scholarly journals Influence of ICP Etching Damage on the Brittle-Fracture Strength of Single-Crystal Silicon

2007 ◽  
Vol 56 (10) ◽  
pp. 920-925 ◽  
Author(s):  
Satoshi IZUMI ◽  
Yusuke KUBODERA ◽  
Shinsuke SAKAI ◽  
Hiroshi MIYAJIMA ◽  
Kenji MURAKAMI ◽  
...  
Keyword(s):  
Brittle Fracture ◽  
Single Crystal ◽  
Fracture Strength ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Icp Etching

Fracture Behavior of Silicon Cut with a High Power Laser

1991 ◽  
Vol 226 ◽  
Author(s):  
C.C. Chao ◽  
R. Chleboski ◽  
E.J. Henderson ◽  
C.K. Holmes ◽  
J.P. Kalejs ◽  
...  
Keyword(s):  
Single Crystal ◽  
Fracture Strength ◽  
High Power ◽  
Single Crystal Silicon ◽  
Strength Distribution ◽  
Power Laser ◽  
Crystal Silicon ◽  
Element Analysis ◽  
Cut Edge ◽  
Basic Hypothesis

AbstractThe fracture twist test is used to obtain the statistical fracture strength distribution for 10-cm square single crystal and polycrystalline silicon wafers cut with a high-power Nd:YAG laser. Tensile wafer edge stresses at fracture are calculated using nonlinear finite element analysis, and the model results are used to examine the limitations of linear torsion and plate theories. The basic hypothesis is that fracture strength of laser-cut wafers is limited by microcracks formed by large residual tensile stresses produced in the cut edge upon cooling after cutting. Differences are found between single crystal CZ and polycrystalline EFG silicon material Weibull parameters characterizing the fracture strength distribution. These indicate that there is a statistical influence of material variables on the fracture strength of the EFG silicon, which lowers its strength and increases the variance of fracture response in comparison to single crystal silicon.

Etching Process Effects on Surface Structure, Fracture Strength, and Reliability of Single-Crystal Silicon Theta-Like Specimens

2013 ◽  
Vol 22 (3) ◽  
pp. 589-602 ◽  
Author(s):  
Michael S. Gaither ◽  
Richard S. Gates ◽  
Rebecca Kirkpatrick ◽  
Robert F. Cook ◽  
Frank W. DelRio
Keyword(s):  
Single Crystal ◽  
Surface Structure ◽  
Fracture Strength ◽  
Single Crystal Silicon ◽  
Etching Process ◽  
Crystal Silicon ◽  
Process Effects

scholarly journals Anisotropy of Fracture Strength and Fracture Toughness of Micro-Sized Single-Crystal Silicon

2005 ◽  
Vol 125 (7) ◽  
pp. 307-312 ◽  
Author(s):  
Taeko Ando ◽  
Xueping Li ◽  
Shigeki Nakao ◽  
Takashi Kasai ◽  
Mitsuhiro Shikida ◽  
...  
Keyword(s):  
Fracture Toughness ◽  
Single Crystal ◽  
Fracture Strength ◽  
Single Crystal Silicon ◽  
Crystal Silicon

Influence of Specimen Size and Sub-Micron Notch on The Fracture Behavior of Single Crystal Silicon Microelements and Nanoscopic Afm Damage Evaluation

1998 ◽  
Vol 546 ◽  
Author(s):  
Kohji Minoshima ◽  
Shigemichi Inoue ◽  
Tomota Terada ◽  
Kenjiro Komai
Keyword(s):  
Single Crystal ◽  
Fracture Strength ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Single Crystal Silicon ◽  
Fatigue Loading ◽  
Sample Surface ◽  
Specimen Size ◽  
Fracture Mechanisms ◽  
Crystal Silicon

AbstractSimple bending tests of single-crystal silicon microelements fabricated by photoetching were performed. Silicon microelements deform elastically until final catastrophic failure, showing a brittle nature. The fracture strength increases with a decrease in specimen size, and the maximum strength reaches about 8 GPa. A Focused ion beam was used to machine a sub-µm deep notch. Such a small notch decreases the fracture strength of a microelement. Some fatigue tests were conducted in laboratory air and in distilled water: water reduces the strength of microelement under fatigue loading. Fracture surface and sample surface were closely examined with a scanning electron microscope and an atomic force microscope, and the fracture mechanisms are discussed from the nanoscopic points of view.

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