Model for predicting performance of cooling fans for thermal design of electronic equipment (Modeling and evaluation of effects from electronic enclosure and inlet sizes)

2011 ◽  
Vol 40 (4) ◽  
pp. 369-386 ◽  
Author(s):  
Takashi Fukue ◽  
Masaru Ishizuka ◽  
Shinji Nakagawa ◽  
Tomoyuki Hatakeyama ◽  
Katsuhiro Koizumi
Keyword(s):  
Thermal Design ◽  
Electronic Equipment ◽  
Predicting Performance ◽  
Cooling Fans

Study on P-Q Curves of Cooling Fans for Thermal Design of Electronic Equipment (Effects of Opening Position of Obstructions Near a Fan)

2011 ◽  
Author(s):  
Takashi Fukue ◽  
Masaru Ishizuka ◽  
Tomoyuki Hatakeyama ◽  
Shinji Nakagawa ◽  
Katsuhiro Koizumi
Keyword(s):  
Flow Rate ◽  
Perforated Plate ◽  
Pressure Rise ◽  
High Density ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Flow Passage ◽  
Fan Performance ◽  
Cooling Fan ◽  
Cooling Fans

This study describes an operation pressure and supplies flow rate of an axial cooling fan installed in high-density packaging electronic equipment. Fan performance is generally defined by their P-Q curve, specifically, a relationship between fan pressure rise (ΔP) and flow rate (Q). A compact cooling fan often operates in a high-density mounting device, which may decrease the fan performance. In this study, we focus on an obstruction near a fan, which is electronic components such as PCBs, capacitors and heat sinks, as one of a factor which decreases fan performance. We installed a perforated plate which simulated the above components near a fan and measured the P-Q curve. To investigate a relationship between a fan performance decrease and an opening position near the fan, a part of the perforated plate was closed. Closed position was changed and explored an opening condition which caused the dominant fan performance decrease. From experiments, it was found that the fan performance was decreased when flow passage in front of a fan was blocked by an obstruction. Especially, when flow passage in front of a fan hub was blocked, a dominantly reduction of fan pressure was caused. An obstruction rear a fan has no effect on a fan performance curve itself. In addition, opening conditions in front of a fan tip had a little influence on a fan pressure characteristic when there was no obstruction in front of a hub.

Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design

2009 ◽  
Author(s):  
Yasuyuki Yokono ◽  
Katsumi Hisano ◽  
Kenji Hirohata
Keyword(s):  
Numerical Simulation ◽  
Product Development ◽  
Statistical Approach ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Product Development Process ◽  
Design Stage ◽  
Application Technology ◽  
Simulation Techniques ◽  
Simulation Based

In order to utilize a numerical simulation on a product development for electronic equipment, not only the simulation techniques themselves, but the application technologies of the simulation in the product design, were examined. The design process of electronic equipment was categorized into four stages, which were a concept, a function, a layout and a parameter design. Each design stage consists of a specifying that a human decide the specification for the next stage and a verification whether the specification satisfy the previous stage requirements. The specifying and the verification are conducted over and over again. Numerical simulation is corresponded to the verification and is used to accelerate this iteration instead of experiments. The examples of numerical simulation corresponding to these four verifications were shown in the present paper. There are few examples in last two type of simulation. The progress of the numerical technology for function and concept verification is expected. The product development process requires not only numerical simulation based on physics but also statistical approach.

Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer

2013 ◽  
Vol 655-657 ◽  
pp. 84-87 ◽  
Author(s):  
Bo Chen
Keyword(s):  
Thermal Analysis ◽  
Finite Element ◽  
Microwave Radiometer ◽  
Engineering Application ◽  
Element Model ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Element Analysis ◽  
Experiment Verification ◽  
Experimental Values

Thermal design, finite element analysis and experiment verification of electronic equipment of a satellite borne microwave radiometer are introduced. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results show that the temperature scopes of the main structures are from 45°C to63.9°C in the digital control equipment and 45°C to 68.7°C in the receiver equipment and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. The experimental results show that the computing values are close to experimental values and the largest error is 10.1°C, which is allowed for engineering application.

Sign in / Sign up

Export Citation Format

Share Document