Fabrication of bilayer resin-bonded fixed abrasive wires using the pultrusion process

The fabrication of resin-bonded abrasive composite materials with constant cross-section was achieved by wire pultrusion wherein a piano wire of diameter 120 μm used as a core was pulled through a surface pretreatment, resin bath and into a die orifice and oven, where the impregnated resin slurry was cured at a moderate temperature. The bilayer resin-bonded fixed diamond wire with a diameter of about 191–205 μm with an inner layer of phenolic-modified epoxy resin and an outer layer of phenolic resin through the pultrusion method was presented. The results showed that when liquid resin slurry with higher diamond concentration during the pultrusion process was used, a larger wire diameter, less diamond spacing and higher diamond protrusion were obtained.

Study on Manufacturing Technology of Resin Bonded Diamond Wire Saw

Slicing of silicon, quartz crystal and other hard brittle materials mainly use dissociated abrasive multi-wire saw slicing technology, which exists some shortcomings, such as severe environmental pollution, lower cutting efficiency, etc. So it is bound to be replaced by fixed abrasive diamond wire saw in the future. At present, generally, the manufacturing technology of fixed diamond wire saw includes electroplating method and resin bonded method. Compared with electroplating diamond wire saw, the resin bonded diamond wire saw has obvious advantages, such as simpler production technique, lower cost, higher cutting efficiency, less environmental pollution, etc. In this paper, the polyurethane was chosen as matrix resin of resin bonded, and phenolic resin was chosen as curing agent, the preparation technology of thermosetting resin bonded diamond wire saw, is researched in this paper. Firstly, the effects of various compositions on resin bonded, are researched, then the optimal fomula and the manufacturing technology are determined

Abrasive Distribution of the Fixed Diamond Wire in Wire Sawing Process

Fixed diamond wire saw has the advantages such as higher cutting rate and clearer operating environment over the slurry wire saw in wafering. However, the higher cost and poor sliced wafer surface are still the obstacles for the diamond wire saw to totally replace slurry wire saw. In this study, the distribution of diamond grits on the wire was investigated by numerical simulation. The results show that there is a critical value of the abrasive interval to transfer the machining mechanism from plastic plowing to brittle indentation cracking for the material removal. The value depends on both the wire tension and bow angle during the operation.