scholarly journals Effect of Corrosion on Mechanical Reliability of Sn-Ag Flip-Chip Solder Joint

2016 ◽  
Vol 57 (11) ◽  
pp. 1966-1971
Author(s):  
Sang Su Ha ◽  
Hanbyul Kang ◽  
Gun Rae Kim ◽  
Sangwoo Pae ◽  
Haebum Lee
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Mechanical Reliability

scholarly journals Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints

Materials ◽  
2019 ◽  
Vol 13 (1) ◽  
pp. 94 ◽  
Author(s):  
Jiajie Fan ◽  
Jie Wu ◽  
Changzhen Jiang ◽  
Hao Zhang ◽  
Mesfin Ibrahim ◽  
...  
Keyword(s):  
Solder Joint ◽  
Thermal Shock ◽  
Flip Chip ◽  
Heat Dissipation ◽  
Solder Joints ◽  
Light Emitting Diode ◽  
Shock Load ◽  
Thermal Shock Test ◽  
Mechanical Reliability ◽  
Light Emitting

To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the generation of voids always challenges the mechanical strength, thermal stability, and reliability of solder joints. This paper models the 3D random voids generation in the LED flip chip Sn96.5–Ag3.0–Cu0.5 (SAC305) solder joint, and investigates the effect of thermal shock load on its mechanical reliability with both simulations and experiments referring to the JEDEC thermal shock test standard (JESD22-A106B). The results reveal the following: (1) the void rate of the solder joint increases after thermal shock ageing, and its shear strength exponentially degrades; (2) the first principal stress of the solder joint is not obviously increased, however, if the through-hole voids emerged in the corner of solder joints, it will dramatically increase; (3) modelling of the fatigue failure of solder joint with randomly distributed voids utilizes the approximate model to estimate the lifetime, and the experimental results confirm that the absolute prediction error can be controlled around 2.84%.

Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package

2010 ◽  
Vol 48 (11) ◽  
pp. 1035-1040 ◽  
Author(s):  
Young-Chul Lee ◽  
Kwang-Seok Kim ◽  
Ji-Hyuk Ahn ◽  
Jeong-Won Yoon ◽  
Min-Kwan Ko ◽  
...  
Keyword(s):  
Solder Joint ◽  
Mechanical Reliability

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Experimental Evaluation ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability

Evaluation of solder joint reliability in flip chip package under thermal shock test

2006 ◽  
Vol 504 (1-2) ◽  
pp. 426-430 ◽  
Author(s):  
Dae-Gon Kim ◽  
Jong-Woong Kim ◽  
Seung-Boo Jung
Keyword(s):  
Solder Joint ◽  
Thermal Shock ◽  
Flip Chip ◽  
Thermal Shock Test ◽  
Solder Joint Reliability ◽  
Shock Test ◽  
Joint Reliability

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

2018 ◽  
Vol 140 (3) ◽  
Author(s):  
Ye Tian ◽  
Ning Ren ◽  
Xiaoxia Jian ◽  
Tie Geng ◽  
Yiping Wu
Keyword(s):  
Site Effects ◽  
Flip Chip ◽  
Fe Simulation ◽  
Great Influence ◽  
Underlying Mechanism ◽  
Edge Region ◽  
Mechanical Reliability ◽  
Reaction Products ◽  
Interfacial Imcs ◽  
Center Region

This study mainly focuses on site effects of the Ni pad interface on intermetallic compounds (IMCs) characteristic during assembly reflowing, and attempts to provide a reasonable explanation for this particular finding. Besides, the changes of the resulting IMCs characteristic are characterized during thermal shock (TS) cycling, and their potential influences on thermal–mechanical reliability of microjoints are evaluated experimentally and numerically. The results show that the site on the Ni pad interface of silicon chip has great influence on interfacial reaction products, i.e., interfacial IMCs. After bumps soldering, a great amount of larger diamond-shaped (Cu, Ni)6Sn5 compounds were densely packed at the edge region, while some smaller ones were only scattered at the center region. Moreover, substantial particle-shaped (Ni, Cu)3Sn4 compounds as well as some rod-shaped ones emerged at the spaces between the (Cu, Ni)6Sn5 compounds of the center region. More importantly, such site effects were remained in the microjoints during TS cycling, which induced the formation of larger protruding (Cu, Ni)6Sn5 compounds. Finite element (FE) simulation results showed that the stress was mainly concentrated at the top of the protruding (Cu, Ni)6Sn5 compounds, which can be a critical reason to cause the crack occurrence. Furthermore, the underlying mechanism of the interfacial IMCs characteristic induced by the site effects was attempted to propose during bumps soldering.

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