scholarly journals Electrochemical characterization of the Au-In-Sb system

2009 ◽  
Vol 63 (4) ◽  
pp. 289-292 ◽  
Author(s):  
Lidija Gomidzelovic ◽  
Zvonimir Stankovic ◽  
Zoran Stevic ◽  
Dragana Zivkovic
Keyword(s):  
Phase Diagram ◽  
Cyclic Voltammetry ◽  
Physical Characteristics ◽  
Electrochemical Characterization ◽  
Lead Free ◽  
Electrochemical Characteristics ◽  
Lead Free Solder ◽  
Free Solder ◽  
The Moment

The Au-In-Sb system belongs to the group of potential candidates for new lead-free solder materials. Therefore, a lot of investigations concerning its phase diagram and thermodynamic, mechanical, physical characteristics are going on at the moment. Having in mind the significance of such materials application in electronics, it is also very important to study their electrochemical characteristics. In order to give such a characterization, the results of cyclic voltammetry measurements for some alloys in the Au-In-Sb system are presented in this paper.

Phase Diagram of Sn-In-Zn System and its Use for Lead-free Solder

1998 ◽  
Vol 14 (12) ◽  
pp. 1098-1103 ◽  
Author(s):  
Zheng Yu-Jun ◽  
◽  
Zhang Qi-Yun
Keyword(s):  
Phase Diagram ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Process characterization of PCB assembly using 0201 packages with lead‐free solder

2003 ◽  
Vol 15 (2) ◽  
pp. 22-27 ◽  
Author(s):  
David Geiger ◽  
Fredrik Mattsson ◽  
Dongkai Shangguan ◽  
MT Ong ◽  
Patrick Wong ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Pcb Assembly ◽  
Process Characterization ◽  
Free Solder

Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

2019 ◽  
Author(s):  
Yuvraj Singh ◽  
Anirudh Udupa ◽  
Srinivasan Chandrasekar ◽  
Ganesh Subbarayan
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Metal Cutting ◽  
High Strain ◽  
Lead Free ◽  
Strain Rates ◽  
Lead Free Solder ◽  
Orthogonal Metal Cutting ◽  
Free Solder

Abstract Studies on medium to high strain-rate characterization (≥ 0.1s−1) of lead-free solder are relatively few, primarily due to the lack of available methods for testing. Prior work in literature uses Split Hopkinson Bar (SPHB) experiments for high strain-rate characterization (≥ 300s−1) [1,2], while a modified micro-scale tester is used for medium strain-rate characterization (0.005s−1 to 300s−1) [3] and an impact hammer test setup for testing in a strain-rate regime from 1s−1 to 100s−1 [4]. However, there is still limited data in strain-rate regimes of relevance, specifically for drop shock applications. In this paper, we present orthogonal metal cutting as a novel method to characterize lead-free solder alloys. Experiments are carried out using a wedgelike tool that cuts through a work piece at a fixed depth and rake angle while maintaining a constant cutting velocity. These experiments are conducted at room temperature on Sn1.0Ag0.5Cu bulk test specimens with strain-rates varying from 0.32 to 48s−1. The range of strain-rates is only limited by the ball screw driven slide allowing higher strain-rates if needed. The strains and strain-rates are captured through Particle Image Velocimetry (PIV) using sequential images taken from a high-speed camera just ahead of the cutting tool. The PIV enables non-contact recording of high strain-rate deformations, while the dynamometer on the cutting head allows one to capture the forces exerted during the cutting process. Results for the stress-strain response obtained through the experiments are compared to prior work for validation. Orthogonal metal cutting is shown to be a potentially attractive method for characterization of solder at higher strain-rates.

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