scholarly journals A review on the effect of surface finish and cooling rate on solder joint reliability

2016 ◽  
Author(s):  
K. Hardinnawirda ◽  
A. M. Zetty Akhtar ◽  
I. Siti Rabiatull Aisha ◽  
I. Mahadzhir
Keyword(s):  
Solder Joint ◽  
Cooling Rate ◽  
Surface Finish ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Effect Of Surface

Solder-Joint Reliability of a Radar Processor for Semi-Autonomous Driving Applications

2018 ◽  
Vol 2018 (1) ◽  
pp. 000104-000109
Author(s):  
Mollie Benson ◽  
Burton Carpenter ◽  
Andrew Mawer
Keyword(s):  
Solder Joint ◽  
Thermal Shock ◽  
Surface Finish ◽  
Solder Ball ◽  
Digital Signal ◽  
Autonomous Driving ◽  
Solder Joint Reliability ◽  
Automotive Safety ◽  
Safety Integrity Level ◽  
Joint Reliability

Abstract Radar is currently employed in automotive applications to provide the range, angle, and velocity of objects using RF waves (77GHz). This paper outlines solder joint reliability of a specific micro-processor that processes data received from a SRR (short range radar operating from 0.2 to 30 meters). It is a powerful digital signal processing accelerator, which targets safety applications that require a high Automotive Safety Integrity Level (ASIL-B). The paper explores the package design and construction, SMT (surface mount technology) assembly, and board level reliability testing of various BGA pad surface finish and solder ball alloy materials on a 0.65 mm pitch, 10 × 10 mm body 141 MAPBGA (mold array process-ball grid array) package. The package configurations include two BGA pad surface finishes (Ni/Au and OSP [organic solderability protectant]) and three solder alloys (SnAg, SAC405, and SAC-Bi [a Bi containing SAC derivative]). Solder joint reliability analysis was performed through AATS (air-to-air thermal shock) between 40°C and +125°C and JEDEC Drop Testing at 1500G's. Thermal shock was extended until at least 75% of the populations failed, which was well past the points needed to qualify the packages for the intended end-use applications. The evaluations of the micro-processor indicate that the MAPBGA package can meet the ASIL-B specification requirements with optimized combinations of BGA pad surface finish and solder alloy. The focus of this paper was to determine the baseline solder-joint thermal shock and JEDEC drop performance with varied BGA pad surface finish and solder ball alloy materials.

ENEP – A Cost-Effective Alternative for High Reliability Soldering Applications

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 002190-002224
Author(s):  
Gustavo Ramos ◽  
Mustafa Oezkoek ◽  
Sven Lamprecht ◽  
Hugh Roberts
Keyword(s):  
Solder Joint ◽  
Surface Finish ◽  
High Reliability ◽  
Electroless Nickel ◽  
High Price ◽  
Nickel Layer ◽  
Nickel Surface ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Pure Palladium

Electroless nickel / immersion gold (ENIG) has been recognized within the electronics packaging industry as a reliable surface finish for soldering applications. Unlike surface finishes, such as OSP, immersion silver or immersion tin, which produce a Cu-Sn intermetallic upon soldering, the nickel layer of ENIG acts as a barrier to minimize copper dissolution during the soldering application. This function is especially important for assemblies that require multiple reflow steps. However, if not properly controlled, excessive corrosion of the nickel by the immersion gold step can also cause the well documented “black pad” effect, often resulting in solder joint reliability issues, including brittle fracture. As an alternative to ENIG, an electroless pure palladium layer over the electroless nickel (ENEP) provides a solderable surface without the noted risk of damage to the underling nickel layer. By eliminating the corrosive attack of the gold bath, the final layer stack would be suitable for high reliability soldering involving both IC substrate and PWB applications. In addition, because of the current high price of gold, replacing it with a pure palladium deposit can offer measureable cost savings for the ENEP process in comparison to ENIG. The paper summarizes an in-depth study of the effect on solder joint reliability caused by replacing the immersion gold by an electroless pure palladium layer. The study includes evaluations for both Pb-free (Sn-3.0Ag-0.5Cu) and eutectic SnPb (63Sn-37Pb) soldering applications. Results of investigations include: (1) cold ball pull testing to evaluate solder joint integrity, (2) SEM examinations of the underlying nickel surface, (3) IMC examinations to quantify nickel thickness degradation after multiple solder reflow cycles and (4) surface wetting through solder spread examinations. The paper discusses the relatively simple surface finish that, if proven effective in large-scale fabrication, may offer measureable performance and cost benefits in comparison to the more traditional ENIG finish.

Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 001328-001360
Author(s):  
Mustafa Oezkoek ◽  
Gustavo RamosArnd ◽  
KilianJens Wegricht
Keyword(s):  
Solder Joint ◽  
Surface Finish ◽  
Copper Wire ◽  
Wire Bonding ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Gold Silver ◽  
Copper Wire Bonding ◽  
Packaging Industry ◽  
New Challenges

New challenges in the industry, new technical requirements, as well as cost and environmental regulations, require a constant search for alternative manufacturing solutions for the electronic packaging industry. Finer lines and spaces, higher frequencies, improved solder joint reliability and new challenges in wire bonding – both with existing wire technology such as Al and Au or novel types such as Cu or Cu-Pd – are just a few examples of technological advancements for surface finishes in the packaging industry. Additionally, the reduction and elimination of toxic and hazardous materials, as well as the drive to further reduce the manufacturing costs, are important requirements which has to be addressed. The new direct pure EP/EPAG surface finish is suggested as a solution to these challenges for the future. The direct EP/EPAG process allows the direct deposition of palladium on copper, without using any nickel. It is suitable for high frequency, for flexible applications, for gold, aluminum, gold, silver and copper wire bonding applications. The process proves superior solder joint strength for lead free and eutectic soldering and is compatible with many new base materials and soldermask types owing to its short deposit time and low temperature needs. Finally, the EP/EPAG process operates at a thickness of less than 300 nm, ideal for very fine lines and spaces. The EP/EPAG finish also features several environmental benefits, such as less water and energy consumption owing to reduced process steps and line lengths. The suggested paper will provide new wire bond data with silver, gold and copper wire bonding results. A technical comparison to a thin ENEPIG finish will be provided to show the differences in terms of soldering and solder joint reliability.

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Experimental Evaluation ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability
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