scholarly journals Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices

2021 ◽  
Vol 39 (2) ◽  
pp. 451-459
Author(s):  
Zhengde Wang
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Source ◽  
Electronic Devices ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Source Analysis ◽  
Power Electronic ◽  
Cooling Performance ◽  
Scheme Design

In electronic equipment, thermal failure and thermal degradation are two increasingly prominent problems of the devices, with the deepening integration and growing power density. Currently, there are relatively few reports on the heat transfer mechanism, heat source analysis, and numerical simulation of electronic equipment containing power electronic devices (PEDs). Therefore, this paper carries out thermal design and evaluates the cooling performance of PED-containing electronic equipment. Firstly, the basic flow was given for the thermal design of PED-containing electronic equipment; the heat transfer mode of PEDs and the equipment were detailed, so was the principle of thermal design; the cooling principles were introduced for ventilation cooling, heat pipe cooling, and closed loop cooling. Then, numerical simulation was carried out on the solid and liquid state heat transfer of PEDs and the equipment under different cooling modes. Based on an engineering example, the cooling scheme was finalized through heat source analysis on the proposed electronic equipment. The experimental results rove the effectiveness of numerical simulation and electronic equipment cooling scheme. The results provide a reference for the cooling scheme design for other fields of thermal design.

Thermal Management of Electronic Equipment: Research Needs in the Mid-1990s and Beyond

1996 ◽  
Vol 49 (10S) ◽  
pp. S167-S174 ◽  
Author(s):  
Wataru Nakayama
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Electronic Devices ◽  
Transport Processes ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Stress Fields ◽  
Hardware Development ◽  
3D Packaging ◽  
The Subject

As electronic devices and equipment are finding their ways into diverse applications, their physical integrity becomes a matter of utmost concern. The thermal design criteria customarily assumed in many of previous heat transfer research programs have to be replaced by those on the thermomechanical load in compact systems. Attempts to find thermal and stress fields in critical parts of components, however, are beset by geometrical complexities and multiple length and time scales involved in transport processes in electronic equipment. Modeling of complex systems is the subject left for further rationalization. Also needed is the foresight about possible hardware morphologies taken by electronic equipment in the future. In view of possible saturation of 2D packaging technology, heat transfer studies for 3D packaging are worth being undertaken. Common to different scenarios of hardware development is the need to critically review the methodology and focuses of fundamental heat transfer research.

scholarly journals Heat Source Analysis on Ultrasonic Welding of Plastic Structural Components Based on Numerical Simulation

2021 ◽  
Vol 39 (3) ◽  
pp. 947-954
Author(s):  
Miaomiao Zhang
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Source ◽  
Welding Process ◽  
Transient Heat Conduction ◽  
Ultrasonic Welding ◽  
Weld Strength ◽  
Source Analysis ◽  
Structural Components ◽  
Small Surface

Compared with traditional arc welding, ultrasonic welding of plastic structural components has such advantages as fast welding speed, high weld strength, small surface damages, simple equipment operation and cleanness and no pollution, thus having a good application prospect. However, the existing literatures have discussed little on the thermal stability analysis of the welding process and the influences of the parameters affecting the fixation effect of welding on the heat transfer performance of the welding process. For this reason, this paper analyzes the heat source in the ultrasonic welding of plastic structural components based on numerical simulation. First, numerical simulation was performed on the temperature field of the heat source in the ultrasonic welding of plastic structural components, the basic heat transfer forms in the welding process were elaborated in detail, the corresponding governing equations and boundary conditions were given and the governing equation of nonlinear transient heat conduction were solved by the finite element method. Then, ABAQUS thermal analysis and heat source parameter calibration were carried out on the welding heat source. In the experiment section, the heat source analysis results were given regarding the ultrasonic welding of plastic structural components.

scholarly journals Study on the Convective Heat Transfer and Fluid Flow of Mini-Channel with High Aspect Ratio of Neutron Production Target

