Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE Comput. Soc. Press

0818635401

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Developing a merchant MCM infrastructure

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 ◽

10.1109/mcmc.1993.302154 ◽

2002 ◽

Cited By ~ 1

Author(s):

N.J. Naclerio

Download Full-text

Lumped approximation of the characteristic impedance of the RLGC transmission line with error analysis

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 ◽

10.1109/mcmc.1993.302141 ◽

2002 ◽

Cited By ~ 6

Author(s):

O. Wing ◽

H. Liu

Keyword(s):

Error Analysis ◽

Transmission Line ◽

Characteristic Impedance

Download Full-text

Automatic a-priori generation of delay and noise macromodels and wiring rules for MCMs

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 ◽

10.1109/mcmc.1993.302129 ◽

2002 ◽

Cited By ~ 2

Author(s):

P. Franzon ◽

S. Simovich ◽

S. Mehrotra ◽

M. Steer

Keyword(s):

A Priori

Download Full-text

Balancing performance and cost in CMOS-based thin film multichip modules

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 ◽

10.1109/mcmc.1993.302160 ◽

2002 ◽

Cited By ~ 9

Author(s):

R.C. Frye

Keyword(s):

Thin Film ◽

Multichip Modules

Download Full-text

Test vehicle for MCM-D interconnect process development

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 ◽

10.1109/mcmc.1993.302143 ◽

2002 ◽

Cited By ~ 2

Author(s):

S. Westbrook

Keyword(s):

Process Development ◽

Test Vehicle

Download Full-text

A distributed-RCL model for MCM layout

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 ◽

10.1109/mcmc.1993.302128 ◽

2002 ◽

Cited By ~ 8

Author(s):

D. Zhou ◽

F. Tsui ◽

J.S. Cong ◽

D.S. Gao

Download Full-text

Electron-beam MCM substrate tester

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 ◽

10.1109/mcmc.1993.302150 ◽

2002 ◽

Cited By ~ 3

Author(s):

M. Brunner ◽

R. Schmid

Keyword(s):

Electron Beam

Download Full-text

The pretreatment of aluminum bondpads for electroless nickel bumping

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 ◽

10.1109/mcmc.1993.302148 ◽

2002 ◽

Cited By ~ 27

Author(s):

A. Ostmann ◽

J. Simon ◽

H. Reichl

Keyword(s):

Electroless Nickel

Download Full-text

SuperSPARC multichip module

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 ◽

10.1109/mcmc.1993.302158 ◽

2002 ◽

Cited By ~ 3

Author(s):

A. Mehta ◽

J. Kennedy ◽

K. Johnson ◽

F. Cano ◽

D. Anderson ◽

...

Keyword(s):

Multichip Module

Download Full-text

Cost-driven layout for thin-film MCMs

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 ◽

10.1109/mcmc.1993.302131 ◽

2002 ◽

Cited By ~ 1

Author(s):

W.W.-M. Dai ◽

D. Staepelaere ◽

J. Jue ◽

T. Dayan

Keyword(s):

Thin Film

Download Full-text

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE Comput. Soc. Press

Developing a merchant MCM infrastructure

Lumped approximation of the characteristic impedance of the RLGC transmission line with error analysis

Automatic a-priori generation of delay and noise macromodels and wiring rules for MCMs

Balancing performance and cost in CMOS-based thin film multichip modules

Test vehicle for MCM-D interconnect process development

A distributed-RCL model for MCM layout

Electron-beam MCM substrate tester

The pretreatment of aluminum bondpads for electroless nickel bumping

SuperSPARC multichip module

Cost-driven layout for thin-film MCMs

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93
Latest Publications