◽  
Multifunctional Properties

Carbon nanotubes (CNTs) are excellent multifunctional materials in terms of mechanical robustness, thermal, and electrical conductivities. These multifunctional properties, as well as the small size of the structures, make CNTs ideal building blocks in developing nanocomposites. However, the matrix materials and the fabrication processes are critical in achieving the expected multifunctional properties of a CNT-reinforced nanocomposite. This paper has proved that electrochemical co-deposition of a metallic nanocomposite is a good approach for achieving good interfacial bonding between CNTs and a metallic matrix. Good interfacial bonding between a single-walled carbon nanotube (SWCNT) and a copper matrix has been verified by enhanced fracture toughness (increased stickiness) and a shift in the Raman scattering spectra. For the Cu/SWCNT nanocomposite, the radial breath mode (RBM) has disappeared and the tangential or G-band has shifted and widened, which is an indication of better energy transport.

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