Diode laser soldering using a lead-free filler material for electronic packaging structures

2006 ◽  
Vol 252 (13) ◽  
pp. 4406-4410 ◽  
Author(s):  
C. Chaminade ◽  
E. Fogarassy ◽  
D. Boisselier
Keyword(s):  
Diode Laser ◽  
Electronic Packaging ◽  
Lead Free ◽  
Filler Material ◽  
Laser Soldering

Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

2008 ◽  
Vol 18 (4) ◽  
pp. 814-818 ◽  
Author(s):  
Zong-jie HAN ◽  
Song-bai XUE ◽  
Jian-xin WANG ◽  
Xin ZHANG ◽  
Liang ZHANG ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Diode Laser ◽  
Lead Free ◽  
Soldering Technology ◽  
Laser Soldering ◽  
Lead Free Solders

Development of high speed laser soldering process for lead-free solder with diode-laser

2003 ◽  
Author(s):  
Jing-bo Wang ◽  
Mamoru Watanabe ◽  
Yasuhiro Goto ◽  
Kouji Fujii ◽  
Hiroyuki Kuriaki ◽  
...  
Keyword(s):  
Diode Laser ◽  
High Speed ◽  
Lead Free ◽  
Lead Free Solder ◽  
Soldering Process ◽  
Laser Soldering ◽  
Free Solder

scholarly journals Laser Soldering of Surface Mount Devices with Lead-free Solder : Comparison between YAG laser and Diode laser

2002 ◽  
Vol 2002.77 (0) ◽  
pp. _3-3_-_3-4_
Author(s):  
Hiroki KAWAKAMI ◽  
Takeyoshi FUJITA ◽  
Sumio NAKAHARA ◽  
Shigeyoshi HISADA
Keyword(s):  
Diode Laser ◽  
Lead Free ◽  
Lead Free Solder ◽  
Yag Laser ◽  
Surface Mount ◽  
Laser Soldering ◽  
Free Solder

Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering

2011 ◽  
Vol 23 (3) ◽  
pp. 177-183 ◽  
Author(s):  
Peng Xue ◽  
Song‐bai Xue ◽  
Liang Zhang ◽  
Yi‐fu Shen ◽  
Li‐li Gao ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Diode Laser ◽  
Lead Free ◽  
Fine Pitch ◽  
Laser Soldering

“Turning ceramic on its head” – a polymer based packaging system for operation over 175°C

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000111-000115
Author(s):  
Piers R. Tremlett
Keyword(s):  
High Temperature ◽  
Electronic Packaging ◽  
Lead Free ◽  
Harsh Environment ◽  
Sensor Systems ◽  
Packaging System

A polymer based electronic packaging system has been developed that is capable of operating at temperatures over 175°C and up to 225°C. This system is being developed to be a lead free, non-hermetic and able to deliver miniature or functionally dense circuits. It will be suitable for sensor systems where amplification, signal digitisation and autonomy are important whilst operating in a harsh environment such as high temperature.

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

2018 ◽  
Vol 140 (4) ◽  
Author(s):  
Hamoon Azizsoltani ◽  
Achintya Haldar
Keyword(s):  
Response Surface ◽  
Electronic Packaging ◽  
Limit State ◽  
Experimental Studies ◽  
Lead Free ◽  
Evaluation Procedure ◽  
Design Parameters ◽  
State Function ◽  
Thermomechanical Loading ◽  
Lead Free Solders

A novel reliability evaluation procedure of lead-free solders used in electronic packaging (EP) subjected to thermomechanical loading is proposed. A solder ball is represented by finite elements (FEs). Major sources of nonlinearities are incorporated as realistically as practicable. Uncertainties in all design variables are quantified using available information. The thermomechanical loading is represented by five design parameters and uncertainties associated with them are incorporated. Since the performance or limit state function (LSF) of such complicated problem is implicit in nature, it is approximately generated explicitly in the failure region with the help of a completely improved response surface method (RSM)-based approach and the universal Kriging method (KM). The response surface (RS) is generated by conducting as few deterministic nonlinear finite element analyses as possible by integrating several advanced factorial mathematical concepts producing compounding beneficial effect. The accuracy, efficiency, and application potential of the procedure are established with the help of Monte Carlo simulation (MCS) and the results from laboratory investigation reported in the literature. The study conclusively verified the proposed method. Similar studies can be conducted to fill the knowledge gap for cases where the available analytical and experimental studies are limited or extend the information to cases where reliability information is unavailable. The study showcased how reliability information can be extracted with the help of multiple deterministic analyses. The authors believe that they proposed an alternative to the classical MCS technique.

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