Energies ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 4020
Author(s):  
Peng Sun ◽  
Yiping Lu ◽  
Jianfei Tong ◽  
Youlian Lu ◽  
Tianjiao Liang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Aspect Ratio ◽  
Optimization Design ◽  
Heat Dissipation ◽  
Neutron Production ◽  
Thermal Design ◽  
Maximum Deviation ◽  
Test Channel ◽  
Production Target

In order to provide a theoretical basis for the thermal design of the neutron production target, flow and heat transfer characteristics are studied by using numerical simulations and experiments. A rectangular mini-channel experimental model consistent with the geometric shape of the heat dissipation structure of neutron production target was established, in which the aspect ratio and gap thickness of the test channel were 53.8:1 and 1.3 mm, respectively. The experimental results indicate that the critical Re of the mini-channel is between 3500 and 4000, and when Re reaches 21,000, Nu can reach 160. The simulation results are in good agreement with the experimental data, and the numerical simulation method can be used for the variable structure optimization design of the target in the later stage. The relationship between the flow pressure drop of the target mini-channel and the aspect ratio and Re is obtained by numerical simulation. The maximum deviation between the correlation and the experimental value is 6%.

Experimental and Numerical Evaluation of Small-Scale Cryosurgery Using Ultrafine Cryoprobe

2013 ◽  
Vol 4 (4) ◽  
Author(s):  
Junnosuke Okajima ◽  
Atsuki Komiya ◽  
Shigenao Maruyama
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Transfer Coefficient ◽  
Temperature Distribution ◽  
Surface Temperature ◽  
Numerical Evaluation ◽  
Small Scale ◽  
Outer Diameter ◽  
Cooling Performance ◽  
The Heat Transfer Coefficient

The objective of this work is to experimentally and numerically evaluate small-scale cryosurgery using an ultrafine cryoprobe. The outer diameter (OD) of the cryoprobe was 550 μm. The cooling performance of the cryoprobe was tested with a freezing experiment using hydrogel at 37 °C. As a result of 1 min of cooling, the surface temperature of the cryoprobe reached −35 °C and the radius of the frozen region was 2 mm. To evaluate the temperature distribution, a numerical simulation was conducted. The temperature distribution in the frozen region and the heat transfer coefficient was discussed.

Turbine Split Rings Thermal Design Using Conjugate Numerical Simulation

2013 ◽  
Author(s):  
Aleksei S. Tikhonov ◽  
Andrey A. Shvyrev ◽  
Nikolay Yu. Samokhvalov
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Gas Turbine ◽  
Gas Dynamics ◽  
Thermal Condition ◽  
Fuel Efficiency ◽  
Thermal Design ◽  
Design Practice ◽  
Gas Temperature ◽  
Split Ring

One of the key factors ensuring gas turbine engines (GTE) competitiveness is improvement of life, reliability and fuel efficiency. However fuel efficiency improvement and the required increase of turbine inlet gas temperature (T*g) can result in gas turbine engine life reduction because of hot path components structural properties deterioration. Considering circumferential nonuniformity, local gas temperature T*g can reach 2500 K. Under these conditions the largest attention at designing is paid to reliable cooling of turbine vanes and blades. At present in design practice and scientific publications comparatively little attention is paid to detailed study of turbine split rings thermal condition. At the same time the experience of modern GTE operation shows high possibility of defects occurrence in turbine 1st stage split ring. This work objective is to perform conjugate numerical simulation (gas dynamics + heat transfer) of thermal condition for the turbine 1st stage split ring in a modern GTE. This research main task is to determine the split ring thermal condition by defining the conjugate gas dynamics and heat transfer result in ANSYS CFX 13.0 package. The research subject is the turbine 1st stage split ring. The split ring was simulated together with the cavity of cooling air supply from vanes through the case. Besides turbine 1st stage vanes and blades have been simulated. Patterns of total temperature (T*Max = 2000 °C) and pressure and turbulence level at vanes inlet (19.2 %) have been defined based on results of calculating the 1st stage vanes together with the combustor. The obtained results of numerical simulation are well coherent with various experimental studies (measurements of static pressure and temperature in supply cavity, metallography). Based on the obtained performance of the split ring cooling system and its thermal condition, the split ring design has been considerably modified (one supply cavity has been split into separate cavities, the number and arrangement of perforation holes have been changed etc.). All these made it possible to reduce considerably (by 40…50 °C) the split ring temperature comparing with the initial design. The design practice has been added with the methods which make it possible to define thermal condition of GTE turbine components by conjugating gas dynamics and heat transfer problems and this fact will allow to improve the designing level substantially and to consider the influence of different factors on aerodynamics and thermal state of turbine components in an integrated programming and computing suite.

