scholarly journals Visualization of Thermo-Fluid Analysis on Electronic Equipment Thermal Design

2005 ◽  
Vol 25 (97) ◽  
pp. 88-93_1
Author(s):  
Yasuyuki YOKONO
Keyword(s):  
Thermal Design ◽  
Electronic Equipment ◽  
Fluid Analysis

Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design

2009 ◽  
Author(s):  
Yasuyuki Yokono ◽  
Katsumi Hisano ◽  
Kenji Hirohata
Keyword(s):  
Numerical Simulation ◽  
Product Development ◽  
Statistical Approach ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Product Development Process ◽  
Design Stage ◽  
Application Technology ◽  
Simulation Techniques ◽  
Simulation Based

In order to utilize a numerical simulation on a product development for electronic equipment, not only the simulation techniques themselves, but the application technologies of the simulation in the product design, were examined. The design process of electronic equipment was categorized into four stages, which were a concept, a function, a layout and a parameter design. Each design stage consists of a specifying that a human decide the specification for the next stage and a verification whether the specification satisfy the previous stage requirements. The specifying and the verification are conducted over and over again. Numerical simulation is corresponded to the verification and is used to accelerate this iteration instead of experiments. The examples of numerical simulation corresponding to these four verifications were shown in the present paper. There are few examples in last two type of simulation. The progress of the numerical technology for function and concept verification is expected. The product development process requires not only numerical simulation based on physics but also statistical approach.

Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer

2013 ◽  
Vol 655-657 ◽  
pp. 84-87 ◽  
Author(s):  
Bo Chen
Keyword(s):  
Thermal Analysis ◽  
Finite Element ◽  
Microwave Radiometer ◽  
Engineering Application ◽  
Element Model ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Element Analysis ◽  
Experiment Verification ◽  
Experimental Values

Thermal design, finite element analysis and experiment verification of electronic equipment of a satellite borne microwave radiometer are introduced. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results show that the temperature scopes of the main structures are from 45°C to63.9°C in the digital control equipment and 45°C to 68.7°C in the receiver equipment and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. The experimental results show that the computing values are close to experimental values and the largest error is 10.1°C, which is allowed for engineering application.

Model for predicting performance of cooling fans for thermal design of electronic equipment (Modeling and evaluation of effects from electronic enclosure and inlet sizes)

2011 ◽  
Vol 40 (4) ◽  
pp. 369-386 ◽  
Author(s):  
Takashi Fukue ◽  
Masaru Ishizuka ◽  
Shinji Nakagawa ◽  
Tomoyuki Hatakeyama ◽  
Katsuhiro Koizumi
Keyword(s):  
Thermal Design ◽  
Electronic Equipment ◽  
Predicting Performance ◽  
Cooling Fans

scholarly journals Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices

2021 ◽  
Vol 39 (2) ◽  
pp. 451-459
Author(s):  
Zhengde Wang
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Source ◽  
Electronic Devices ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Source Analysis ◽  
Power Electronic ◽  
Cooling Performance ◽  
Scheme Design

In electronic equipment, thermal failure and thermal degradation are two increasingly prominent problems of the devices, with the deepening integration and growing power density. Currently, there are relatively few reports on the heat transfer mechanism, heat source analysis, and numerical simulation of electronic equipment containing power electronic devices (PEDs). Therefore, this paper carries out thermal design and evaluates the cooling performance of PED-containing electronic equipment. Firstly, the basic flow was given for the thermal design of PED-containing electronic equipment; the heat transfer mode of PEDs and the equipment were detailed, so was the principle of thermal design; the cooling principles were introduced for ventilation cooling, heat pipe cooling, and closed loop cooling. Then, numerical simulation was carried out on the solid and liquid state heat transfer of PEDs and the equipment under different cooling modes. Based on an engineering example, the cooling scheme was finalized through heat source analysis on the proposed electronic equipment. The experimental results rove the effectiveness of numerical simulation and electronic equipment cooling scheme. The results provide a reference for the cooling scheme design for other fields of thermal design.

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