A direct comparison of diode laser soldering of lead-tin and lead-free solders

2001 ◽  
Author(s):  
A. P. Hoult ◽  
R. S. Ong ◽  
A. P. Malshe ◽  
A. R. Dhamdhere
Keyword(s):  
Diode Laser ◽  
Lead Free ◽  
Laser Soldering ◽  
Lead Free Solders

Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

2008 ◽  
Vol 18 (4) ◽  
pp. 814-818 ◽  
Author(s):  
Zong-jie HAN ◽  
Song-bai XUE ◽  
Jian-xin WANG ◽  
Xin ZHANG ◽  
Liang ZHANG ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Diode Laser ◽  
Lead Free ◽  
Soldering Technology ◽  
Laser Soldering ◽  
Lead Free Solders

Development of high speed laser soldering process for lead-free solder with diode-laser

2003 ◽  
Author(s):  
Jing-bo Wang ◽  
Mamoru Watanabe ◽  
Yasuhiro Goto ◽  
Kouji Fujii ◽  
Hiroyuki Kuriaki ◽  
...  
Keyword(s):  
Diode Laser ◽  
High Speed ◽  
Lead Free ◽  
Lead Free Solder ◽  
Soldering Process ◽  
Laser Soldering ◽  
Free Solder

Diode laser soldering using a lead-free filler material for electronic packaging structures

2006 ◽  
Vol 252 (13) ◽  
pp. 4406-4410 ◽  
Author(s):  
C. Chaminade ◽  
E. Fogarassy ◽  
D. Boisselier
Keyword(s):  
Diode Laser ◽  
Electronic Packaging ◽  
Lead Free ◽  
Filler Material ◽  
Laser Soldering

scholarly journals Laser Soldering of Surface Mount Devices with Lead-free Solder : Comparison between YAG laser and Diode laser

2002 ◽  
Vol 2002.77 (0) ◽  
pp. _3-3_-_3-4_
Author(s):  
Hiroki KAWAKAMI ◽  
Takeyoshi FUJITA ◽  
Sumio NAKAHARA ◽  
Shigeyoshi HISADA
Keyword(s):  
Diode Laser ◽  
Lead Free ◽  
Lead Free Solder ◽  
Yag Laser ◽  
Surface Mount ◽  
Laser Soldering ◽  
Free Solder

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

2009 ◽  
Vol 131 (2) ◽  
Author(s):  
Zongjie Han ◽  
Songbai Xue ◽  
Jianxin Wang ◽  
Xin Zhang ◽  
Shenglin Yu ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Lead Free ◽  
Reflow Soldering ◽  
Optimal Power ◽  
Fine Pitch ◽  
Quad Flat Package ◽  
Continuous Scanning ◽  
Laser Soldering ◽  
Lead Free Solders ◽  
Better Than

In this paper, soldering experiments of fine pitch quad flat package (QFP) devices were carried out when soldered with Sn–Ag–Cu and Sn–Cu–Ni lead-free solders by means of diode laser soldering system, and compared with the experimental results soldered with Sn–Pb solders and with infrared (IR) reflow soldering method. The results indicate that under the conditions of laser continuous scanning mode and the fixed laser soldering time, an optimal power is obtained when the optimal mechanical properties of QFP microjoints are achieved. Mechanical properties of QFP microjoints soldered with laser soldering system are better than that of QFP microjoints soldered with IR soldering method. Results also indicate that adding rare earth element Ce to Sn–Ag–Cu and Sn–Cu–Ni lead-free solders improves mechanical properties of QFP microjoints, and the optimal amount of Ce is about 0.03%.

Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering

2011 ◽  
Vol 23 (3) ◽  
pp. 177-183 ◽  
Author(s):  
Peng Xue ◽  
Song‐bai Xue ◽  
Liang Zhang ◽  
Yi‐fu Shen ◽  
Li‐li Gao ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Diode Laser ◽  
Lead Free ◽  
Fine Pitch ◽  
Laser Soldering

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

scholarly journals Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9zn Lead-Free Solders Al-Loy

Materials ◽  
2021 ◽  
Vol 14 (10) ◽  
pp. 2549
Author(s):  
Wenchao Yang ◽  
Jun Mao ◽  
Yueyuan Ma ◽  
Shuyuan Yu ◽  
Hongping He ◽  
...  
Keyword(s):  
Corrosion Resistance ◽  
Microstructure Evolution ◽  
Electrochemical Corrosion ◽  
Lead Free ◽  
Nacl Solution ◽  
Rich Phase ◽  
Yttrium Addition ◽  
Electrochemical Corrosion Behavior ◽  
Lead Free Solders ◽  
Addition Amount

Electrochemical corrosion behavior of ternary tin-zinc-yttrium (Sn-9Zn-xY) solder alloys were investigated in aerated 3.5 wt.% NaCl solution using potentiodynamic polarization techniques, and the microstructure evolution was obtained by scanning electron microscope (SEM). Eight different compositions of Sn-9Zn-xY (x = 0, 0.02, 0.04, 0.06, 0.08, 0.10, 0.20, and 0.30 wt.%) were compared by melting. The experimental results show that when the content of Y reached 0.06 wt.%, the grain size of Zn-rich phase became the smallest and the effect of grain refinement was the best, but there was no significant effect on the melting point. With the increases of Y content, the spreading ratio first increased and then decreased. When the content of Y was 0.06 wt.%, the Sn-9Zn-0.06Y solder alloy had the best wettability on the Cu substrate, which was increased by approximately 20% compared with Sn-9Zn. Besides, the electrochemical corrosion experimental shows that the Y can improve the corrosion resistance of Sn-9Zn system in 3.5 wt.% NaCl solution, and the corrosion resistance of the alloy is better when the amount of Y added is larger within 0.02–0.30 wt.%. Overall considering all performances, the optimal performance can be obtained when the addition amount of Y is 0.06.

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