Boiling/Evaporation Heat Transfer Augmentation Using Subchannels-Inserted Metal Porous Media

2013 ◽  
Author(s):  
Kazuhisa Yuki ◽  
Masahiro Uemura ◽  
Koichi Suzuki ◽  
Ken-ichi Sunamoto
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronic Devices ◽  
High Heat Flux ◽  
Transfer Performance ◽  
Power Electronic ◽  
Copper Particles ◽  
Evaporation Heat

Two-phase flow loop system using a metal porous heat sink is proposed as a cooling system of the future power electronic devices with a heat load exceeding 300W/cm2. In this paper, as the first step, the heat transfer performance of the porous heat sink is evaluated under high heat flux conditions and the applicability and some engineering issues are discussed. The porous medium, which is fabricated by sintering copper particles, has a functional structure with several sub-channels inside it to enhance phase-change as well as discharge of generated vapor outside the porous medium. This porous heat sink is attached onto a heating chip and removes the heat by evaporating cooling liquid passing through the porous medium against the heat flow. Experiments using 30 kW of heating system show that the heat transfer performance of a copper-particles-sintered porous medium with the sub-channels exceeds 800W/cm2 in both high and low subcooling cases and achieves 300W/cm2 at a wall temperature of 150 °C (Tin = 70 °C) and 130 °C (Tin = 70 °C). These results prove that this porous heat sink is applicable enough for cooling 300 W/cm2 class of power electronic devices.

scholarly journals The numerical simulation of heat transfer during a hybrid laser–MIG welding using equivalent heat source approach

2014 ◽  
Vol 56 ◽  
pp. 334-342 ◽  
Author(s):  
Issam Bendaoud ◽  
Simone Matteï ◽  
Eugen Cicala ◽  
Iryna Tomashchuk ◽  
Henri Andrzejewski ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Source ◽  
Mig Welding

Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design

2009 ◽  
Author(s):  
Yasuyuki Yokono ◽  
Katsumi Hisano ◽  
Kenji Hirohata
Keyword(s):  
Numerical Simulation ◽  
Product Development ◽  
Statistical Approach ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Product Development Process ◽  
Design Stage ◽  
Application Technology ◽  
Simulation Techniques ◽  
Simulation Based

In order to utilize a numerical simulation on a product development for electronic equipment, not only the simulation techniques themselves, but the application technologies of the simulation in the product design, were examined. The design process of electronic equipment was categorized into four stages, which were a concept, a function, a layout and a parameter design. Each design stage consists of a specifying that a human decide the specification for the next stage and a verification whether the specification satisfy the previous stage requirements. The specifying and the verification are conducted over and over again. Numerical simulation is corresponded to the verification and is used to accelerate this iteration instead of experiments. The examples of numerical simulation corresponding to these four verifications were shown in the present paper. There are few examples in last two type of simulation. The progress of the numerical technology for function and concept verification is expected. The product development process requires not only numerical simulation based on physics but also statistical approach.

Sign in / Sign up

Export Citation Format

Share Document